KR20060099245A - 멀티 레이어 커패시터 내장형의 인쇄회로기판의 제조방법 - Google Patents
멀티 레이어 커패시터 내장형의 인쇄회로기판의 제조방법 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 130
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims abstract description 55
- 239000003990 capacitor Substances 0.000 claims abstract description 51
- 239000011889 copper foil Substances 0.000 claims abstract description 40
- 230000008569 process Effects 0.000 claims abstract description 40
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- 239000011888 foil Substances 0.000 claims description 20
- 238000009713 electroplating Methods 0.000 claims description 6
- 238000007772 electroless plating Methods 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 description 21
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- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 4
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- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Claims (6)
- 코어층을 형성하는 원판에 절연층을 형성하고 일면에 하부 전극층이 형성된 RCC를 적층하는 제 1 단계;상기 RCC의 상부 동박을 제거한 후에 내부 전극층을 형성하는 제 2 단계;상기 제 1 단계의 RCC를 적층하는 과정부터 제 2 단계를 수회 반복하여 유전층과 내부 전극층을 복수층으로 형성하는 제 3 단계; 및상기 유전층과 내부 전극층이 복수층 형성된 인쇄회로기판에 복수의 비아홀을 형성하고 홀의 내벽을 도금하여 내부 전극층간에 층간 도통을 제공하여 멀티 레이어 커패시터를 완성하는 제 4 단계를 포함하여 이루어진 멀티 레이어 커패시터를 내장한 인쇄회로기판의 제조방법.
- 제 1 항에 있어서,상기 제 2 단계는,상기 절연층에 적층된 RCC의 상부 동박을 제거하는 제 2-1 단계;상기 상부 동박이 제거된 RCC의 절연층 위에 무전해 도금을 하여 시드층을 형성하는 제 2-2 단계; 및상기 시드층위에 전해 도금하여 내부 전극층을 형성하는 제 2-3 단계를 포함하여 이루어진 멀티 레이어 커패시터를 내장한 인쇄회로기판의 제조방법.
- 제 2 항에 있어서,상기 제 2-3 단계의 내부 전극층은 0.1~5um인 것을 특징으로 하는 멀티 레이어 커패시터를 내장한 인쇄회로기판의 제조방법.
- 코어층을 형성하는 원판에 절연층을 형성하고 하부 전극층을 형성하는 제 1 단계;상기 하부 전극층위에 초박막 포일 캐리어를 이용하여 절연층과 내부 전극층을 형성하는 제 2 단계;상기 절연층과 내부 전극층이 형성된 인쇄회로기판에 비아홀을 가공하여 내부 전극층간에 층간 도통을 제공하는 제 3 단계; 및상기 제2 단계와 제 3 단계를 반복하여 복수의 절연층과 내부 전극층을 형성하여 멀티 레이어 커패시터를 형성하는 제 4 단계를 포함하여 이루어진 멀티 레이어 커패시터를 내장한 인쇄회로기판의 제조방법.
- 제 4 항에 있어서,상기 제 1 단계는,코어층을 형성하는 원판에 프리프레그를 적층하여 절연층을 형성하는 제 1-1 단계; 및상기 절연층 상에 포일을 적층한 후에 화상 형성 공정에 의해 하부 전극층을 형성하는 제 1-2 단계를 포함하여 이루어진 멀티 레이어 커패시터를 내장한 인쇄회로기판의 제조방법.
- 제 4 항에 있어서,상기 제 2 단계는상기 하부 전극층위에 초박막 포일 캐리어를 이용하여 절연층에 박막이 적층된 RCC를 적층하는 제 2-1 단계;상기 제 2-1 단계의 초박막 포일 캐리어에서 캐리어를 제거하여 상기 RCC의 박막을 노출시키는 제 2-2 단계; 및상기 제 2-2 단계의 박막에 화상형성공정에 의해 내부 전극층을 형성하는 제 2-3 단계를 포함하여 이루어진 멀티 레이어 커패시터를 내장한 인쇄회로기판의 제조방법.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050020572A KR100688743B1 (ko) | 2005-03-11 | 2005-03-11 | 멀티 레이어 커패시터 내장형의 인쇄회로기판의 제조방법 |
TW094145790A TWI305480B (en) | 2005-03-11 | 2005-12-22 | Method of fabricating printed circuit board having embedded multi-layer passive devices |
CNB2005101378263A CN100548089C (zh) | 2005-03-11 | 2005-12-31 | 具有嵌入式多层无源器件的印刷电路板的制造方法 |
US11/325,557 US7293356B2 (en) | 2005-03-11 | 2006-01-03 | Method of fabricating printed circuit board having embedded multi-layer passive devices |
JP2006017832A JP4288266B2 (ja) | 2005-03-11 | 2006-01-26 | 多層キャパシタ内蔵型のプリント基板の製造方法 |
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Application Number | Priority Date | Filing Date | Title |
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KR1020050020572A KR100688743B1 (ko) | 2005-03-11 | 2005-03-11 | 멀티 레이어 커패시터 내장형의 인쇄회로기판의 제조방법 |
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KR20060099245A true KR20060099245A (ko) | 2006-09-19 |
KR100688743B1 KR100688743B1 (ko) | 2007-03-02 |
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KR1020050020572A KR100688743B1 (ko) | 2005-03-11 | 2005-03-11 | 멀티 레이어 커패시터 내장형의 인쇄회로기판의 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7293356B2 (ko) |
JP (1) | JP4288266B2 (ko) |
KR (1) | KR100688743B1 (ko) |
CN (1) | CN100548089C (ko) |
TW (1) | TWI305480B (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100882266B1 (ko) * | 2007-11-07 | 2009-02-06 | 삼성전기주식회사 | 캐패시터 내장형 인쇄회로기판의 제조방법 |
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- 2005-12-31 CN CNB2005101378263A patent/CN100548089C/zh not_active Expired - Fee Related
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100882266B1 (ko) * | 2007-11-07 | 2009-02-06 | 삼성전기주식회사 | 캐패시터 내장형 인쇄회로기판의 제조방법 |
KR20160100352A (ko) * | 2014-02-21 | 2016-08-23 | 미쓰이금속광업주식회사 | 내장 캐패시터층 형성용 동장 적층판, 다층 프린트 배선판 및 다층 프린트 배선판의 제조 방법 |
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CN100548089C (zh) | 2009-10-07 |
US7293356B2 (en) | 2007-11-13 |
TWI305480B (en) | 2009-01-11 |
JP4288266B2 (ja) | 2009-07-01 |
CN1832664A (zh) | 2006-09-13 |
KR100688743B1 (ko) | 2007-03-02 |
US20060203456A1 (en) | 2006-09-14 |
TW200633614A (en) | 2006-09-16 |
JP2006253656A (ja) | 2006-09-21 |
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