KR20080040647A - 기판처리장치 및 기판처리 방법 - Google Patents
기판처리장치 및 기판처리 방법 Download PDFInfo
- Publication number
- KR20080040647A KR20080040647A KR1020080024698A KR20080024698A KR20080040647A KR 20080040647 A KR20080040647 A KR 20080040647A KR 1020080024698 A KR1020080024698 A KR 1020080024698A KR 20080024698 A KR20080024698 A KR 20080024698A KR 20080040647 A KR20080040647 A KR 20080040647A
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- tank
- processing liquid
- liquid
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- 239000000758 substrate Substances 0.000 title claims abstract description 205
- 238000000034 method Methods 0.000 title claims abstract description 139
- 239000007788 liquid Substances 0.000 claims abstract description 492
- 238000001816 cooling Methods 0.000 claims abstract description 201
- 239000012535 impurity Substances 0.000 claims abstract description 123
- 238000011144 upstream manufacturing Methods 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 17
- 238000001914 filtration Methods 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 6
- 238000005086 pumping Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 description 59
- 208000028659 discharge Diseases 0.000 description 19
- 238000005530 etching Methods 0.000 description 16
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 150000004767 nitrides Chemical class 0.000 description 9
- 239000007787 solid Substances 0.000 description 7
- 239000002699 waste material Substances 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 238000005119 centrifugation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D9/00—Equipment for handling freight; Equipment for facilitating passenger embarkation or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C1/00—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith for transmitting lifting forces to articles or groups of articles
- B66C1/10—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith for transmitting lifting forces to articles or groups of articles by mechanical means
- B66C1/62—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith for transmitting lifting forces to articles or groups of articles by mechanical means comprising article-engaging members of a shape complementary to that of the articles to be handled
- B66C1/66—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith for transmitting lifting forces to articles or groups of articles by mechanical means comprising article-engaging members of a shape complementary to that of the articles to be handled for engaging holes, recesses, or abutments on articles specially provided for facilitating handling thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Abstract
Description
Claims (9)
- 기판을 처리액에 의해 처리하는 기판처리장치에 있어서,기판을 수납하는 동시에, 처리액을 저류(貯留)하는 처리조와,상기 처리조로부터 배출된 처리액을 다시 한번 상기 처리조로 공급하는 순환경로와,상기 순환경로 도중에 있어서 처리액을 저류하는 동시에, 처리액을 냉각하는 냉각조와,상기 냉각조에 침전한 불순물을 상기 냉각조로부터 배출하는 배출 수단을 갖추는 것을 특징으로 하는 기판처리장치.
- 제1항에 있어서,상기 냉각조에 저류된 처리액의 위(上)의 맑은 액을 퍼 올리고, 하류 측의 순환경로에 처리액을 공급시키는 순환기구를 더 갖추는 것을 특징으로 하는 기판처리장치.
- 제2항에 있어서,상기 순환경로 도중의 상기 냉각조보다도 하류 측에 있어서, 처리액을 가열하는 가열수단을 더 갖는 것을 특징으로 하는 기판처리장치.
- 제3항에 있어서,상기 처리조는, 기판을 수용하는 동시에, 기판을 처리하는 내조와, 상기 내조의 상부 외측에 상기 내조로부터 넘친 처리액을 수용하는 외조(外槽)를 갖추고, 상기 순환경로는, 상기 외조로부터 배출된 처리액을 다시 한번 상기 내조에 공급하는 것을 특징으로 하는 기판처리장치.
- 제3항에 있어서,상기 순환경로는, 상기 처리조의 저부로부터 배출된 처리액을 다시 한번 상기 처리조에 공급하는 것을 특징으로 하는 기판처리장치.
- 제3항에 있어서,상기 순환경로는, 제1 순환경로와 제2 순환경로를 갖추고,상기 제1 순환경로와 상기 제2 순환경로의 각각에, 상기 냉각조가 설치되고,상기 제1 순환경로와 상기 제2 순환경로를 전환하는 순환경로 전환수단을 갖추는 것을 특징으로 하는 기판처리장치.
- 제6항에 있어서,상기 순환경로의 상기 냉각조보다도 하류 측에 있어서, 처리액 중의 불순물을 걸러 내는 필터를 더 갖추는 것을 특징으로 하는 기판처리장치.
- 제7항에 있어서,상기 순환경로 도중의 상기 냉각조보다도 상류 측에 있어서, 처리액을 공급하는 처리액공급수단을 더 갖추는 것을 특징으로 하는 기판처리장치.
