KR20040072645A - 하이브리드 스택형 직접 회로 다이 소자들을 포함한재구성 가능 프로세서 모듈 - Google Patents

하이브리드 스택형 직접 회로 다이 소자들을 포함한재구성 가능 프로세서 모듈 Download PDF

Info

Publication number
KR20040072645A
KR20040072645A KR10-2004-7008724A KR20047008724A KR20040072645A KR 20040072645 A KR20040072645 A KR 20040072645A KR 20047008724 A KR20047008724 A KR 20047008724A KR 20040072645 A KR20040072645 A KR 20040072645A
Authority
KR
South Korea
Prior art keywords
integrated circuit
circuit die
die device
array
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR10-2004-7008724A
Other languages
English (en)
Korean (ko)
Inventor
존 엠. 후펜쌀
제임스 디. 구지
Original Assignee
아르보 컴퍼니 엘엘피
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=21753168&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20040072645(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 아르보 컴퍼니 엘엘피 filed Critical 아르보 컴퍼니 엘엘피
Publication of KR20040072645A publication Critical patent/KR20040072645A/ko
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • G06F15/76—Architectures of general purpose stored program computers
    • G06F15/78—Architectures of general purpose stored program computers comprising a single central processing unit
    • G06F15/7867—Architectures of general purpose stored program computers comprising a single central processing unit with reconfigurable architecture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B20/00—Read-only memory [ROM] devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/922—Active solid-state devices, e.g. transistors, solid-state diodes with means to prevent inspection of or tampering with an integrated circuit, e.g. "smart card", anti-tamper

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Microcomputers (AREA)
KR10-2004-7008724A 2001-12-05 2002-11-08 하이브리드 스택형 직접 회로 다이 소자들을 포함한재구성 가능 프로세서 모듈 Ceased KR20040072645A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/012,057 US6627985B2 (en) 2001-12-05 2001-12-05 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
US10/012,057 2001-12-05
PCT/US2002/035972 WO2003050694A1 (en) 2001-12-05 2002-11-08 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements

Publications (1)

Publication Number Publication Date
KR20040072645A true KR20040072645A (ko) 2004-08-18

Family

ID=21753168

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-7008724A Ceased KR20040072645A (ko) 2001-12-05 2002-11-08 하이브리드 스택형 직접 회로 다이 소자들을 포함한재구성 가능 프로세서 모듈

Country Status (7)

Country Link
US (3) US6627985B2 (enExample)
EP (1) EP1461715A4 (enExample)
JP (1) JP2005512229A (enExample)
KR (1) KR20040072645A (enExample)
AU (1) AU2002352582A1 (enExample)
CA (1) CA2467821C (enExample)
WO (1) WO2003050694A1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100883655B1 (ko) * 2006-12-04 2009-02-18 삼성전자주식회사 재구성 가능한 프로세서를 갖는 문맥 교환 시스템 및 방법
US8093717B2 (en) 2005-12-09 2012-01-10 Intel Corporation Microstrip spacer for stacked chip scale packages, methods of making same, methods of operating same, and systems containing same
KR20160073334A (ko) * 2014-12-16 2016-06-24 삼성전자주식회사 재설정 가능 논리 장치
KR20170016450A (ko) * 2014-06-23 2017-02-13 지글루, 인크. 모듈형 적층 집적 회로를 제조하기 위한 시스템 및 방법
US9753769B2 (en) 2013-01-28 2017-09-05 Samsung Electronics Co., Ltd. Apparatus and method for sharing function logic between functional units, and reconfigurable processor thereof
KR20230021147A (ko) * 2020-06-29 2023-02-13 아르보 컴퍼니 엘엘엘피 5g 프로세서 독립형 모뎀과 함께 3d 다이 스태킹 재구성 가능 프로세서 모듈을 사용하는 모바일 iot 에지 디바이스
US11797067B2 (en) 2019-04-23 2023-10-24 Arbor Company, Lllp Systems and methods for reconfiguring dual-function cell arrays

