KR20050084150A - 포지티브형 상 형성 가능 후막 조성물 - Google Patents
포지티브형 상 형성 가능 후막 조성물 Download PDFInfo
- Publication number
- KR20050084150A KR20050084150A KR1020057010117A KR20057010117A KR20050084150A KR 20050084150 A KR20050084150 A KR 20050084150A KR 1020057010117 A KR1020057010117 A KR 1020057010117A KR 20057010117 A KR20057010117 A KR 20057010117A KR 20050084150 A KR20050084150 A KR 20050084150A
- Authority
- KR
- South Korea
- Prior art keywords
- composition
- film
- acrylate
- patterned structure
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Electrodes For Cathode-Ray Tubes (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Discharge Lamps And Accessories Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43139202P | 2002-12-06 | 2002-12-06 | |
| US60/431,392 | 2002-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20050084150A true KR20050084150A (ko) | 2005-08-26 |
Family
ID=32507722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020057010117A Ceased KR20050084150A (ko) | 2002-12-06 | 2003-12-05 | 포지티브형 상 형성 가능 후막 조성물 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20040170925A1 (https=) |
| EP (1) | EP1567917A2 (https=) |
| JP (1) | JP2006510046A (https=) |
| KR (1) | KR20050084150A (https=) |
| CN (1) | CN1742233A (https=) |
| AU (1) | AU2003293441A1 (https=) |
| WO (1) | WO2004053593A2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101034346B1 (ko) * | 2006-12-22 | 2011-05-16 | 주식회사 엘지화학 | 탄소 나노 튜브를 통한 내열성 개선의 감광성 수지 조성물 |
| KR20150050530A (ko) * | 2012-08-31 | 2015-05-08 | 후지필름 가부시키가이샤 | 감광성 수지 조성물, 경화물과 그 제조 방법, 수지 패턴 제조 방법, 경화막, 액정 표시 장치, 유기 el 표시 장치, 및 터치 패널 표시 장치 |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003287660A1 (en) * | 2002-11-15 | 2004-06-15 | E.I. Du Pont De Nemours And Company | Process for using protective layers in the fabrication of electronic devices |
| GB0227902D0 (en) * | 2002-11-29 | 2003-01-08 | Ingenia Holdings Ltd | Template |
| WO2005052691A1 (ja) * | 2003-11-25 | 2005-06-09 | Murata Manufacturing Co., Ltd. | 厚膜パターンの形成方法、電子部品の製造方法、およびフォトリソグラフィー用感光性ペースト |
| US7402373B2 (en) * | 2004-02-05 | 2008-07-22 | E.I. Du Pont De Nemours And Company | UV radiation blocking protective layers compatible with thick film pastes |
| KR101042667B1 (ko) * | 2004-07-05 | 2011-06-20 | 주식회사 동진쎄미켐 | 포토레지스트 조성물 |
| KR20060090520A (ko) * | 2005-02-07 | 2006-08-11 | 삼성전자주식회사 | 감광성 수지 및 상기 감광성 수지로 이루어진 패턴을포함하는 박막 표시판 및 그 제조 방법 |
| US7247419B2 (en) | 2005-04-11 | 2007-07-24 | Az Electronic Materials Usa Corp. | Nanocomposite photosensitive composition and use thereof |
| US7524606B2 (en) * | 2005-04-11 | 2009-04-28 | Az Electronic Materials Usa Corp. | Nanocomposite photoresist composition for imaging thick films |
| JP4861767B2 (ja) | 2005-07-26 | 2012-01-25 | 富士フイルム株式会社 | ポジ型レジスト組成物およびそれを用いたパターン形成方法 |
| KR101166016B1 (ko) | 2006-04-26 | 2012-07-19 | 삼성에스디아이 주식회사 | 전자 방출원 형성용 조성물, 이로부터 제조된 전자 방출원및 상기 전자 방출원을 구비한 전자 방출 소자 |
| JP4751773B2 (ja) * | 2006-06-09 | 2011-08-17 | 太陽ホールディングス株式会社 | 光硬化性組成物及びそれを用いて形成した焼成物パターン |
| WO2008065827A1 (fr) * | 2006-11-28 | 2008-06-05 | Tokyo Ohka Kogyo Co., Ltd. | Composition de résine photosensible de type positif chimiquement amplifié pour film épais, film sec chimiquement amplifié pour film épais, et procédé de fabrication d'un motif de résine photosensible sur film épais |