- 제3항에 있어서,상기 순환 경로 도중의 상기 냉각조보다도 하류 측에 있어서, 처리액을 저류하는 처리액 저류조를 더 갖추고,상기 가열수단은, 상기 처리액 저류조에 저류된 처리액을 가열하는 것을 특징으로 하는 기판처리장치.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2006-00020388 | 2006-01-30 | ||
JP2006020412A JP4668079B2 (ja) | 2006-01-30 | 2006-01-30 | 基板処理装置 |
JPJP-P-2006-00020412 | 2006-01-30 | ||
JP2006020388A JP4828948B2 (ja) | 2006-01-30 | 2006-01-30 | 基板処理装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070009072A Division KR100853058B1 (ko) | 2006-01-30 | 2007-01-29 | 기판처리장치 및 기판처리 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080040647A true KR20080040647A (ko) | 2008-05-08 |
KR100852537B1 KR100852537B1 (ko) | 2008-08-14 |
Family
ID=38320752
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070009072A KR100853058B1 (ko) | 2006-01-30 | 2007-01-29 | 기판처리장치 및 기판처리 방법 |
KR1020080024698A KR100852537B1 (ko) | 2006-01-30 | 2008-03-18 | 기판처리장치 및 기판처리 방법 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070009072A KR100853058B1 (ko) | 2006-01-30 | 2007-01-29 | 기판처리장치 및 기판처리 방법 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20070175387A1 (ko) |
KR (2) | KR100853058B1 (ko) |
TW (1) | TWI334624B (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4786351B2 (ja) * | 2006-01-20 | 2011-10-05 | 株式会社東芝 | 処理装置及び処理方法 |
US7541067B2 (en) * | 2006-04-13 | 2009-06-02 | Solopower, Inc. | Method and apparatus for continuous processing of buffer layers for group IBIIIAVIA solar cells |
JP5179282B2 (ja) * | 2007-09-27 | 2013-04-10 | 大日本スクリーン製造株式会社 | 基板処理装置及び基板処理方法 |
US20090087566A1 (en) * | 2007-09-27 | 2009-04-02 | Masahiro Kimura | Substrate treating apparatus and substrate treating method |
JP5451515B2 (ja) * | 2010-05-06 | 2014-03-26 | 東京エレクトロン株式会社 | 薬液供給システム、これを備える基板処理装置、およびこの基板処理装置を備える塗布現像システム |
CN102989717B (zh) * | 2012-12-25 | 2014-11-26 | 西安烽火光伏科技股份有限公司 | 一种预清洗工序中在线废水回用方法 |
KR20140117021A (ko) * | 2013-03-25 | 2014-10-07 | 삼성에스디아이 주식회사 | 증착 장치 및 용액의 재사용 방법 |
JP6502633B2 (ja) * | 2013-09-30 | 2019-04-17 | 芝浦メカトロニクス株式会社 | 基板処理方法及び基板処理装置 |
KR20150042370A (ko) * | 2013-10-10 | 2015-04-21 | 삼성에스디아이 주식회사 | 용액의 재사용 방법, 상기 방법에 의해 형성된 버퍼층을 포함하는 태양전지, 및 증착 장치 |
TWI630652B (zh) | 2014-03-17 | 2018-07-21 | 斯克林集團公司 | 基板處理裝置及使用基板處理裝置之基板處理方法 |
JP6383254B2 (ja) * | 2014-11-04 | 2018-08-29 | 株式会社東芝 | 処理装置および処理方法 |
JP6326387B2 (ja) * | 2015-03-19 | 2018-05-16 | 東京エレクトロン株式会社 | 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体 |
JP6789751B2 (ja) * | 2016-10-04 | 2020-11-25 | 東京エレクトロン株式会社 | 基板液処理装置、基板液処理方法および記憶媒体 |
JP6535649B2 (ja) | 2016-12-12 | 2019-06-26 | 株式会社荏原製作所 | 基板処理装置、排出方法およびプログラム |
KR102478777B1 (ko) * | 2017-04-06 | 2022-12-21 | 도쿄엘렉트론가부시키가이샤 | 액 공급 장치 및 액 공급 방법 |
JP6900274B2 (ja) * | 2017-08-16 | 2021-07-07 | 株式会社Screenホールディングス | 薬液供給装置、基板処理装置、薬液供給方法、および基板処理方法 |
JP6979852B2 (ja) | 2017-10-26 | 2021-12-15 | 株式会社Screenホールディングス | 処理液供給装置、基板処理装置、および処理液供給方法 |
