KR20100016224A - 비평면형 표면 상에 재료를 증착시키는 방법 - Google Patents
비평면형 표면 상에 재료를 증착시키는 방법 Download PDFInfo
- Publication number
- KR20100016224A KR20100016224A KR1020097023068A KR20097023068A KR20100016224A KR 20100016224 A KR20100016224 A KR 20100016224A KR 1020097023068 A KR1020097023068 A KR 1020097023068A KR 20097023068 A KR20097023068 A KR 20097023068A KR 20100016224 A KR20100016224 A KR 20100016224A
- Authority
- KR
- South Korea
- Prior art keywords
- substrates
- semiconductor processing
- planar
- processing chamber
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B9/00—Cells or assemblies of cells; Constructional parts of cells; Assemblies of constructional parts, e.g. electrode-diaphragm assemblies; Process-related cell features
- C25B9/13—Single electrolytic cells with circulation of an electrolyte
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3311—Horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/22—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using physical deposition, e.g. vacuum deposition or sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3436—Deposited materials, e.g. layers characterised by the chemical composition being chalcogenide semiconductor materials not being oxides, e.g. ternary compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US92229007P | 2007-04-05 | 2007-04-05 | |
| US60/922,290 | 2007-04-05 | ||
| US11/801,469 | 2007-05-09 | ||
| US11/801,469 US7563725B2 (en) | 2007-04-05 | 2007-05-09 | Method of depositing materials on a non-planar surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20100016224A true KR20100016224A (ko) | 2010-02-12 |
Family
ID=39827323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097023068A Ceased KR20100016224A (ko) | 2007-04-05 | 2008-03-24 | 비평면형 표면 상에 재료를 증착시키는 방법 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US7563725B2 (https=) |
| EP (1) | EP2137761A4 (https=) |
| JP (1) | JP5415401B2 (https=) |
| KR (1) | KR20100016224A (https=) |
| CN (1) | CN101681844B (https=) |
| MY (1) | MY149238A (https=) |
| SG (1) | SG163597A1 (https=) |
| WO (1) | WO2008123930A1 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090011573A1 (en) * | 2007-07-02 | 2009-01-08 | Solyndra, Inc. | Carrier used for deposition of materials on a non-planar surface |
| US20090084219A1 (en) * | 2007-09-10 | 2009-04-02 | Ross-Hime Designs, Inc. | Robotic manipulator |
| WO2011028290A1 (en) * | 2009-09-06 | 2011-03-10 | Hanzhong Zhang | Tubular photovoltaic device and method of making |
| US8087380B2 (en) * | 2009-10-30 | 2012-01-03 | Intevac, Inc. | Evaporative system for solar cell fabrication |
| TW201200628A (en) * | 2010-06-29 | 2012-01-01 | Hon Hai Prec Ind Co Ltd | Coating apparatus |
| US9178093B2 (en) | 2011-07-06 | 2015-11-03 | Flextronics Ap, Llc | Solar cell module on molded lead-frame and method of manufacture |
| CN103866249A (zh) * | 2012-12-13 | 2014-06-18 | 中国科学院大连化学物理研究所 | 一种磁控溅射装置及其应用 |
| CN104213094A (zh) * | 2013-06-04 | 2014-12-17 | 金弼 | 一种真空镀膜装置 |
| US9300169B1 (en) | 2013-06-26 | 2016-03-29 | Cameron M. D. Bardy | Automotive roof rack with integral solar cell array |
| JP6805124B2 (ja) * | 2014-07-09 | 2020-12-23 | ソレラス・アドヴァンスト・コーティングス・ビーヴイ | 移動ターゲットを有するスパッタ装置 |
| JP6451030B2 (ja) * | 2015-01-26 | 2019-01-16 | 株式会社昭和真空 | 成膜装置 |
| US9963778B2 (en) | 2015-05-07 | 2018-05-08 | International Business Machines Corporation | Functionally graded material by in-situ gradient alloy sputter deposition management |