Families Citing this family (291)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9092595B2 (en) * 1997-10-08 2015-07-28 Pact Xpp Technologies Ag Multiprocessor having associated RAM units
US6856007B2 (en) 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US7030488B2 (en) * 2001-10-30 2006-04-18 Intel Corporation Packaged combination memory for electronic devices
US6627985B2 (en) * 2001-12-05 2003-09-30 Arbor Company Llp Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
US7126214B2 (en) * 2001-12-05 2006-10-24 Arbor Company Llp Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
US7649386B2 (en) * 2002-01-17 2010-01-19 Ozguz Volkan H Field programmable gate array utilizing dedicated memory stacks in a vertical layer format
US7082591B2 (en) * 2002-01-17 2006-07-25 Irvine Sensors Corporation Method for effectively embedding various integrated circuits within field programmable gate arrays
US6747478B2 (en) * 2002-07-08 2004-06-08 Viciciv Field programmable gate array with convertibility to application specific integrated circuit
US7673273B2 (en) 2002-07-08 2010-03-02 Tier Logic, Inc. MPGA products based on a prototype FPGA
US6992503B2 (en) 2002-07-08 2006-01-31 Viciciv Technology Programmable devices with convertibility to customizable devices
US7064579B2 (en) * 2002-07-08 2006-06-20 Viciciv Technology Alterable application specific integrated circuit (ASIC)
US7312109B2 (en) * 2002-07-08 2007-12-25 Viciciv, Inc. Methods for fabricating fuse programmable three dimensional integrated circuits
US7129744B2 (en) * 2003-10-23 2006-10-31 Viciciv Technology Programmable interconnect structures
US7112994B2 (en) * 2002-07-08 2006-09-26 Viciciv Technology Three dimensional integrated circuits
US7064018B2 (en) * 2002-07-08 2006-06-20 Viciciv Technology Methods for fabricating three dimensional integrated circuits
US20040004251A1 (en) * 2002-07-08 2004-01-08 Madurawe Raminda U. Insulated-gate field-effect thin film transistors
US7062744B2 (en) * 2002-09-04 2006-06-13 Osann Jr Robert Emulation solution for programmable instruction DSP
US7812458B2 (en) * 2007-11-19 2010-10-12 Tier Logic, Inc. Pad invariant FPGA and ASIC devices
US8643162B2 (en) 2007-11-19 2014-02-04 Raminda Udaya Madurawe Pads and pin-outs in three dimensional integrated circuits
US20040125093A1 (en) * 2002-12-30 2004-07-01 Serge Rutman Micro-controller with integrated light modulator
US6917219B2 (en) * 2003-03-12 2005-07-12 Xilinx, Inc. Multi-chip programmable logic device having configurable logic circuitry and configuration data storage on different dice
JP4419049B2 (ja) * 2003-04-21 2010-02-24 エルピーダメモリ株式会社 メモリモジュール及びメモリシステム
US6972480B2 (en) 2003-06-16 2005-12-06 Shellcase Ltd. Methods and apparatus for packaging integrated circuit devices
JP2007528120A (ja) 2003-07-03 2007-10-04 テッセラ テクノロジーズ ハンガリー コルラートルト フェレロェセーギュー タールシャシャーグ 集積回路装置をパッケージングする方法及び装置
JP2007516602A (ja) * 2003-09-26 2007-06-21 テッセラ，インコーポレイテッド 流動可能な伝導媒体を含むキャップ付きチップの製造構造および方法
US20050116344A1 (en) * 2003-10-29 2005-06-02 Tessera, Inc. Microelectronic element having trace formed after bond layer
US7030651B2 (en) 2003-12-04 2006-04-18 Viciciv Technology Programmable structured arrays
US7176713B2 (en) * 2004-01-05 2007-02-13 Viciciv Technology Integrated circuits with RAM and ROM fabrication options
DE102004001669B4 (de) * 2004-01-12 2008-06-05 Infineon Technologies Ag Konfigurierbares Logikbauelement ohne lokalen Konfigurationsspeicher mit parallelem Konfigurationsbus
JP4045506B2 (ja) * 2004-01-21 2008-02-13 セイコーエプソン株式会社 積層型半導体記憶装置
KR100564611B1 (ko) * 2004-02-14 2006-03-29 삼성전자주식회사 하드 디스크 드라이브의 완충 구조체
US6991947B1 (en) 2004-03-22 2006-01-31 Tushar Gheewala Hybrid semiconductor circuit with programmable intraconnectivity
US7038324B2 (en) * 2004-03-31 2006-05-02 Intel Corporation Wafer stacking using interconnect structures of substantially uniform height