CN108048822A (zh) * | 2017-12-20 | 2018-05-18 | 北京铂阳顶荣光伏科技有限公司 | 化学浴沉积装置及其沉积方法、废液回收系统 |
TWI679718B (zh) * | 2018-11-30 | 2019-12-11 | 辛耘企業股份有限公司 | 基板處理系統 |
CN111017245A (zh) * | 2019-12-18 | 2020-04-17 | 成都飞机工业(集团)有限责任公司 | 一种飞机地面液冷保障设备废液收集系统 |
KR102520603B1 (ko) * | 2020-04-07 | 2023-04-13 | 세메스 주식회사 | 쿼츠 부품 재생 방법 및 쿼츠 부품 재생 장치 |
JP7475252B2 (ja) * | 2020-10-02 | 2024-04-26 | 東京エレクトロン株式会社 | 基板処理装置、及び基板処理方法 |
CN112530790B (zh) * | 2020-11-03 | 2022-01-11 | 长江存储科技有限责任公司 | 晶圆清洗装置和晶圆清洗方法 |
Family Cites Families (15)
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US2941902A (en) * | 1957-07-02 | 1960-06-21 | Gen Am Transport | Chemical nickel plating methods and systems |
US3463708A (en) * | 1966-06-20 | 1969-08-26 | Mohawk Data Sciences Corp | Electrolytic bath for magnetic deposition |
JP2655098B2 (ja) * | 1994-10-18 | 1997-09-17 | 日本電気株式会社 | 薬液を用いたウエハ表面処理装置 |
JPH09275091A (ja) * | 1996-04-03 | 1997-10-21 | Mitsubishi Electric Corp | 半導体窒化膜エッチング装置 |
KR19990019401U (ko) * | 1997-11-19 | 1999-06-15 | 구본준 | 웨이퍼 세정조 |
JPH11285673A (ja) | 1998-04-03 | 1999-10-19 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
CN1121992C (zh) * | 1998-08-26 | 2003-09-24 | 松下电器产业株式会社 | 玻璃洗净用溶液的再生方法和再生装置、硅酸盐玻璃的洗净方法和洗净装置 |
US6454927B1 (en) * | 2000-06-26 | 2002-09-24 | Applied Materials, Inc. | Apparatus and method for electro chemical deposition |
CN1245249C (zh) * | 2001-09-18 | 2006-03-15 | 天津膜天膜工程技术有限公司 | 中空纤维膜分离装置及其运行方法 |
KR100672634B1 (ko) * | 2001-12-19 | 2007-02-09 | 엘지.필립스 엘시디 주식회사 | 액정표시소자의 기판 반송 장치 및 방법 |
US7341634B2 (en) * | 2002-08-27 | 2008-03-11 | Ebara Corporation | Apparatus for and method of processing substrate |
US7238295B2 (en) * | 2002-09-17 | 2007-07-03 | m·FSI Ltd. | Regeneration process of etching solution, etching process, and etching system |
TW570293U (en) * | 2003-05-26 | 2004-01-01 | Toppoly Optoelectronics Corp | Wet etching device |
JP3884440B2 (ja) * | 2004-03-15 | 2007-02-21 | 株式会社東芝 | フィルタおよび半導体処理装置 |
TWI235425B (en) * | 2004-05-26 | 2005-07-01 | Promos Technologies Inc | Etching system and method for treating the etching solution thereof |
-
2007
- 2007-01-23 TW TW096102488A patent/TWI334624B/zh active
- 2007-01-29 KR KR1020070009072A patent/KR100853058B1/ko active IP Right Grant
- 2007-01-30 US US11/668,777 patent/US20070175387A1/en not_active Abandoned
-
2008
- 2008-03-18 KR KR1020080024698A patent/KR100852537B1/ko active IP Right Grant
-
2014
- 2014-10-02 US US14/505,092 patent/US20150020968A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TWI334624B (en) | 2010-12-11 |
KR20070078811A (ko) | 2007-08-02 |
US20150020968A1 (en) | 2015-01-22 |
KR100853058B1 (ko) | 2008-08-19 |
US20070175387A1 (en) | 2007-08-02 |
KR100852537B1 (ko) | 2008-08-14 |
TW200739712A (en) | 2007-10-16 |
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