| KR102651054B1 (ko) * | 2016-02-22 | 2024-03-26 | 삼성디스플레이 주식회사 | 전사 장치, 이를 이용한 전사 방법 및 표시 장치 |
| CN108385068B (zh) * | 2018-02-05 | 2019-12-31 | 信利光电股份有限公司 | 一种曲面盖板的镀膜装置、镀膜方法和可读存储介质 |
| CN110007539B (zh) * | 2019-05-22 | 2021-09-21 | 江苏铁锚玻璃股份有限公司 | 高效均匀变色的曲面电致变色透明器件及其制备方法 |
| BE1027427B1 (nl) * | 2019-07-14 | 2021-02-08 | Soleras Advanced Coatings Bv | Bewegingssystemen voor sputter coaten van niet-vlakke substraten |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5022840A (https=) * | 1973-06-28 | 1975-03-11 | ||
| US3990914A (en) * | 1974-09-03 | 1976-11-09 | Sensor Technology, Inc. | Tubular solar cell |
| US4114330A (en) * | 1976-11-04 | 1978-09-19 | Kawneer Company, Inc. | Skylight system |
| FR2401290A1 (fr) * | 1977-08-25 | 1979-03-23 | Saint Gobain | Dispositif de montage de capteurs solaires sur les batiments |
| US4225638A (en) * | 1979-04-16 | 1980-09-30 | The D. L. Auld Company | Method and apparatus for flow coating with suck-back control |
| US4451507A (en) * | 1982-10-29 | 1984-05-29 | Rca Corporation | Automatic liquid dispensing apparatus for spinning surface of uniform thickness |
| DE3306870A1 (de) * | 1983-02-26 | 1984-08-30 | Leybold-Heraeus GmbH, 5000 Köln | Vorrichtung zum herstellen von schichten mit rotationssymmetrischem dickenprofil durch katodenzerstaeubung |
| JPH06102829B2 (ja) * | 1984-03-28 | 1994-12-14 | 日電アネルバ株式会社 | 放電反応処理装置 |
| US4620985A (en) * | 1985-03-22 | 1986-11-04 | The D. L. Auld Company | Circumferential groove coating method for protecting a glass bottle |
| JPH0791642B2 (ja) * | 1986-10-15 | 1995-10-04 | 石川島播磨重工業株式会社 | 表面処理装置 |
| US4851095A (en) * | 1988-02-08 | 1989-07-25 | Optical Coating Laboratory, Inc. | Magnetron sputtering apparatus and process |
| US5174881A (en) * | 1988-05-12 | 1992-12-29 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for forming a thin film on surface of semiconductor substrate |
| US5055036A (en) * | 1991-02-26 | 1991-10-08 | Tokyo Electron Sagami Limited | Method of loading and unloading wafer boat |
| US5215420A (en) * | 1991-09-20 | 1993-06-01 | Intevac, Inc. | Substrate handling and processing system |
| JP3322912B2 (ja) * | 1992-08-17 | 2002-09-09 | 東京エレクトロン株式会社 | ウエハボート回転装置及びこれを用いた熱処理装置 |
| US5705321A (en) * | 1993-09-30 | 1998-01-06 | The University Of New Mexico | Method for manufacture of quantum sized periodic structures in Si materials |
| US5373839A (en) * | 1994-01-05 | 1994-12-20 | Hoang; Shao-Kuang | Solar collector assembly for a solar heating system |
| US5588996A (en) * | 1994-04-01 | 1996-12-31 | Argus International | Apparatus for spray coating flat surfaces |
| JP2665202B2 (ja) * | 1995-05-31 | 1997-10-22 | 九州日本電気株式会社 | 半導体ウェハ処理装置 |
| US5626207A (en) * | 1995-10-23 | 1997-05-06 | Micron Technology, Inc. | Manual wafer lift |
| US6018383A (en) * | 1997-08-20 | 2000-01-25 | Anvik Corporation | Very large area patterning system for flexible substrates |
| US6086362A (en) * | 1998-05-20 | 2000-07-11 | Applied Komatsu Technology, Inc. | Multi-function chamber for a substrate processing system |
| US6079693A (en) * | 1998-05-20 | 2000-06-27 | Applied Komatsu Technology, Inc. | Isolation valves |
| US6530340B2 (en) * | 1998-11-12 | 2003-03-11 | Advanced Micro Devices, Inc. | Apparatus for manufacturing planar spin-on films |
| US6662673B1 (en) * | 1999-04-08 | 2003-12-16 | Applied Materials, Inc. | Linear motion apparatus and associated method |
| US6460369B2 (en) * | 1999-11-03 | 2002-10-08 | Applied Materials, Inc. | Consecutive deposition system |