EA200602046A1 (ru) * 2004-05-13 2007-06-29 Басф Акциенгезельшафт Фунгицидные смеси
US7489164B2 (en) * 2004-05-17 2009-02-10 Raminda Udaya Madurawe Multi-port memory devices
US7556775B2 (en) * 2004-05-25 2009-07-07 The United States Of America As Represented By The Secretary Of The Navy Microelectro-mechanical chemical sensor
US7299339B2 (en) * 2004-08-30 2007-11-20 The Boeing Company Super-reconfigurable fabric architecture (SURFA): a multi-FPGA parallel processing architecture for COTS hybrid computing framework
US7459772B2 (en) * 2004-09-29 2008-12-02 Actel Corporation Face-to-face bonded I/O circuit die and functional logic circuit die system
US7301242B2 (en) 2004-11-04 2007-11-27 Tabula, Inc. Programmable system in package
US7750669B2 (en) * 2005-01-06 2010-07-06 Justin Martin Spangaro Reprogrammable integrated circuit
US8201124B1 (en) 2005-03-15 2012-06-12 Tabula, Inc. System in package and method of creating system in package
US8143095B2 (en) 2005-03-22 2012-03-27 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
US20060225020A1 (en) * 2005-04-01 2006-10-05 Anantha Chandrakasan Methods and apparatus for 3-D FPGA design
US7382154B2 (en) * 2005-10-03 2008-06-03 Honeywell International Inc. Reconfigurable network on a chip
US7327159B1 (en) * 2005-11-28 2008-02-05 Lattice Semiconductor Corporation Interface block architectures
US20070138644A1 (en) * 2005-12-15 2007-06-21 Tessera, Inc. Structure and method of making capped chip having discrete article assembled into vertical interconnect
US7936062B2 (en) 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
US7486111B2 (en) * 2006-03-08 2009-02-03 Tier Logic, Inc. Programmable logic devices comprising time multiplexed programmable interconnect
US7714450B2 (en) * 2006-03-27 2010-05-11 Marvell International Technology Ltd. On-die bond wires system and method for enhancing routability of a redistribution layer
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
EP2191007B1 (en) 2007-04-20 2019-06-05 Becton, Dickinson and Company Hydrogel compositions
US7518398B1 (en) * 2007-10-04 2009-04-14 Xilinx, Inc. Integrated circuit with through-die via interface for die stacking
US8415783B1 (en) 2007-10-04 2013-04-09 Xilinx, Inc. Apparatus and methodology for testing stacked die
US7635988B2 (en) * 2007-11-19 2009-12-22 Tier Logic, Inc. Multi-port thin-film memory devices
US20090128189A1 (en) * 2007-11-19 2009-05-21 Raminda Udaya Madurawe Three dimensional programmable devices
US7573293B2 (en) * 2007-12-26 2009-08-11 Tier Logic, Inc. Programmable logic based latches and shift registers
US7573294B2 (en) * 2007-12-26 2009-08-11 Tier Logic, Inc. Programmable logic based latches and shift registers
US7602213B2 (en) * 2007-12-26 2009-10-13 Tier Logic, Inc. Using programmable latch to implement logic
US7795913B2 (en) * 2007-12-26 2010-09-14 Tier Logic Programmable latch based multiplier
US7777330B2 (en) * 2008-02-05 2010-08-17 Freescale Semiconductor, Inc. High bandwidth cache-to-processing unit communication in a multiple processor/cache system
US7973555B1 (en) 2008-05-28 2011-07-05 Xilinx, Inc. Configuration interface to stacked FPGA
US8230375B2 (en) 2008-09-14 2012-07-24 Raminda Udaya Madurawe Automated metal pattern generation for integrated circuits
US20100123477A1 (en) * 2008-11-20 2010-05-20 Shih-Wei Sun Programmable array module
US9577642B2 (en) * 2009-04-14 2017-02-21 Monolithic 3D Inc. Method to form a 3D semiconductor device
US8174841B2 (en) * 2009-04-27 2012-05-08 International Business Machines Corporation Adaptive interconnect structure
US8063654B2 (en) * 2009-07-17 2011-11-22 Xilinx, Inc. Apparatus and method for testing of stacked die structure
US11018133B2 (en) 2009-10-12 2021-05-25 Monolithic 3D Inc. 3D integrated circuit
