KR20050031994A - 유전체 자기 조성물 및 전자 부품 - Google Patents
유전체 자기 조성물 및 전자 부품 Download PDFInfo
- Publication number
- KR20050031994A KR20050031994A KR1020040077840A KR20040077840A KR20050031994A KR 20050031994 A KR20050031994 A KR 20050031994A KR 1020040077840 A KR1020040077840 A KR 1020040077840A KR 20040077840 A KR20040077840 A KR 20040077840A KR 20050031994 A KR20050031994 A KR 20050031994A
- Authority
- KR
- South Korea
- Prior art keywords
- dielectric
- mol
- oxide
- dielectric layer
- multilayer ceramic
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 61
- 239000000919 ceramic Substances 0.000 title claims abstract description 39
- 239000003985 ceramic capacitor Substances 0.000 claims description 43
- 239000003990 capacitor Substances 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 12
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 11
- 239000013078 crystal Substances 0.000 claims description 9
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 230000002950 deficient Effects 0.000 abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 84
- 238000010304 firing Methods 0.000 description 28
- 239000012298 atmosphere Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 18
- 230000007547 defect Effects 0.000 description 17
- 239000007789 gas Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 13
- 238000000137 annealing Methods 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 239000011230 binding agent Substances 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 238000009413 insulation Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 7
- 239000003989 dielectric material Substances 0.000 description 7
- 230000002159 abnormal effect Effects 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000003981 vehicle Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 239000002003 electrode paste Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052755 nonmetal Inorganic materials 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- 239000008135 aqueous vehicle Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- 239000003232 water-soluble binding agent Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- -1 or various oxides Chemical class 0.000 description 1
- 150000003891 oxalate salts Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010405 reoxidation reaction Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Abstract
Description
Claims (8)
- 조성식{{Ba(1-x)Cax}O}A{Ti(1-y-z)ZryMgz} BO2(단, A, B, x, y, z가 0.995≤A/B≤1.020, 0.0001≤x≤0.07, 0.1≤y≤0.3, 0.0005≤z≤0.01)로 표시되는 주성분과,부성분으로서, 주성분 100몰에 대하여, Mn 산화물을 MnO 환산으로 0.03∼1.7몰과, Y 산화물을 Y2O3 환산으로 0.05∼0.5몰과, V 산화물을 V2O5 환산으로 0.007∼0.4몰과, Si 산화물을 SiO2 환산으로 0∼0.5몰을 함유하는 것을 특징으로 하는 유전체 자기 조성물.
- 제1항에 있어서, 부성분으로서, 또한, W 산화물을, 주성분 100몰에 대하여, WO3 환산으로 0.005∼0.3몰 함유하는 것을 특징으로 하는 유전체 자기 조성물.
- 제1항 또는 제2항 기재의 유전체 자기 조성물로 구성되어 있는 유전체층을 갖는 것을 특징으로 하는 전자 부품.
- 제1항 또는 제2항 기재의 유전체 자기 조성물로 구성되어 있는 유전체층과, 내부 전극층이 교대로 적층되어 있는 콘덴서 소자 본체를 갖는 것을 특징으로 하는 적층 세라믹 콘덴서.
- 제4항에 있어서, 상기 내부 전극층에 함유되는 도전재가 Ni 또는 Ni 합금인 것을 특징으로 하는 적층 세라믹 콘덴서.
- 제5항에 있어서, 상기 유전체층의 적층수가 50 이상인 것을 특징으로 하는 적층 세라믹 콘덴서.
- 제6항에 있어서, 상기 유전체층의 두께가 4.5㎛ 이하인 것을 특징으로 하는 적층 세라믹 콘덴서.