| US8310069B2 (en) * | 2007-10-05 | 2012-11-13 | Texas Instruements Incorporated | Semiconductor package having marking layer |
| CN101861282A (zh) * | 2007-11-15 | 2010-10-13 | 纳幕尔杜邦公司 | 碳纳米管的保护 |
| US20110012035A1 (en) * | 2009-07-15 | 2011-01-20 | Texas Instruments Incorporated | Method for Precision Symbolization Using Digital Micromirror Device Technology |
| US20130189524A1 (en) * | 2012-01-19 | 2013-07-25 | Brewer Science Inc. | Viscous fugitive polymer-based carbon nanotube coatings |
| TW201421154A (zh) * | 2012-10-26 | 2014-06-01 | Fujifilm Corp | 感光性樹脂組成物、硬化物及其製造方法、樹脂圖案製造方法、硬化膜、有機el顯示裝置、液晶顯示裝置以及觸控面板顯示裝置 |
| WO2014150577A1 (en) | 2013-03-15 | 2014-09-25 | Sinovia Technologies | Photoactive transparent conductive films, method of making them and touch sensitive device comprising said films |
| JP6564196B2 (ja) * | 2014-03-20 | 2019-08-21 | 東京応化工業株式会社 | 厚膜用化学増幅型ポジ型感光性樹脂組成物 |
| US11097449B2 (en) | 2017-05-17 | 2021-08-24 | Formlabs, Inc. | Techniques for casting from additively fabricated molds and related systems and methods |
Family Cites Families (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5915394B2 (ja) * | 1978-08-31 | 1984-04-09 | 富士通株式会社 | 厚膜微細パタ−ン生成方法 |
| DD234196A3 (de) * | 1983-02-09 | 1986-03-26 | Ptnjj Npo Elektronpribor | Fotoempfindliche dielektrische mischung |
| JPS6232453A (ja) * | 1985-08-06 | 1987-02-12 | Tokyo Ohka Kogyo Co Ltd | ポジ型ホトレジスト用現像液 |
| US4939070A (en) * | 1986-07-28 | 1990-07-03 | Brunsvold William R | Thermally stable photoresists with high sensitivity |
| US5256836A (en) * | 1989-06-09 | 1993-10-26 | Toshiba Lighting & Technology Corporation | Thick film hybrid circuit board device and method of manufacturing the same |
| US4985332A (en) * | 1990-04-10 | 1991-01-15 | E. I. Du Pont De Nemours And Company | Resist material with carbazole diazonium salt acid generator and process for use |
| JP2670711B2 (ja) * | 1990-05-29 | 1997-10-29 | 富士写真フイルム株式会社 | ネガ型感光性樹脂組成物用現像液 |
| DE69130701T2 (de) * | 1990-10-29 | 1999-08-26 | Toyo Gosei Kogyo Co. Ltd. | Lichtempfindliches gefärbtes Harz, farbiges Bild, Verfahren zur Herstellung von Farbfiltern und Verfahren zur Herstellung einer Schwarzmatrix |
| US5164286A (en) * | 1991-02-01 | 1992-11-17 | Ocg Microelectronic Materials, Inc. | Photoresist developer containing fluorinated amphoteric surfactant |
| US6074893A (en) * | 1993-09-27 | 2000-06-13 | Sumitomo Metal Industries, Ltd. | Process for forming fine thick-film conductor patterns |
| NL9301908A (nl) * | 1993-11-04 | 1995-06-01 | Spiro Research Bv | Werkwijze en inrichting voor het ontluchten van een vloeistof in een in hoofdzaak gesloten vloeistofcirculatiesysteem. |
| US6060207A (en) * | 1994-07-11 | 2000-05-09 | Kabushiki Kaisha Toshiba | Photosensitive material |
| US5506090A (en) * | 1994-09-23 | 1996-04-09 | Minnesota Mining And Manufacturing Company | Process for making shoot and run printing plates |
| JPH08148787A (ja) * | 1994-11-21 | 1996-06-07 | Sumitomo Kinzoku Ceramics:Kk | 厚膜ペースト |
| US6107360A (en) * | 1995-09-29 | 2000-08-22 | Nippon Kayaku Kabushiki Kaisha | Active radiation ray curable, solar radiation blocking resin compositions and films coated therewith |