US10366970B2 (en) 2009-10-12 2019-07-30 Monolithic 3D Inc. 3D semiconductor device and structure
US10910364B2 (en) 2009-10-12 2021-02-02 Monolitaic 3D Inc. 3D semiconductor device
US10388863B2 (en) 2009-10-12 2019-08-20 Monolithic 3D Inc. 3D memory device and structure
US11374118B2 (en) 2009-10-12 2022-06-28 Monolithic 3D Inc. Method to form a 3D integrated circuit
US10043781B2 (en) 2009-10-12 2018-08-07 Monolithic 3D Inc. 3D semiconductor device and structure
US12027518B1 (en) 2009-10-12 2024-07-02 Monolithic 3D Inc. 3D semiconductor devices and structures with metal layers
US10354995B2 (en) 2009-10-12 2019-07-16 Monolithic 3D Inc. Semiconductor memory device and structure
US10157909B2 (en) 2009-10-12 2018-12-18 Monolithic 3D Inc. 3D semiconductor device and structure
US11984445B2 (en) 2009-10-12 2024-05-14 Monolithic 3D Inc. 3D semiconductor devices and structures with metal layers
US8159060B2 (en) * 2009-10-29 2012-04-17 International Business Machines Corporation Hybrid bonding interface for 3-dimensional chip integration
US8315068B2 (en) * 2009-11-12 2012-11-20 International Business Machines Corporation Integrated circuit die stacks having initially identical dies personalized with fuses and methods of manufacturing the same
US10217667B2 (en) 2011-06-28 2019-02-26 Monolithic 3D Inc. 3D semiconductor device, fabrication method and system
US20140013129A1 (en) * 2012-07-09 2014-01-09 L. Pierre de Rochemont Hybrid computing module
US10497713B2 (en) 2010-11-18 2019-12-03 Monolithic 3D Inc. 3D semiconductor memory device and structure
US11482440B2 (en) 2010-12-16 2022-10-25 Monolithic 3D Inc. 3D semiconductor device and structure with a built-in test circuit for repairing faulty circuits
US12362219B2 (en) 2010-11-18 2025-07-15 Monolithic 3D Inc. 3D semiconductor memory device and structure
US11018191B1 (en) 2010-10-11 2021-05-25 Monolithic 3D Inc. 3D semiconductor device and structure
US11024673B1 (en) 2010-10-11 2021-06-01 Monolithic 3D Inc. 3D semiconductor device and structure
US10896931B1 (en) 2010-10-11 2021-01-19 Monolithic 3D Inc. 3D semiconductor device and structure
US11469271B2 (en) 2010-10-11 2022-10-11 Monolithic 3D Inc. Method to produce 3D semiconductor devices and structures with memory
US11315980B1 (en) 2010-10-11 2022-04-26 Monolithic 3D Inc. 3D semiconductor device and structure with transistors
US11257867B1 (en) 2010-10-11 2022-02-22 Monolithic 3D Inc. 3D semiconductor device and structure with oxide bonds
US10290682B2 (en) 2010-10-11 2019-05-14 Monolithic 3D Inc. 3D IC semiconductor device and structure with stacked memory
US11158674B2 (en) 2010-10-11 2021-10-26 Monolithic 3D Inc. Method to produce a 3D semiconductor device and structure
US11600667B1 (en) 2010-10-11 2023-03-07 Monolithic 3D Inc. Method to produce 3D semiconductor devices and structures with memory
US11227897B2 (en) 2010-10-11 2022-01-18 Monolithic 3D Inc. Method for producing a 3D semiconductor memory device and structure
US12094892B2 (en) 2010-10-13 2024-09-17 Monolithic 3D Inc. 3D micro display device and structure
US11694922B2 (en) 2010-10-13 2023-07-04 Monolithic 3D Inc. Multilevel semiconductor device and structure with oxide bonding
US11855100B2 (en) 2010-10-13 2023-12-26 Monolithic 3D Inc. Multilevel semiconductor device and structure with oxide bonding
US11164898B2 (en) 2010-10-13 2021-11-02 Monolithic 3D Inc. Multilevel semiconductor device and structure
US11327227B2 (en) 2010-10-13 2022-05-10 Monolithic 3D Inc. Multilevel semiconductor device and structure with electromagnetic modulators
US11133344B2 (en) 2010-10-13 2021-09-28 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors
US11163112B2 (en) 2010-10-13 2021-11-02 Monolithic 3D Inc. Multilevel semiconductor device and structure with electromagnetic modulators