- 제7항에 있어서, 상기 유전체층을 구성하는 유전체 입자의 평균 결정 입자 직경(R)과, 상기 유전체층의 두께(d)와의 비(R/d)가 0.5<R/d<3인 것을 특징으로 하는 적층 세라믹 콘덴서.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003340577A JP2005104770A (ja) | 2003-09-30 | 2003-09-30 | 誘電体磁器組成物および電子部品 |
JPJP-P-2003-00340577 | 2003-09-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050031994A true KR20050031994A (ko) | 2005-04-06 |
KR100651019B1 KR100651019B1 (ko) | 2006-11-29 |
Family
ID=34309051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040077840A KR100651019B1 (ko) | 2003-09-30 | 2004-09-30 | 유전체 자기 조성물 및 전자 부품 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6995968B2 (ko) |
EP (1) | EP1520844A3 (ko) |
JP (1) | JP2005104770A (ko) |
KR (1) | KR100651019B1 (ko) |
CN (1) | CN100483577C (ko) |
TW (1) | TWI244098B (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4777605B2 (ja) * | 2003-05-21 | 2011-09-21 | 日本碍子株式会社 | 多層型圧電/電歪素子 |
JP2006005222A (ja) * | 2004-06-18 | 2006-01-05 | Tdk Corp | セラミック電子部品およびその製造方法 |
EP1767507B1 (en) * | 2004-07-08 | 2011-08-10 | Murata Manufacturing Co., Ltd. | Dielectric ceramic composition and laminated ceramic capacitor |
US7923395B2 (en) * | 2005-04-07 | 2011-04-12 | Kemet Electronics Corporation | C0G multi-layered ceramic capacitor |
US20060229188A1 (en) * | 2005-04-07 | 2006-10-12 | Randall Michael S | C0G multi-layered ceramic capacitor |
JP2007131476A (ja) * | 2005-11-09 | 2007-05-31 | Tdk Corp | 誘電体磁器組成物、電子部品および積層セラミックコンデンサ |
JP5046699B2 (ja) * | 2007-03-27 | 2012-10-10 | 京セラ株式会社 | 誘電体磁器および積層セラミックコンデンサ |
JP5272754B2 (ja) * | 2008-02-05 | 2013-08-28 | Tdk株式会社 | 誘電体磁器組成物および電子部品 |
JP2010226038A (ja) * | 2009-03-25 | 2010-10-07 | Tdk Corp | セラミック電子部品 |
KR101792368B1 (ko) * | 2015-12-24 | 2017-11-20 | 삼성전기주식회사 | 유전체 자기 조성물, 유전체 재료 및 이를 포함하는 적층 세라믹 커패시터 |
KR102166127B1 (ko) * | 2015-12-28 | 2020-10-15 | 삼성전기주식회사 | 유전체 조성물 및 이를 포함하는 적층 세라믹 커패시터 |
CN116097382A (zh) * | 2020-09-10 | 2023-05-09 | 基美电子公司 | 谐振多层陶瓷电容器 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3207847B2 (ja) | 1989-10-18 | 2001-09-10 | ティーディーケイ株式会社 | 積層型セラミックチップコンデンサ |
JP2787746B2 (ja) | 1992-03-27 | 1998-08-20 | ティーディーケイ株式会社 | 積層型セラミックチップコンデンサ |
US5319517A (en) * | 1992-03-27 | 1994-06-07 | Tdk Corporation | Multilayer ceramic chip capacitor |
JP3269903B2 (ja) | 1993-12-29 | 2002-04-02 | 太陽誘電株式会社 | 磁器コンデンサ及びその製造方法 |
KR0170577B1 (ko) * | 1994-12-19 | 1999-01-15 | 무라따 야스따까 | 유전체 자기 조성물 및 그것을 사용한 적층 세라믹 콘덴서 |
JPH09315861A (ja) | 1996-05-30 | 1997-12-09 | Kyocera Corp | 誘電体磁器組成物 |
JP3039417B2 (ja) * | 1997-02-07 | 2000-05-08 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP3370933B2 (ja) | 1998-05-01 | 2003-01-27 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
JP2001230148A (ja) | 2000-02-16 | 2001-08-24 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサとその製造方法 |
TW492017B (en) * | 2000-06-29 | 2002-06-21 | Tdk Corp | Dielectrics porcelain composition and electronic parts |
JP2002029835A (ja) | 2000-07-13 | 2002-01-29 | Matsushita Electric Ind Co Ltd | 誘電体磁器組成物とこれを用いた積層セラミックコンデンサとその製造方法 |
JP2002187770A (ja) * | 2000-12-15 | 2002-07-05 | Toho Titanium Co Ltd | 誘電体磁器組成物及びこれを用いた積層セラミックコンデンサ |
DE60232958D1 (de) * | 2001-04-12 | 2009-08-27 | Tdk Corp | Produktionsverfahren für ein keramisches elektronisches mehrschicht-bauteil |
JP4446324B2 (ja) | 2001-09-27 | 2010-04-07 | 株式会社村田製作所 | 誘電体磁器組成物及びそれを用いたコンデンサ |
KR100466072B1 (ko) * | 2002-05-24 | 2005-01-13 | 삼성전기주식회사 | 적층 세라믹 콘덴서용 유전체 조성물 및 이를 이용한 적층세라믹 콘덴서 |
KR100466073B1 (ko) * | 2002-05-24 | 2005-01-13 | 삼성전기주식회사 | 균일성 및 절연저항성이 증대된 유전체 조성물, 그제조방법 및 이를 이용한 적층 세라믹 콘덴서 |
-
2003
- 2003-09-30 JP JP2003340577A patent/JP2005104770A/ja active Pending
-
2004
- 2004-09-27 TW TW093129213A patent/TWI244098B/zh not_active IP Right Cessation
- 2004-09-29 US US10/951,941 patent/US6995968B2/en active Active
- 2004-09-30 EP EP04023367A patent/EP1520844A3/en not_active Withdrawn
- 2004-09-30 KR KR1020040077840A patent/KR100651019B1/ko active IP Right Grant
- 2004-09-30 CN CNB2004100874755A patent/CN100483577C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN100483577C (zh) | 2009-04-29 |
CN1604247A (zh) | 2005-04-06 |
JP2005104770A (ja) | 2005-04-21 |
EP1520844A3 (en) | 2009-04-29 |
US20050111163A1 (en) | 2005-05-26 |
KR100651019B1 (ko) | 2006-11-29 |
TWI244098B (en) | 2005-11-21 |
TW200522101A (en) | 2005-07-01 |
EP1520844A2 (en) | 2005-04-06 |
US6995968B2 (en) | 2006-02-07 |
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