KR20090009734A - 표면처리제 - Google Patents

표면처리제 Download PDF

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Publication number
KR20090009734A
KR20090009734A KR1020080069864A KR20080069864A KR20090009734A KR 20090009734 A KR20090009734 A KR 20090009734A KR 1020080069864 A KR1020080069864 A KR 1020080069864A KR 20080069864 A KR20080069864 A KR 20080069864A KR 20090009734 A KR20090009734 A KR 20090009734A
Authority
KR
South Korea
Prior art keywords
mass
zinc
surface treatment
treatment agent
treating agent
Prior art date
Application number
KR1020080069864A
Other languages
English (en)
Korean (ko)
Inventor
켄지 니시에
노리코 야구마
요시아키 후루카와
Original Assignee
멕크 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 멕크 가부시키가이샤 filed Critical 멕크 가부시키가이샤
Publication of KR20090009734A publication Critical patent/KR20090009734A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D235/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings
    • C07D235/02—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings condensed with carbocyclic rings or ring systems
    • C07D235/04—Benzimidazoles; Hydrogenated benzimidazoles
    • C07D235/06—Benzimidazoles; Hydrogenated benzimidazoles with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached in position 2
    • C07D235/08—Radicals containing only hydrogen and carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Chemical Treatment Of Metals (AREA)
KR1020080069864A 2007-07-20 2008-07-18 표면처리제 KR20090009734A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007189950 2007-07-20
JPJP-P-2007-00189950 2007-07-20

Publications (1)

Publication Number Publication Date
KR20090009734A true KR20090009734A (ko) 2009-01-23

Family

ID=40149312

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080069864A KR20090009734A (ko) 2007-07-20 2008-07-18 표면처리제

Country Status (5)

Country Link
JP (1) JP2009046761A (de)
KR (1) KR20090009734A (de)
CN (1) CN101348913B (de)
DE (1) DE102008033348A1 (de)
TW (1) TW200907107A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101827765B1 (ko) * 2014-06-24 2018-02-09 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 동계 금속 또는 은계 금속의 흑화 처리용 조성물
CN105750354A (zh) * 2016-03-31 2016-07-13 常州易藤电气有限公司 一种冷镀锡铁道用铜镁合金绞线的制备方法
CN105880432A (zh) * 2016-03-31 2016-08-24 常州易藤电气有限公司 一种热镀锡铁道用铜镁合金绞线的制备方法
JP6402134B2 (ja) * 2016-05-12 2018-10-10 株式会社タムラ製作所 水溶性プリフラックス、それを用いた表面処理方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4772645A (en) * 1986-05-07 1988-09-20 Minnesota Mining And Manufacturing Company Epoxy resin composition
JP2561150B2 (ja) * 1989-06-09 1996-12-04 四国化成工業株式会社 銅及び銅合金の表面処理方法
JP2972295B2 (ja) * 1990-08-10 1999-11-08 四国化成工業株式会社 銅及び銅合金の表面処理方法
JP2834884B2 (ja) * 1990-10-29 1998-12-14 四国化成工業株式会社 銅及び銅合金の表面処理方法
JPH05163585A (ja) * 1991-12-12 1993-06-29 Shikoku Chem Corp 銅及び銅合金の表面処理方法
JPH05237688A (ja) 1992-02-28 1993-09-17 Shikoku Chem Corp はんだ付け用フラックス組成物
JP2923596B2 (ja) 1993-08-11 1999-07-26 メック株式会社 イミダゾール系化合物を用いた銅および銅合金の表面処理剤
US5747623A (en) * 1994-10-14 1998-05-05 Tonen Corporation Method and composition for forming ceramics and article coated with the ceramics
JPH09316649A (ja) * 1996-05-27 1997-12-09 Matsushita Electric Ind Co Ltd 無電解めっき液
JPH10251867A (ja) * 1997-03-07 1998-09-22 Shikoku Chem Corp 銅及び銅合金の表面処理剤
JPH11177218A (ja) 1997-12-12 1999-07-02 Tamura Kaken Co Ltd 電子回路用金属面具備部品及びその表面保護剤
JP4546163B2 (ja) * 2004-06-10 2010-09-15 四国化成工業株式会社 銅または銅合金の表面処理剤及び半田付け方法
JP2007115497A (ja) * 2005-10-20 2007-05-10 Mitsubishi Materials Corp ニッケル被覆銅微粒子とその製造方法、導電ペースト、及び、導電膜の製造方法

Also Published As

Publication number Publication date
JP2009046761A (ja) 2009-03-05
CN101348913B (zh) 2011-09-07
DE102008033348A1 (de) 2009-01-22
TW200907107A (en) 2009-02-16
CN101348913A (zh) 2009-01-21

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