| US5879856A (en) * | 1995-12-05 | 1999-03-09 | Shipley Company, L.L.C. | Chemically amplified positive photoresists |
| US5942367A (en) * | 1996-04-24 | 1999-08-24 | Shin-Etsu Chemical Co., Ltd. | Chemically amplified positive resist composition, pattern forming method, and method for preparing polymer having a crosslinking group |
| JP3297324B2 (ja) * | 1996-10-30 | 2002-07-02 | 富士通株式会社 | レジスト組成物、レジストパターンの形成方法及び半導体装置の製造方法 |
| US6323361B1 (en) * | 1997-04-17 | 2001-11-27 | Corning Inc. | Photocurable halofluorinated acrylates |
| JPH10340666A (ja) * | 1997-06-09 | 1998-12-22 | Futaba Corp | 電界電子放出素子 |
| US6291129B1 (en) * | 1997-08-29 | 2001-09-18 | Kabushiki Kaisha Toshiba | Monomer, high molecular compound and photosensitive composition |
| US6399279B1 (en) * | 1998-01-16 | 2002-06-04 | Mitsubishi Chemical Corporation | Method for forming a positive image |
| KR100594768B1 (ko) * | 1998-03-12 | 2006-07-03 | 후지 샤신 필름 가부시기가이샤 | 포지티브 감광성 조성물 |
| KR100571313B1 (ko) * | 1998-03-17 | 2006-04-17 | 후지 샤신 필름 가부시기가이샤 | 포지티브 감광성 조성물 |
| DE69936995T2 (de) * | 1998-03-20 | 2008-05-21 | Nippon Soda Co. Ltd. | Photohärtbare zusammensetzung welche ein iodoniumsalz enthält |
| US6294270B1 (en) * | 1998-12-23 | 2001-09-25 | 3M Innovative Properties Company | Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| US6455234B1 (en) * | 1999-05-04 | 2002-09-24 | Air Products And Chemicals, Inc. | Acetylenic diol ethylene oxide/propylene oxide adducts and their use in photoresist developers |
| KR20010051350A (ko) * | 1999-11-01 | 2001-06-25 | 이시마루 기미오, 다께우찌 마사아끼 | 활성 입자, 감광성 수지 조성물 및 패턴 형성 방법 |
| US7449081B2 (en) * | 2000-06-21 | 2008-11-11 | E. I. Du Pont De Nemours And Company | Process for improving the emission of electron field emitters |
| US6534235B1 (en) * | 2000-10-31 | 2003-03-18 | Kansai Research Institute, Inc. | Photosensitive resin composition and process for forming pattern |
| TW583503B (en) * | 2000-12-01 | 2004-04-11 | Kansai Paint Co Ltd | Method of forming conductive pattern |
| JP3914386B2 (ja) * | 2000-12-28 | 2007-05-16 | 株式会社ルネサステクノロジ | フォトマスク、その製造方法、パターン形成方法および半導体装置の製造方法 |
| JP4317330B2 (ja) * | 2001-02-07 | 2009-08-19 | 富士フイルム株式会社 | 感光性平版印刷版の製版方法 |
| US6656667B2 (en) * | 2001-03-14 | 2003-12-02 | United Microelectronics Corp. | Multiple resist layer photolithographic process |
| US20020187438A1 (en) * | 2001-06-12 | 2002-12-12 | Ching-Yu Chang | Development method for manufacturing semiconductors |
| KR100592404B1 (ko) * | 2001-09-11 | 2006-06-22 | 다이켄카가쿠 코교 가부시키가이샤 | 회로기판을 포함하는 물체 표면에의 화상형성방법 |
| US20030070559A1 (en) * | 2001-10-15 | 2003-04-17 | Victor Robert J. | Vegetable and related food products steamer cooker |
| US20030073042A1 (en) * | 2001-10-17 | 2003-04-17 | Cernigliaro George J. | Process and materials for formation of patterned films of functional materials |
| KR100646793B1 (ko) * | 2001-11-13 | 2006-11-17 | 삼성전자주식회사 | 씬너 조성물 |
| JP2003195517A (ja) * | 2001-12-14 | 2003-07-09 | Shipley Co Llc | フォトレジスト用現像液 |
| JP2003195518A (ja) * | 2001-12-14 | 2003-07-09 | Shipley Co Llc | フォトレジスト用現像液 |
| US6900003B2 (en) * | 2002-04-12 | 2005-05-31 | Shipley Company, L.L.C. | Photoresist processing aid and method |