| US6499426B1 (en) * | 1999-12-10 | 2002-12-31 | Saint-Gobain Industrial Ceramics, Inc. | System and method for coating non-planar surfaces of objects with diamond film |
| US20020083739A1 (en) * | 2000-12-29 | 2002-07-04 | Pandelisev Kiril A. | Hot substrate deposition fiber optic preforms and preform components process and apparatus |
| US6732551B2 (en) * | 2001-05-04 | 2004-05-11 | Corning Incorporated | Method and feedstock for making silica |
| US7415844B2 (en) * | 2001-06-25 | 2008-08-26 | Prysmian Cavi E Sistemi Energia S.R.L. | Device for manufacturing a preform for optical fibres through chemical deposition |
| EP1408540A4 (en) * | 2001-06-28 | 2008-12-10 | Shinetsu Handotai Kk | METHOD OF MANUFACTURING A HEATER AND HEATING WAFERS |
| US6681716B2 (en) * | 2001-11-27 | 2004-01-27 | General Electric Company | Apparatus and method for depositing large area coatings on non-planar surfaces |
| US20030154923A1 (en) * | 2002-02-19 | 2003-08-21 | Innovative Technology Licensing, Llc | Mechanical translator with ultra low friction ferrofluid bearings |
| US7600349B2 (en) * | 2003-02-26 | 2009-10-13 | Unirac, Inc. | Low profile mounting system |
| US7441379B2 (en) * | 2003-06-27 | 2008-10-28 | Konvin Associates Limited Partnership | Light transmission panels, retaining clip and a combination thereof |
| US7313893B2 (en) * | 2003-11-13 | 2008-01-01 | Extech/Exterior Technologies, Inc. | Panel clip assembly for use with roof or wall panels |
| US20060201074A1 (en) * | 2004-06-02 | 2006-09-14 | Shinichi Kurita | Electronic device manufacturing chamber and methods of forming the same |
| GB2417251A (en) * | 2004-08-18 | 2006-02-22 | Nanofilm Technologies Int | Removing material from a substrate surface using plasma |
| US7661234B2 (en) * | 2005-08-10 | 2010-02-16 | Extech/Exterior Technologies, Inc. | Reduced friction fastening clip assembly for use with standing seam roof or wall panel systems |
| JP2007077478A (ja) * | 2005-09-16 | 2007-03-29 | Sony Corp | 成膜方法及び成膜装置 |
-
2007
- 2007-05-09 US US11/801,469 patent/US7563725B2/en not_active Expired - Fee Related
-
2008
- 2008-03-24 JP JP2010502089A patent/JP5415401B2/ja not_active Expired - Fee Related
- 2008-03-24 CN CN2008800186554A patent/CN101681844B/zh not_active Expired - Fee Related
- 2008-03-24 EP EP08727143A patent/EP2137761A4/en not_active Withdrawn
- 2008-03-24 SG SG201004989-8A patent/SG163597A1/en unknown
- 2008-03-24 WO PCT/US2008/003886 patent/WO2008123930A1/en not_active Ceased
- 2008-03-24 KR KR1020097023068A patent/KR20100016224A/ko not_active Ceased
- 2008-03-24 MY MYPI20094133A patent/MY149238A/en unknown
-
2009
- 2009-06-10 US US12/482,263 patent/US8580037B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101681844A (zh) | 2010-03-24 |
| US20090255471A1 (en) | 2009-10-15 |
| EP2137761A1 (en) | 2009-12-30 |
| JP2010523818A (ja) | 2010-07-15 |
| US20080248647A1 (en) | 2008-10-09 |
| WO2008123930A1 (en) | 2008-10-16 |
| EP2137761A4 (en) | 2011-12-07 |
| US8580037B2 (en) | 2013-11-12 |
| US7563725B2 (en) | 2009-07-21 |
| JP5415401B2 (ja) | 2014-02-12 |
| SG163597A1 (en) | 2010-08-30 |
| MY149238A (en) | 2013-07-31 |
| CN101681844B (zh) | 2013-03-27 |
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St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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St.27 status event code: U-3-3-T10-T11-oth-X000 |
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