KR20040105832A - 도전성 및 열전도성을 갖는 열경화성 접착 시트 - Google Patents

도전성 및 열전도성을 갖는 열경화성 접착 시트 Download PDF

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Publication number
KR20040105832A
KR20040105832A KR10-2004-7015601A KR20047015601A KR20040105832A KR 20040105832 A KR20040105832 A KR 20040105832A KR 20047015601 A KR20047015601 A KR 20047015601A KR 20040105832 A KR20040105832 A KR 20040105832A
Authority
KR
South Korea
Prior art keywords
adhesive sheet
ethylene
meth
thermosetting adhesive
adhesive
Prior art date
Application number
KR10-2004-7015601A
Other languages
English (en)
Korean (ko)
Inventor
마사아끼 다께다
아끼히꼬 미쯔이
고이찌로 가와떼
시게요시 이시이
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20040105832A publication Critical patent/KR20040105832A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
    • C08L93/04—Rosin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/26—Natural polymers, natural resins or derivatives thereof according to C08L1/00 - C08L5/00, C08L89/00, C08L93/00, C08L97/00 or C08L99/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
KR10-2004-7015601A 2002-04-02 2003-04-01 도전성 및 열전도성을 갖는 열경화성 접착 시트 KR20040105832A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002100200A JP2003292908A (ja) 2002-04-02 2002-04-02 導電性及び熱伝導性を有する熱硬化型接着シート
JPJP-P-2002-00100200 2002-04-02
PCT/US2003/009907 WO2003085733A1 (en) 2002-04-02 2003-04-01 Thermosetting adhesive sheet with electroconductive and thermoconductive properties

Publications (1)

Publication Number Publication Date
KR20040105832A true KR20040105832A (ko) 2004-12-16

Family

ID=28786231

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-7015601A KR20040105832A (ko) 2002-04-02 2003-04-01 도전성 및 열전도성을 갖는 열경화성 접착 시트

Country Status (6)

Country Link
EP (1) EP1490904A1 (zh)
JP (1) JP2003292908A (zh)
KR (1) KR20040105832A (zh)
CN (1) CN1653610A (zh)
AU (1) AU2003226175A1 (zh)
WO (1) WO2003085733A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011019132A1 (ko) * 2009-08-14 2011-02-17 중앙대학교 산학협력단 도전성 접착제, 이를 이용한 반도체의 실장방법 및 웨이퍼 레벨 패키지

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005217369A (ja) * 2004-02-02 2005-08-11 Three M Innovative Properties Co 発光ダイオード装置用接着シート及び発光ダイオード装置
US20060118601A1 (en) * 2004-12-06 2006-06-08 Brandenburg Scott D Epoxy-solder thermally conductive structure for an integrated circuit
CN101448862B (zh) * 2006-06-02 2011-12-14 昭和电工株式会社 感光性树脂及感光性树脂组合物
JP5297418B2 (ja) * 2010-06-21 2013-09-25 デクセリアルズ株式会社 異方性導電材料及びその製造方法、並びに実装体及びその製造方法
CN102002325B (zh) * 2010-12-10 2013-08-21 浙江华正新材料股份有限公司 一种绝缘粘结片的制造方法
CN111440564A (zh) * 2020-03-25 2020-07-24 无锡睿穗电子材料科技有限公司 一种兼具导热和导电性能的热固型材料及其制作方法
CN111394017A (zh) * 2020-04-24 2020-07-10 无锡睿穗电子材料科技有限公司 一种具有高导热率和导电性的热固型粘合材料

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4606962A (en) * 1983-06-13 1986-08-19 Minnesota Mining And Manufacturing Company Electrically and thermally conductive adhesive transfer tape
EP0537965B1 (en) * 1991-10-12 1997-03-05 Sumitomo Special Metals Company Limited Process of manufacturing a heat-conductive material
US5275856A (en) * 1991-11-12 1994-01-04 Minnesota Mining And Manufacturing Company Electrically conductive adhesive web
JP2001107009A (ja) * 1999-09-30 2001-04-17 Three M Innovative Properties Co 熱硬化性接着剤組成物及びそれを用いた接着構造
JP3830726B2 (ja) * 2000-04-26 2006-10-11 松下電器産業株式会社 熱伝導基板とその製造方法およびパワーモジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011019132A1 (ko) * 2009-08-14 2011-02-17 중앙대학교 산학협력단 도전성 접착제, 이를 이용한 반도체의 실장방법 및 웨이퍼 레벨 패키지

Also Published As

Publication number Publication date
JP2003292908A (ja) 2003-10-15
EP1490904A1 (en) 2004-12-29
AU2003226175A1 (en) 2003-10-20
CN1653610A (zh) 2005-08-10
WO2003085733A1 (en) 2003-10-16

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