| US6769945B2 (en) * | 2002-08-24 | 2004-08-03 | Industrial Technology Research Institute | Method of growing isomeric carbon emitters onto triode structure of field emission display |
| US6798127B2 (en) * | 2002-10-09 | 2004-09-28 | Nano-Proprietary, Inc. | Enhanced field emission from carbon nanotubes mixed with particles |
| US20040140861A1 (en) * | 2002-11-15 | 2004-07-22 | Alvarez Robby L. | High temperature superconducting mini-filter resonator configuration with low sensitivity to variations in substrate thickness and resonator patterning |
| AU2003287660A1 (en) * | 2002-11-15 | 2004-06-15 | E.I. Du Pont De Nemours And Company | Process for using protective layers in the fabrication of electronic devices |
| EP1586112B1 (en) * | 2003-01-22 | 2006-12-27 | E.I. du Pont de Nemours and Company | Binder diffusion patterning of a thick film paste layer |
| JP4040544B2 (ja) * | 2003-06-27 | 2008-01-30 | 東京応化工業株式会社 | レジスト用現像液組成物およびレジストパターンの形成方法 |
| US7186498B2 (en) * | 2003-10-02 | 2007-03-06 | Willi-Kurt Gries | Alkaline developer for radiation sensitive compositions |
| US7125648B2 (en) * | 2003-12-19 | 2006-10-24 | Fuji Photo Film Co., Ltd. | Method for forming images |
| US7402373B2 (en) * | 2004-02-05 | 2008-07-22 | E.I. Du Pont De Nemours And Company | UV radiation blocking protective layers compatible with thick film pastes |
| CN1973247A (zh) * | 2004-05-27 | 2007-05-30 | 纳幕尔杜邦公司 | 光聚合物保护层的显影剂 |
-
2003
- 2003-12-04 US US10/728,210 patent/US20040170925A1/en not_active Abandoned
- 2003-12-05 AU AU2003293441A patent/AU2003293441A1/en not_active Abandoned
- 2003-12-05 WO PCT/US2003/038810 patent/WO2004053593A2/en not_active Ceased
- 2003-12-05 CN CNA2003801092354A patent/CN1742233A/zh active Pending
- 2003-12-05 EP EP03790390A patent/EP1567917A2/en not_active Withdrawn
- 2003-12-05 KR KR1020057010117A patent/KR20050084150A/ko not_active Ceased
- 2003-12-05 JP JP2004559365A patent/JP2006510046A/ja active Pending
-
2008
- 2008-03-05 US US12/042,772 patent/US20080166666A1/en not_active Abandoned
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101034346B1 (ko) * | 2006-12-22 | 2011-05-16 | 주식회사 엘지화학 | 탄소 나노 튜브를 통한 내열성 개선의 감광성 수지 조성물 |
| KR20150050530A (ko) * | 2012-08-31 | 2015-05-08 | 후지필름 가부시키가이샤 | 감광성 수지 조성물, 경화물과 그 제조 방법, 수지 패턴 제조 방법, 경화막, 액정 표시 장치, 유기 el 표시 장치, 및 터치 패널 표시 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003293441A8 (en) | 2004-06-30 |
| US20040170925A1 (en) | 2004-09-02 |
| WO2004053593A2 (en) | 2004-06-24 |
| WO2004053593A3 (en) | 2004-10-28 |
| AU2003293441A1 (en) | 2004-06-30 |
| CN1742233A (zh) | 2006-03-01 |
| JP2006510046A (ja) | 2006-03-23 |
| EP1567917A2 (en) | 2005-08-31 |
| US20080166666A1 (en) | 2008-07-10 |
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Legal Events
| Date | Code | Title | Description |
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| PA0105 | International application |
Patent event date: 20050603 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20080917 Comment text: Request for Examination of Application |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20100414 Patent event code: PE09021S01D |
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