KR20090013717A - 전기 신호 접속 장치 - Google Patents

전기 신호 접속 장치 Download PDF

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Publication number
KR20090013717A
KR20090013717A KR1020080075283A KR20080075283A KR20090013717A KR 20090013717 A KR20090013717 A KR 20090013717A KR 1020080075283 A KR1020080075283 A KR 1020080075283A KR 20080075283 A KR20080075283 A KR 20080075283A KR 20090013717 A KR20090013717 A KR 20090013717A
Authority
KR
South Korea
Prior art keywords
probe
circuit board
resin film
electrical signal
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020080075283A
Other languages
English (en)
Korean (ko)
Inventor
군세이 기모토
Original Assignee
군세이 기모토
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 군세이 기모토 filed Critical 군세이 기모토
Publication of KR20090013717A publication Critical patent/KR20090013717A/ko
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020080075283A 2007-08-01 2008-07-31 전기 신호 접속 장치 Ceased KR20090013717A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007223243A JP5030060B2 (ja) 2007-08-01 2007-08-01 電気信号接続装置
JPJP-P-2007-00223243 2007-08-01

Publications (1)

Publication Number Publication Date
KR20090013717A true KR20090013717A (ko) 2009-02-05

Family

ID=40331500

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080075283A Ceased KR20090013717A (ko) 2007-08-01 2008-07-31 전기 신호 접속 장치

Country Status (5)

Country Link
US (1) US7622937B2 (https=)
JP (1) JP5030060B2 (https=)
KR (1) KR20090013717A (https=)
CN (1) CN101359000B (https=)
TW (1) TW200907359A (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5077794B2 (ja) * 2007-08-02 2012-11-21 軍生 木本 プローブ組立体
JP5099487B2 (ja) * 2007-08-03 2012-12-19 軍生 木本 複数梁合成型接触子
JP5288248B2 (ja) 2008-06-04 2013-09-11 軍生 木本 電気信号接続装置
JP5364877B2 (ja) * 2009-04-28 2013-12-11 有限会社清田製作所 積層型プローブ
WO2011036718A1 (ja) * 2009-09-25 2011-03-31 株式会社アドバンテスト プローブ装置および試験装置
JP2011141126A (ja) * 2010-01-05 2011-07-21 Toshiba Corp プローブカード
CN102156205B (zh) * 2010-02-11 2013-06-19 旺矽科技股份有限公司 探针卡及用于该探针卡的印刷电路板
CN103048576A (zh) * 2013-01-24 2013-04-17 昆山尼赛拉电子器材有限公司 端子检测治具
CN112309486B (zh) * 2019-07-26 2024-04-12 第一检测有限公司 芯片测试装置
CN112349712B (zh) * 2019-08-08 2024-12-03 桑迪士克科技股份有限公司 集成电子元件模块、包含其的半导体封装体及其制造方法
TWI749690B (zh) * 2020-08-10 2021-12-11 京元電子股份有限公司 半導體元件預燒測試模組及其預燒測試裝置
CN114078718B (zh) * 2020-08-13 2025-02-28 京元电子股份有限公司 半导体元件预烧测试模块及其预烧测试装置
CN115616259B (zh) * 2022-09-26 2023-12-08 上海泽丰半导体科技有限公司 薄膜探针卡水平调节装置及薄膜探针卡

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5084672A (en) * 1989-02-21 1992-01-28 Giga Probe, Inc. Multi-point probe assembly for testing electronic device
US5059898A (en) * 1990-08-09 1991-10-22 Tektronix, Inc. Wafer probe with transparent loading member
US6034534A (en) * 1995-05-25 2000-03-07 Kiyota; Shigeo Laminated contact probe for inspection of ultra-microscopic pitch
US5736850A (en) * 1995-09-11 1998-04-07 Teradyne, Inc. Configurable probe card for automatic test equipment
JP3022312B2 (ja) * 1996-04-15 2000-03-21 日本電気株式会社 プローブカードの製造方法
KR100471341B1 (ko) * 1996-05-23 2005-07-21 제네시스 테크놀로지 가부시키가이샤 콘택트프로브및그것을구비한프로브장치
JP3172760B2 (ja) * 1997-03-07 2001-06-04 東京エレクトロン株式会社 バキュームコンタクタ
US6586954B2 (en) * 1998-02-10 2003-07-01 Celadon Systems, Inc. Probe tile for probing semiconductor wafer
ATE260470T1 (de) * 1997-11-05 2004-03-15 Feinmetall Gmbh Prüfkopf für mikrostrukturen mit schnittstelle
JP3323449B2 (ja) * 1998-11-18 2002-09-09 日本碍子株式会社 半導体用ソケット
JP4185218B2 (ja) * 1999-04-02 2008-11-26 株式会社ヨコオ コンタクトプローブとその製造方法、および前記コンタクトプローブを用いたプローブ装置とその製造方法
US6330744B1 (en) * 1999-07-12 2001-12-18 Pjc Technologies, Inc. Customized electrical test probe head using uniform probe assemblies
US6496612B1 (en) * 1999-09-23 2002-12-17 Arizona State University Electronically latching micro-magnetic switches and method of operating same
JP4355074B2 (ja) 1999-12-27 2009-10-28 株式会社日本マイクロニクス プローブカード
US6496026B1 (en) * 2000-02-25 2002-12-17 Microconnect, Inc. Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground
JP2002296297A (ja) * 2001-03-29 2002-10-09 Isao Kimoto 接触子組立体
JP4496456B2 (ja) 2001-09-03 2010-07-07 軍生 木本 プローバ装置
JP3829099B2 (ja) * 2001-11-21 2006-10-04 株式会社日本マイクロニクス 電気的接続装置
JP4008408B2 (ja) * 2003-11-07 2007-11-14 日本電子材料株式会社 プローブカード
JP4721099B2 (ja) * 2004-03-16 2011-07-13 軍生 木本 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置
TWI286606B (en) * 2004-03-16 2007-09-11 Gunsei Kimoto Electric signal connecting device, and probe assembly and prober device using it
JP4107275B2 (ja) * 2004-09-09 2008-06-25 セイコーエプソン株式会社 検査用プローブ及び検査装置、検査用プローブの製造方法
JP4815192B2 (ja) * 2005-10-31 2011-11-16 株式会社日本マイクロニクス 電気的接続装置
JP5077794B2 (ja) * 2007-08-02 2012-11-21 軍生 木本 プローブ組立体

Also Published As

Publication number Publication date
US7622937B2 (en) 2009-11-24
US20090033348A1 (en) 2009-02-05
CN101359000B (zh) 2012-07-04
CN101359000A (zh) 2009-02-04
JP2009036745A (ja) 2009-02-19
TWI375039B (https=) 2012-10-21
JP5030060B2 (ja) 2012-09-19
TW200907359A (en) 2009-02-16

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000