KR20070106627A - 가요성 인쇄 회로 기판과 다른 회로 기판의 접속 방법 - Google Patents

가요성 인쇄 회로 기판과 다른 회로 기판의 접속 방법 Download PDF

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Publication number
KR20070106627A
KR20070106627A KR1020077020348A KR20077020348A KR20070106627A KR 20070106627 A KR20070106627 A KR 20070106627A KR 1020077020348 A KR1020077020348 A KR 1020077020348A KR 20077020348 A KR20077020348 A KR 20077020348A KR 20070106627 A KR20070106627 A KR 20070106627A
Authority
KR
South Korea
Prior art keywords
circuit board
fpc
adhesive film
conductor
thermosetting adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020077020348A
Other languages
English (en)
Korean (ko)
Inventor
고히찌로 가와떼
요시아끼 사또
유지 히라사와
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20070106627A publication Critical patent/KR20070106627A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020077020348A 2005-03-07 2006-03-07 가요성 인쇄 회로 기판과 다른 회로 기판의 접속 방법 Withdrawn KR20070106627A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005061858A JP2006245453A (ja) 2005-03-07 2005-03-07 フレキシブルプリント回路基板の他の回路基板への接続方法
JPJP-P-2005-00061858 2005-03-07

Publications (1)

Publication Number Publication Date
KR20070106627A true KR20070106627A (ko) 2007-11-02

Family

ID=36603345

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077020348A Withdrawn KR20070106627A (ko) 2005-03-07 2006-03-07 가요성 인쇄 회로 기판과 다른 회로 기판의 접속 방법

Country Status (7)

Country Link
US (1) US20080156437A1 (https=)
EP (1) EP1856770A1 (https=)
JP (1) JP2006245453A (https=)
KR (1) KR20070106627A (https=)
CN (1) CN101138135A (https=)
TW (1) TW200638823A (https=)
WO (1) WO2006096631A1 (https=)

Cited By (1)

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KR20130114739A (ko) * 2011-02-25 2013-10-17 야자키 소교 가부시키가이샤 회로체 및 커넥터 구조

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US7040557B2 (en) * 2001-02-26 2006-05-09 Power Technologies Investment Ltd. System and method for pulverizing and extracting moisture
JP2007005640A (ja) * 2005-06-24 2007-01-11 Three M Innovative Properties Co 回路基板の相互接続方法
JP2008089819A (ja) * 2006-09-29 2008-04-17 Toshiba Matsushita Display Technology Co Ltd フレキシブル基板及びフレキシブル基板を備えた表示装置
JP5087302B2 (ja) * 2007-03-29 2012-12-05 三洋電機株式会社 回路装置およびその製造方法
GB0714723D0 (en) 2007-07-30 2007-09-12 Pilkington Automotive D Gmbh Improved electrical connector
US9001016B2 (en) * 2007-09-19 2015-04-07 Nvidia Corporation Hardware driven display restore mechanism
US7854817B2 (en) * 2008-05-29 2010-12-21 3M Innovative Properties Company Methods and assemblies for attaching articles to surfaces
JP2012199262A (ja) * 2011-03-18 2012-10-18 Seiko Epson Corp 回路基板、接続構造体及び回路基板の接続方法
JP6146302B2 (ja) * 2011-05-18 2017-06-14 日立化成株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
KR102044574B1 (ko) * 2012-04-13 2019-11-13 히타치가세이가부시끼가이샤 회로 접속 재료, 접속 구조체 및 그의 제조 방법
TWI436718B (zh) * 2012-05-04 2014-05-01 Mutual Tek Ind Co Ltd 複合式電路板的製作方法
CN103607855B (zh) * 2013-10-26 2016-06-08 溧阳市东大技术转移中心有限公司 一种复合挠性基板的制造方法
DE102013221870B4 (de) 2013-10-28 2021-09-30 Te Connectivity Germany Gmbh Verbindungsanordnung zur Verbindung mindestens einer als Zelle ausgestalteten Spannungsquelle und/oder -senke mit einem externen elektrischen Bauelement und elektrische Anordnung umfassend eine Verbindungsanordnung
US9460757B2 (en) * 2013-11-04 2016-10-04 HGST Netherlands B.V. Flexible cable assembly having reduced-tolerance electrical connection pads
US10543039B2 (en) * 2014-03-18 2020-01-28 Boston Scientific Scimed, Inc. Nerve ablation devices and related methods of use and manufacture
JP6656808B2 (ja) * 2015-02-17 2020-03-04 ヒロセ電機株式会社 電気コネクタとフレキシブル基板との組立体
US11737818B2 (en) * 2018-08-14 2023-08-29 Biosense Webster (Israel) Ltd. Heat transfer during ablation procedures
TWI705748B (zh) * 2019-11-21 2020-09-21 頎邦科技股份有限公司 雙面銅之軟性電路板及其佈線結構
EP4096545A1 (en) * 2020-05-08 2022-12-07 St. Jude Medical, Cardiology Division, Inc. Methods for forming a spline using a flexible circuit assembly and electrode assemblies including same
TWI763042B (zh) * 2020-09-17 2022-05-01 佳勝科技股份有限公司 製造電路板結構的方法
CN112616244B (zh) * 2020-12-22 2022-03-22 浙江清华柔性电子技术研究院 柔性电路板及柔性电路板制备方法
TWI881025B (zh) * 2021-01-25 2025-04-21 優顯科技股份有限公司 電子裝置及其製造方法

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ES8605846A1 (es) * 1984-03-01 1986-04-16 Norton Sa Procedimiento de producir agentes de ensamblado para objetos solidos
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
JP3238695B2 (ja) * 1990-07-09 2001-12-17 株式会社半導体エネルギー研究所 表示装置及びイメージセンサー装置の作製方法
JP2995993B2 (ja) * 1992-03-16 1999-12-27 日立化成工業株式会社 回路の接続方法
JP2937705B2 (ja) * 1993-08-31 1999-08-23 アルプス電気株式会社 プリント配線板の接続方法
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JP2003100953A (ja) * 2001-06-29 2003-04-04 Hitachi Chem Co Ltd 接着部材
EP1516031B1 (en) * 2002-06-24 2007-08-15 3M Innovative Properties Company Heat curable adhesive composition, article, semiconductor apparatus and method
US6936644B2 (en) * 2002-10-16 2005-08-30 Cookson Electronics, Inc. Releasable microcapsule and adhesive curing system using the same
JP4152196B2 (ja) * 2003-01-10 2008-09-17 スリーエム イノベイティブ プロパティズ カンパニー 平面多導体の接続方法、該接続方法で接続される部分を含む電気電子部品、該接続方法で接続される平面多導体、および、平面多導体の接続システム
JP4714406B2 (ja) * 2003-03-03 2011-06-29 日立化成工業株式会社 半導体装置用ダイボンディング材及びこれを用いた半導体装置
JP2006140052A (ja) * 2004-11-12 2006-06-01 Three M Innovative Properties Co 熱硬化性接着フィルム付きコネクタ及びそれを用いた接続方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130114739A (ko) * 2011-02-25 2013-10-17 야자키 소교 가부시키가이샤 회로체 및 커넥터 구조
US9190748B2 (en) 2011-02-25 2015-11-17 Yazaki Corporation Connector structure

Also Published As

Publication number Publication date
JP2006245453A (ja) 2006-09-14
WO2006096631A1 (en) 2006-09-14
US20080156437A1 (en) 2008-07-03
CN101138135A (zh) 2008-03-05
EP1856770A1 (en) 2007-11-21
TW200638823A (en) 2006-11-01

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20070906

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid