JP2006510046A - ポジ画像形成性厚膜組成物 - Google Patents
ポジ画像形成性厚膜組成物 Download PDFInfo
- Publication number
- JP2006510046A JP2006510046A JP2004559365A JP2004559365A JP2006510046A JP 2006510046 A JP2006510046 A JP 2006510046A JP 2004559365 A JP2004559365 A JP 2004559365A JP 2004559365 A JP2004559365 A JP 2004559365A JP 2006510046 A JP2006510046 A JP 2006510046A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- film
- acrylate
- group
- patterned structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 claims abstract description 47
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 23
- 239000002245 particle Substances 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 36
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 24
- 239000002253 acid Substances 0.000 claims description 16
- 230000005855 radiation Effects 0.000 claims description 15
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 229920001577 copolymer Polymers 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052752 metalloid Inorganic materials 0.000 claims description 9
- 150000002738 metalloids Chemical class 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- 239000000178 monomer Substances 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 238000007650 screen-printing Methods 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 229920000058 polyacrylate Polymers 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000004528 spin coating Methods 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 4
- 229910052723 transition metal Inorganic materials 0.000 claims description 4
- 150000003624 transition metals Chemical class 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 238000002508 contact lithography Methods 0.000 claims description 3
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- MHSLHIWAHIILPI-UHFFFAOYSA-N 1-ethoxypropyl 4-ethenylbenzoate Chemical compound CCOC(CC)OC(=O)C1=CC=C(C=C)C=C1 MHSLHIWAHIILPI-UHFFFAOYSA-N 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- GRYPAHWNUAJRKU-UHFFFAOYSA-N oxan-2-yl 4-ethenylbenzoate Chemical compound C1=CC(C=C)=CC=C1C(=O)OC1OCCCC1 GRYPAHWNUAJRKU-UHFFFAOYSA-N 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 229910052716 thallium Inorganic materials 0.000 claims description 2
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 2
- 229910001887 tin oxide Inorganic materials 0.000 claims description 2
- OOHZIRUJZFRULE-UHFFFAOYSA-N 2,2-dimethylpropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)C OOHZIRUJZFRULE-UHFFFAOYSA-N 0.000 claims 1
- BYABXVLZJIJCEX-UHFFFAOYSA-N 3-bicyclo[1.1.1]pentanyl 2-methylprop-2-enoate Chemical compound C1C2CC1(OC(=O)C(=C)C)C2 BYABXVLZJIJCEX-UHFFFAOYSA-N 0.000 claims 1
- MNUIIOIZUIYJBF-UHFFFAOYSA-N 4-bicyclo[2.1.1]hexanyl 2-methylprop-2-enoate Chemical compound C1C2CC1(OC(=O)C(=C)C)CC2 MNUIIOIZUIYJBF-UHFFFAOYSA-N 0.000 claims 1
- FEZAQYCRLLDDBS-UHFFFAOYSA-N 4-bicyclo[2.2.1]heptanyl 2-methylprop-2-enoate Chemical compound C1CC2CCC1(OC(=O)C(=C)C)C2 FEZAQYCRLLDDBS-UHFFFAOYSA-N 0.000 claims 1
- JDOOLUPUWIMLMP-UHFFFAOYSA-N 4-bicyclo[2.2.2]octanyl 2-methylprop-2-enoate Chemical compound C1CC2CCC1(OC(=O)C(=C)C)CC2 JDOOLUPUWIMLMP-UHFFFAOYSA-N 0.000 claims 1
- DCTLJGWMHPGCOS-UHFFFAOYSA-N Osajin Chemical compound C1=2C=CC(C)(C)OC=2C(CC=C(C)C)=C(O)C(C2=O)=C1OC=C2C1=CC=C(O)C=C1 DCTLJGWMHPGCOS-UHFFFAOYSA-N 0.000 claims 1
- JRWBRQLLFYFUFO-UHFFFAOYSA-N [4-(1-butoxyethoxy)phenyl]methyl 2-methylprop-2-enoate Chemical compound CCCCOC(C)OC1=CC=C(COC(=O)C(C)=C)C=C1 JRWBRQLLFYFUFO-UHFFFAOYSA-N 0.000 claims 1
- VQDZSZYDIGQSIS-UHFFFAOYSA-N [4-(oxan-2-yloxy)phenyl]methyl 2-methylprop-2-enoate Chemical compound C1=CC(COC(=O)C(=C)C)=CC=C1OC1OCCCC1 VQDZSZYDIGQSIS-UHFFFAOYSA-N 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 238000005286 illumination Methods 0.000 claims 1
- QHGUPRQTQITEPO-UHFFFAOYSA-N oxan-2-yl 2-methylprop-2-enoate Chemical group CC(=C)C(=O)OC1CCCCO1 QHGUPRQTQITEPO-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000011236 particulate material Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 65
- 229920000642 polymer Polymers 0.000 description 20
- 239000000843 powder Substances 0.000 description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- -1 t-butoxyoxycarbonyl Chemical group 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- 239000000126 substance Substances 0.000 description 12
- 239000000243 solution Substances 0.000 description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 239000011230 binding agent Substances 0.000 description 7
- YISOXLVRWFDIKD-UHFFFAOYSA-N bismuth;borate Chemical compound [Bi+3].[O-]B([O-])[O-] YISOXLVRWFDIKD-UHFFFAOYSA-N 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- URQUNWYOBNUYJQ-UHFFFAOYSA-N diazonaphthoquinone Chemical compound C1=CC=C2C(=O)C(=[N]=[N])C=CC2=C1 URQUNWYOBNUYJQ-UHFFFAOYSA-N 0.000 description 6
- 238000010304 firing Methods 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000001856 Ethyl cellulose Substances 0.000 description 5
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 235000019325 ethyl cellulose Nutrition 0.000 description 5
- 229920001249 ethyl cellulose Polymers 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 230000003321 amplification Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000002086 nanomaterial Substances 0.000 description 4
- 238000003199 nucleic acid amplification method Methods 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 239000012776 electronic material Substances 0.000 description 3
- 125000004185 ester group Chemical group 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000002071 nanotube Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical compound OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 2
- QWJQFWNMZDAHNL-UHFFFAOYSA-N 3,4-diazabicyclo[3.2.2]non-3-ene Chemical compound C1CC2CCC1N=NC2 QWJQFWNMZDAHNL-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000008121 dextrose Substances 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 1
- OYJXODFXGXZFIF-UHFFFAOYSA-N (4Z)-4-diazopiperidine-2,3-dione Chemical compound [N-]=[N+]=C1CCNC(=O)C1=O OYJXODFXGXZFIF-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- KZVBBTZJMSWGTK-UHFFFAOYSA-N 1-[2-(2-butoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCCC KZVBBTZJMSWGTK-UHFFFAOYSA-N 0.000 description 1
- IIZPXYDJLKNOIY-JXPKJXOSSA-N 1-palmitoyl-2-arachidonoyl-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/CCCCC IIZPXYDJLKNOIY-JXPKJXOSSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- NAOAMSZZEPAPNP-UHFFFAOYSA-N 3-chlorosulfonyl-2-diazonio-4-oxo-3h-naphthalen-1-olate Chemical compound C1=CC=C2C(=O)C(=[N+]=[N-])C(S(=O)(=O)Cl)C(=O)C2=C1 NAOAMSZZEPAPNP-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 102100033806 Alpha-protein kinase 3 Human genes 0.000 description 1
- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 229920005372 Plexiglas® Polymers 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- APOOHNQQCBRJGA-UHFFFAOYSA-N [N-]=[N+]=C1NNC(=O)C1=O Chemical compound [N-]=[N+]=C1NNC(=O)C1=O APOOHNQQCBRJGA-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000005192 alkyl ethylene group Chemical group 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000008049 diazo compounds Chemical class 0.000 description 1
- XXTZHYXQVWRADW-UHFFFAOYSA-N diazomethanone Chemical compound [N]N=C=O XXTZHYXQVWRADW-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000000787 lecithin Substances 0.000 description 1
- 235000010445 lecithin Nutrition 0.000 description 1
- 229940067606 lecithin Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000010550 living polymerization reaction Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- JESXATFQYMPTNL-UHFFFAOYSA-N mono-hydroxyphenyl-ethylene Natural products OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000012934 organic peroxide initiator Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 230000002186 photoactivation Effects 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000006862 quantum yield reaction Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000000807 solvent casting Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- BPCBXWVRESTYBG-UHFFFAOYSA-N tert-butyl 3-phenylprop-2-eneperoxoate Chemical compound CC(C)(C)OOC(=O)C=CC1=CC=CC=C1 BPCBXWVRESTYBG-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000005931 tert-butyloxycarbonyl group Chemical group [H]C([H])([H])C(OC(*)=O)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000001412 tetrahydropyranyl group Chemical group 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Electrodes For Cathode-Ray Tubes (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Discharge Lamps And Accessories Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43139202P | 2002-12-06 | 2002-12-06 | |
| PCT/US2003/038810 WO2004053593A2 (en) | 2002-12-06 | 2003-12-05 | Positive imageable thick film compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006510046A true JP2006510046A (ja) | 2006-03-23 |
| JP2006510046A5 JP2006510046A5 (https=) | 2007-02-01 |
Family
ID=32507722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004559365A Pending JP2006510046A (ja) | 2002-12-06 | 2003-12-05 | ポジ画像形成性厚膜組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20040170925A1 (https=) |
| EP (1) | EP1567917A2 (https=) |
| JP (1) | JP2006510046A (https=) |
| KR (1) | KR20050084150A (https=) |
| CN (1) | CN1742233A (https=) |
| AU (1) | AU2003293441A1 (https=) |
| WO (1) | WO2004053593A2 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007526936A (ja) * | 2004-02-05 | 2007-09-20 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 厚膜ペーストと適合性のuv放射遮断保護層 |
| WO2014034768A1 (ja) * | 2012-08-31 | 2014-03-06 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、液晶表示装置、有機el表示装置、並びに、タッチパネル表示装置 |
| WO2014065351A1 (ja) * | 2012-10-26 | 2014-05-01 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、有機el表示装置、液晶表示装置、並びに、タッチパネル表示装置 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003287660A1 (en) * | 2002-11-15 | 2004-06-15 | E.I. Du Pont De Nemours And Company | Process for using protective layers in the fabrication of electronic devices |
| GB0227902D0 (en) * | 2002-11-29 | 2003-01-08 | Ingenia Holdings Ltd | Template |
| WO2005052691A1 (ja) * | 2003-11-25 | 2005-06-09 | Murata Manufacturing Co., Ltd. | 厚膜パターンの形成方法、電子部品の製造方法、およびフォトリソグラフィー用感光性ペースト |
| KR101042667B1 (ko) * | 2004-07-05 | 2011-06-20 | 주식회사 동진쎄미켐 | 포토레지스트 조성물 |
| KR20060090520A (ko) * | 2005-02-07 | 2006-08-11 | 삼성전자주식회사 | 감광성 수지 및 상기 감광성 수지로 이루어진 패턴을포함하는 박막 표시판 및 그 제조 방법 |
| US7247419B2 (en) | 2005-04-11 | 2007-07-24 | Az Electronic Materials Usa Corp. | Nanocomposite photosensitive composition and use thereof |
| US7524606B2 (en) * | 2005-04-11 | 2009-04-28 | Az Electronic Materials Usa Corp. | Nanocomposite photoresist composition for imaging thick films |
| JP4861767B2 (ja) | 2005-07-26 | 2012-01-25 | 富士フイルム株式会社 | ポジ型レジスト組成物およびそれを用いたパターン形成方法 |
| KR101166016B1 (ko) | 2006-04-26 | 2012-07-19 | 삼성에스디아이 주식회사 | 전자 방출원 형성용 조성물, 이로부터 제조된 전자 방출원및 상기 전자 방출원을 구비한 전자 방출 소자 |
| JP4751773B2 (ja) * | 2006-06-09 | 2011-08-17 | 太陽ホールディングス株式会社 | 光硬化性組成物及びそれを用いて形成した焼成物パターン |
| WO2008065827A1 (fr) * | 2006-11-28 | 2008-06-05 | Tokyo Ohka Kogyo Co., Ltd. | Composition de résine photosensible de type positif chimiquement amplifié pour film épais, film sec chimiquement amplifié pour film épais, et procédé de fabrication d'un motif de résine photosensible sur film épais |
| KR101034346B1 (ko) * | 2006-12-22 | 2011-05-16 | 주식회사 엘지화학 | 탄소 나노 튜브를 통한 내열성 개선의 감광성 수지 조성물 |
| US8310069B2 (en) * | 2007-10-05 | 2012-11-13 | Texas Instruements Incorporated | Semiconductor package having marking layer |
| CN101861282A (zh) * | 2007-11-15 | 2010-10-13 | 纳幕尔杜邦公司 | 碳纳米管的保护 |
| US20110012035A1 (en) * | 2009-07-15 | 2011-01-20 | Texas Instruments Incorporated | Method for Precision Symbolization Using Digital Micromirror Device Technology |
| US20130189524A1 (en) * | 2012-01-19 | 2013-07-25 | Brewer Science Inc. | Viscous fugitive polymer-based carbon nanotube coatings |
| WO2014150577A1 (en) | 2013-03-15 | 2014-09-25 | Sinovia Technologies | Photoactive transparent conductive films, method of making them and touch sensitive device comprising said films |
| JP6564196B2 (ja) * | 2014-03-20 | 2019-08-21 | 東京応化工業株式会社 | 厚膜用化学増幅型ポジ型感光性樹脂組成物 |
| US11097449B2 (en) | 2017-05-17 | 2021-08-24 | Formlabs, Inc. | Techniques for casting from additively fabricated molds and related systems and methods |
Family Cites Families (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5915394B2 (ja) * | 1978-08-31 | 1984-04-09 | 富士通株式会社 | 厚膜微細パタ−ン生成方法 |
| DD234196A3 (de) * | 1983-02-09 | 1986-03-26 | Ptnjj Npo Elektronpribor | Fotoempfindliche dielektrische mischung |
| JPS6232453A (ja) * | 1985-08-06 | 1987-02-12 | Tokyo Ohka Kogyo Co Ltd | ポジ型ホトレジスト用現像液 |
| US4939070A (en) * | 1986-07-28 | 1990-07-03 | Brunsvold William R | Thermally stable photoresists with high sensitivity |
| US5256836A (en) * | 1989-06-09 | 1993-10-26 | Toshiba Lighting & Technology Corporation | Thick film hybrid circuit board device and method of manufacturing the same |
| US4985332A (en) * | 1990-04-10 | 1991-01-15 | E. I. Du Pont De Nemours And Company | Resist material with carbazole diazonium salt acid generator and process for use |
| JP2670711B2 (ja) * | 1990-05-29 | 1997-10-29 | 富士写真フイルム株式会社 | ネガ型感光性樹脂組成物用現像液 |
| DE69130701T2 (de) * | 1990-10-29 | 1999-08-26 | Toyo Gosei Kogyo Co. Ltd. | Lichtempfindliches gefärbtes Harz, farbiges Bild, Verfahren zur Herstellung von Farbfiltern und Verfahren zur Herstellung einer Schwarzmatrix |
| US5164286A (en) * | 1991-02-01 | 1992-11-17 | Ocg Microelectronic Materials, Inc. | Photoresist developer containing fluorinated amphoteric surfactant |
| US6074893A (en) * | 1993-09-27 | 2000-06-13 | Sumitomo Metal Industries, Ltd. | Process for forming fine thick-film conductor patterns |
| NL9301908A (nl) * | 1993-11-04 | 1995-06-01 | Spiro Research Bv | Werkwijze en inrichting voor het ontluchten van een vloeistof in een in hoofdzaak gesloten vloeistofcirculatiesysteem. |
| US6060207A (en) * | 1994-07-11 | 2000-05-09 | Kabushiki Kaisha Toshiba | Photosensitive material |
| US5506090A (en) * | 1994-09-23 | 1996-04-09 | Minnesota Mining And Manufacturing Company | Process for making shoot and run printing plates |
| JPH08148787A (ja) * | 1994-11-21 | 1996-06-07 | Sumitomo Kinzoku Ceramics:Kk | 厚膜ペースト |
| US6107360A (en) * | 1995-09-29 | 2000-08-22 | Nippon Kayaku Kabushiki Kaisha | Active radiation ray curable, solar radiation blocking resin compositions and films coated therewith |
| US5879856A (en) * | 1995-12-05 | 1999-03-09 | Shipley Company, L.L.C. | Chemically amplified positive photoresists |
| US5942367A (en) * | 1996-04-24 | 1999-08-24 | Shin-Etsu Chemical Co., Ltd. | Chemically amplified positive resist composition, pattern forming method, and method for preparing polymer having a crosslinking group |
| JP3297324B2 (ja) * | 1996-10-30 | 2002-07-02 | 富士通株式会社 | レジスト組成物、レジストパターンの形成方法及び半導体装置の製造方法 |
| US6323361B1 (en) * | 1997-04-17 | 2001-11-27 | Corning Inc. | Photocurable halofluorinated acrylates |
| JPH10340666A (ja) * | 1997-06-09 | 1998-12-22 | Futaba Corp | 電界電子放出素子 |
| US6291129B1 (en) * | 1997-08-29 | 2001-09-18 | Kabushiki Kaisha Toshiba | Monomer, high molecular compound and photosensitive composition |
| US6399279B1 (en) * | 1998-01-16 | 2002-06-04 | Mitsubishi Chemical Corporation | Method for forming a positive image |
| KR100594768B1 (ko) * | 1998-03-12 | 2006-07-03 | 후지 샤신 필름 가부시기가이샤 | 포지티브 감광성 조성물 |
| KR100571313B1 (ko) * | 1998-03-17 | 2006-04-17 | 후지 샤신 필름 가부시기가이샤 | 포지티브 감광성 조성물 |
| DE69936995T2 (de) * | 1998-03-20 | 2008-05-21 | Nippon Soda Co. Ltd. | Photohärtbare zusammensetzung welche ein iodoniumsalz enthält |
| US6294270B1 (en) * | 1998-12-23 | 2001-09-25 | 3M Innovative Properties Company | Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| US6455234B1 (en) * | 1999-05-04 | 2002-09-24 | Air Products And Chemicals, Inc. | Acetylenic diol ethylene oxide/propylene oxide adducts and their use in photoresist developers |
| KR20010051350A (ko) * | 1999-11-01 | 2001-06-25 | 이시마루 기미오, 다께우찌 마사아끼 | 활성 입자, 감광성 수지 조성물 및 패턴 형성 방법 |
| US7449081B2 (en) * | 2000-06-21 | 2008-11-11 | E. I. Du Pont De Nemours And Company | Process for improving the emission of electron field emitters |
| US6534235B1 (en) * | 2000-10-31 | 2003-03-18 | Kansai Research Institute, Inc. | Photosensitive resin composition and process for forming pattern |
| TW583503B (en) * | 2000-12-01 | 2004-04-11 | Kansai Paint Co Ltd | Method of forming conductive pattern |
| JP3914386B2 (ja) * | 2000-12-28 | 2007-05-16 | 株式会社ルネサステクノロジ | フォトマスク、その製造方法、パターン形成方法および半導体装置の製造方法 |
| JP4317330B2 (ja) * | 2001-02-07 | 2009-08-19 | 富士フイルム株式会社 | 感光性平版印刷版の製版方法 |
| US6656667B2 (en) * | 2001-03-14 | 2003-12-02 | United Microelectronics Corp. | Multiple resist layer photolithographic process |
| US20020187438A1 (en) * | 2001-06-12 | 2002-12-12 | Ching-Yu Chang | Development method for manufacturing semiconductors |
| KR100592404B1 (ko) * | 2001-09-11 | 2006-06-22 | 다이켄카가쿠 코교 가부시키가이샤 | 회로기판을 포함하는 물체 표면에의 화상형성방법 |
| US20030070559A1 (en) * | 2001-10-15 | 2003-04-17 | Victor Robert J. | Vegetable and related food products steamer cooker |
| US20030073042A1 (en) * | 2001-10-17 | 2003-04-17 | Cernigliaro George J. | Process and materials for formation of patterned films of functional materials |
| KR100646793B1 (ko) * | 2001-11-13 | 2006-11-17 | 삼성전자주식회사 | 씬너 조성물 |
| JP2003195517A (ja) * | 2001-12-14 | 2003-07-09 | Shipley Co Llc | フォトレジスト用現像液 |
| JP2003195518A (ja) * | 2001-12-14 | 2003-07-09 | Shipley Co Llc | フォトレジスト用現像液 |
| US6900003B2 (en) * | 2002-04-12 | 2005-05-31 | Shipley Company, L.L.C. | Photoresist processing aid and method |
| US6769945B2 (en) * | 2002-08-24 | 2004-08-03 | Industrial Technology Research Institute | Method of growing isomeric carbon emitters onto triode structure of field emission display |
| US6798127B2 (en) * | 2002-10-09 | 2004-09-28 | Nano-Proprietary, Inc. | Enhanced field emission from carbon nanotubes mixed with particles |
| US20040140861A1 (en) * | 2002-11-15 | 2004-07-22 | Alvarez Robby L. | High temperature superconducting mini-filter resonator configuration with low sensitivity to variations in substrate thickness and resonator patterning |
| AU2003287660A1 (en) * | 2002-11-15 | 2004-06-15 | E.I. Du Pont De Nemours And Company | Process for using protective layers in the fabrication of electronic devices |
| EP1586112B1 (en) * | 2003-01-22 | 2006-12-27 | E.I. du Pont de Nemours and Company | Binder diffusion patterning of a thick film paste layer |
| JP4040544B2 (ja) * | 2003-06-27 | 2008-01-30 | 東京応化工業株式会社 | レジスト用現像液組成物およびレジストパターンの形成方法 |
| US7186498B2 (en) * | 2003-10-02 | 2007-03-06 | Willi-Kurt Gries | Alkaline developer for radiation sensitive compositions |
| US7125648B2 (en) * | 2003-12-19 | 2006-10-24 | Fuji Photo Film Co., Ltd. | Method for forming images |
| US7402373B2 (en) * | 2004-02-05 | 2008-07-22 | E.I. Du Pont De Nemours And Company | UV radiation blocking protective layers compatible with thick film pastes |
| CN1973247A (zh) * | 2004-05-27 | 2007-05-30 | 纳幕尔杜邦公司 | 光聚合物保护层的显影剂 |
-
2003
- 2003-12-04 US US10/728,210 patent/US20040170925A1/en not_active Abandoned
- 2003-12-05 AU AU2003293441A patent/AU2003293441A1/en not_active Abandoned
- 2003-12-05 WO PCT/US2003/038810 patent/WO2004053593A2/en not_active Ceased
- 2003-12-05 CN CNA2003801092354A patent/CN1742233A/zh active Pending
- 2003-12-05 EP EP03790390A patent/EP1567917A2/en not_active Withdrawn
- 2003-12-05 KR KR1020057010117A patent/KR20050084150A/ko not_active Ceased
- 2003-12-05 JP JP2004559365A patent/JP2006510046A/ja active Pending
-
2008
- 2008-03-05 US US12/042,772 patent/US20080166666A1/en not_active Abandoned
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007526936A (ja) * | 2004-02-05 | 2007-09-20 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 厚膜ペーストと適合性のuv放射遮断保護層 |
| WO2014034768A1 (ja) * | 2012-08-31 | 2014-03-06 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、液晶表示装置、有機el表示装置、並びに、タッチパネル表示装置 |
| JPWO2014034768A1 (ja) * | 2012-08-31 | 2016-08-08 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、液晶表示装置、有機el表示装置、並びに、タッチパネル表示装置 |
| TWI585522B (zh) * | 2012-08-31 | 2017-06-01 | 富士軟片股份有限公司 | 感光性樹脂組成物、硬化物及其製造方法、樹脂圖案的製造方法、硬化膜、液晶顯示裝置、有機el顯示裝置、以及觸控面板顯示裝置 |
| WO2014065351A1 (ja) * | 2012-10-26 | 2014-05-01 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、有機el表示装置、液晶表示装置、並びに、タッチパネル表示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003293441A8 (en) | 2004-06-30 |
| US20040170925A1 (en) | 2004-09-02 |
| KR20050084150A (ko) | 2005-08-26 |
| WO2004053593A2 (en) | 2004-06-24 |
| WO2004053593A3 (en) | 2004-10-28 |
| AU2003293441A1 (en) | 2004-06-30 |
| CN1742233A (zh) | 2006-03-01 |
| EP1567917A2 (en) | 2005-08-31 |
| US20080166666A1 (en) | 2008-07-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20080166666A1 (en) | Positive imageable thick film composition | |
| JP5003481B2 (ja) | 感光性組成物、ディスプレイ部材およびその製造方法 | |
| JP4692136B2 (ja) | 感光性ペースト組成物およびそれを用いたフィールドエミッションディスプレイ部材 | |
| JP4918352B2 (ja) | 厚いフィルムペースト層のポリマー拡散によるパターン化方法 | |
| JP2004247300A (ja) | フィールドエミッション型ディスプレイ装置用の電極形成組成物およびそのような組成物の使用方法 | |
| JP3405199B2 (ja) | 感光性導電ペースト | |
| JPH09110466A (ja) | 感光性絶縁ガラスペースト | |
| US20100252804A1 (en) | Cathode assembly containing an ultraviolet light-blocking dielectric layer | |
| JP2000016835A (ja) | ディスプレイ用絶縁ペースト | |
| CN102113080A (zh) | 用于场发射装置的可共加工的光成像银和碳纳米管组合物及方法 | |
| KR101176728B1 (ko) | 성능이 향상된 레지네이트 함유의 수성 현상가능하고 광이미지형성가능한 탄소 나노튜브 페이스트 | |
| JP3567606B2 (ja) | プラズマディスプレイの製造方法 | |
| JP2004206883A (ja) | プラズマディスプレイ及びプラズマディスプレイ用2層構造電極の製造方法 | |
| JPH10182185A (ja) | 感光性ガラスペースト | |
| JP2009175399A (ja) | 電子放出素子の絶縁層形成用感光性組成物 | |
| JP2000040462A (ja) | ディスプレイ用基板の製造方法 | |
| JP2004206884A (ja) | プラズマディスプレイ及びプラズマディスプレイ用2層構造電極の製造方法 | |
| JP2011508386A (ja) | 表面フィーチャーにおける厚膜ペーストのパターニング | |
| JPH11213876A (ja) | プラズマディスプレイの製造方法 | |
| JPH10208630A (ja) | プラズマディスプレイの製造方法 | |
| JP2009193679A (ja) | フラットパネルディスプレイ部材の製造方法。 | |
| JPH10214560A (ja) | プラズマディスプレイおよびその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061204 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061204 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20080303 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20081106 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20081106 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20081111 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090623 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20090917 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20090929 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20091022 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20091029 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20100202 |