KR20040080986A - 패턴 형성 방법 및 패턴 형성 장치, 디바이스의 제조방법, 도전막 배선, 전기 광학 장치, 및 전자 기기 - Google Patents
패턴 형성 방법 및 패턴 형성 장치, 디바이스의 제조방법, 도전막 배선, 전기 광학 장치, 및 전자 기기 Download PDFInfo
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- KR20040080986A KR20040080986A KR1020040014204A KR20040014204A KR20040080986A KR 20040080986 A KR20040080986 A KR 20040080986A KR 1020040014204 A KR1020040014204 A KR 1020040014204A KR 20040014204 A KR20040014204 A KR 20040014204A KR 20040080986 A KR20040080986 A KR 20040080986A
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2217/00—Gas-filled discharge tubes
- H01J2217/38—Cold-cathode tubes
- H01J2217/49—Display panels, e.g. not making use of alternating current
- H01J2217/492—Details
- H01J2217/49207—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electroluminescent Light Sources (AREA)
- Coating Apparatus (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Manufacturing Of Electric Cables (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Claims (13)
- 액체 재료의 액적을 기판 상에 배치함에 의해 막패턴을 형성하는 패턴 형성 방법으로서,상기 액적에 의해 상기 기판 상에 상기 막패턴의 중앙부를 형성하는 제1 공정과,상기 형성된 중앙부에 대해서 한쪽 측부를 형성하는 제2 공정과,상기 형성된 중앙부에 대해서 다른쪽 측부를 형성하는 제3 공정을 갖는 것을 특징으로 하는 패턴 형성 방법.
- 제1항에 있어서,상기 기판 상에 형성된 상기 중앙부에 대해서 적어도 그 일부가 겹치도록 상기 액적을 배치하여 상기 측부를 형성하는 것을 특징으로 하는 패턴 형성 방법.
- 제1항 또는 제2항에 있어서,복수의 액적에 의해 상기 측부를 형성할 때,상기 기판 상에서 액적끼리 겹치지 않도록 복수의 액적을 배치하는 제1 배치 공정과, 상기 제1 배치 공정에서 상기 기판 상에 배치된 복수의 액적끼리의 사이에 액적을 배치하는 제2 배치 공정을 갖는 것을 특징으로 하는 패턴 형성 방법.
- 제1항에 있어서,상기 제1, 제2, 및 제3 공정에서의 상기 액적의 배치 조건을 서로 다른 조건으로 설정하는 것을 특징으로 하는 패턴 형성 방법.
- 제4항에 있어서,상기 제1, 제2, 및 제3 공정에서의 상기 액적의 상기 기판 상에서의 배치 간격을 서로 다른 값으로 설정하는 것을 특징으로 하는 패턴 형성 방법.
- 제4항에 있어서,상기 제1, 제2, 및 제3 공정에서의 상기 액적의 체적을 서로 다른 값으로 설정하는 것을 특징으로 하는 패턴 형성 방법.
- 제1항에 있어서,상기 기판 상에 상기 액적을 배치하기 전에 상기 기판 표면의 발액성(撥液性)을 조정하는 표면 처리 공정을 갖는 것을 특징으로 하는 패턴 형성 방법.
- 제1항에 있어서,상기 액체 재료는 도전성 미립자를 포함하는 액상체인 것을 특징으로 하는 패턴 형성 방법.
- 액체 재료의 액적을 기판 상에 배치하는 액적 토출 장치를 구비하고, 상기 액적에 의해 막패턴을 형성하는 패턴 형성 장치로서,상기 액적 토출 장치는, 상기 액적에 의해 상기 기판 상에 상기 막패턴의 중앙부를 형성한 뒤, 상기 기판 상에 형성된 중앙부에 대해서 한쪽 및 다른쪽의 측부를 형성하는 것을 특징으로 하는 패턴 형성 장치.
- 배선 패턴을 갖는 디바이스의 제조 방법에 있어서,액체 재료의 액적을 기판 상에 배치하는 재료 배치 공정을 갖고,상기 재료 배치 공정은, 상기 액적에 의해 상기 기판 상에 상기 배선 패턴의 중앙부를 형성하는 제1 공정과,상기 형성된 중앙부에 대해서 한쪽 측부를 형성하는 제2 공정과,상기 형성된 중앙부에 대해서 다른쪽 측부를 형성하는 제3 공정을 갖는 것을 특징으로 하는 디바이스의 제조 방법.
- 제9항 기재의 패턴 형성 장치에 의해 형성된 것을 특징으로 하는 도전막 배선.
- 제11항 기재의 도전막 배선을 구비하는 것을 특징으로 하는 전기 광학 장치.
- 제12항 기재의 전기 광학 장치를 구비하는 것을 특징으로 하는 전자 기기.
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- 2004-03-03 KR KR1020040014204A patent/KR100592372B1/ko active IP Right Grant
- 2004-03-04 CN CNB2004100078356A patent/CN100508693C/zh not_active Expired - Fee Related
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Cited By (2)
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KR100726270B1 (ko) * | 2004-08-27 | 2007-06-11 | 세이코 엡슨 가부시키가이샤 | 배선 패턴 형성 방법 및 tft용 게이트 전극의 형성 방법 |
KR100978276B1 (ko) * | 2008-09-17 | 2010-08-26 | 삼성전기주식회사 | 복합 노즐 잉크젯 장치를 이용한 배선 인쇄 방법 |
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KR100592372B1 (ko) | 2006-06-22 |
US20040241586A1 (en) | 2004-12-02 |
CN100508693C (zh) | 2009-07-01 |
CN1531389A (zh) | 2004-09-22 |
TW200420210A (en) | 2004-10-01 |
JP3966293B2 (ja) | 2007-08-29 |
US7582333B2 (en) | 2009-09-01 |
TWI231164B (en) | 2005-04-11 |
JP2004290958A (ja) | 2004-10-21 |
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