US11043523B1 (en) 2010-10-13 2021-06-22 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors
US12360310B2 (en) 2010-10-13 2025-07-15 Monolithic 3D Inc. Multilevel semiconductor device and structure with oxide bonding
US11605663B2 (en) 2010-10-13 2023-03-14 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors and wafer bonding
US11437368B2 (en) 2010-10-13 2022-09-06 Monolithic 3D Inc. Multilevel semiconductor device and structure with oxide bonding
US11404466B2 (en) 2010-10-13 2022-08-02 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors
US10998374B1 (en) 2010-10-13 2021-05-04 Monolithic 3D Inc. Multilevel semiconductor device and structure
US11869915B2 (en) 2010-10-13 2024-01-09 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors and wafer bonding
US10679977B2 (en) 2010-10-13 2020-06-09 Monolithic 3D Inc. 3D microdisplay device and structure
US11063071B1 (en) 2010-10-13 2021-07-13 Monolithic 3D Inc. Multilevel semiconductor device and structure with waveguides
US12080743B2 (en) 2010-10-13 2024-09-03 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors and wafer bonding
US11929372B2 (en) 2010-10-13 2024-03-12 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors and wafer bonding
US11984438B2 (en) 2010-10-13 2024-05-14 Monolithic 3D Inc. Multilevel semiconductor device and structure with oxide bonding
US10978501B1 (en) 2010-10-13 2021-04-13 Monolithic 3D Inc. Multilevel semiconductor device and structure with waveguides
US11855114B2 (en) 2010-10-13 2023-12-26 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors and wafer bonding
US10943934B2 (en) 2010-10-13 2021-03-09 Monolithic 3D Inc. Multilevel semiconductor device and structure
US10833108B2 (en) 2010-10-13 2020-11-10 Monolithic 3D Inc. 3D microdisplay device and structure
US8159268B1 (en) 2010-11-16 2012-04-17 Raminda Udaya Madurawe Interconnect structures for metal configurable integrated circuits
US8159266B1 (en) 2010-11-16 2012-04-17 Raminda Udaya Madurawe Metal configurable integrated circuits
US8159265B1 (en) 2010-11-16 2012-04-17 Raminda Udaya Madurawe Memory for metal configurable integrated circuits
US11901210B2 (en) 2010-11-18 2024-02-13 Monolithic 3D Inc. 3D semiconductor device and structure with memory
US11804396B2 (en) 2010-11-18 2023-10-31 Monolithic 3D Inc. Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
US11107721B2 (en) 2010-11-18 2021-08-31 Monolithic 3D Inc. 3D semiconductor device and structure with NAND logic
US11615977B2 (en) 2010-11-18 2023-03-28 Monolithic 3D Inc. 3D semiconductor memory device and structure
US12068187B2 (en) 2010-11-18 2024-08-20 Monolithic 3D Inc. 3D semiconductor device and structure with bonding and DRAM memory cells
US11018042B1 (en) 2010-11-18 2021-05-25 Monolithic 3D Inc. 3D semiconductor memory device and structure
US11735462B2 (en) 2010-11-18 2023-08-22 Monolithic 3D Inc. 3D semiconductor device and structure with single-crystal layers
US12125737B1 (en) 2010-11-18 2024-10-22 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and memory cells
US11610802B2 (en) 2010-11-18 2023-03-21 Monolithic 3D Inc. Method for producing a 3D semiconductor device and structure with single crystal transistors and metal gate electrodes
US12136562B2 (en) 2010-11-18 2024-11-05 Monolithic 3D Inc. 3D semiconductor device and structure with single-crystal layers
US11211279B2 (en) 2010-11-18 2021-12-28 Monolithic 3D Inc. Method for processing a 3D integrated circuit and structure
US11031275B2 (en) 2010-11-18 2021-06-08 Monolithic 3D Inc. 3D semiconductor device and structure with memory
US11569117B2 (en) 2010-11-18 2023-01-31 Monolithic 3D Inc. 3D semiconductor device and structure with single-crystal layers
US12272586B2 (en) 2010-11-18 2025-04-08 Monolithic 3D Inc. 3D semiconductor memory device and structure with memory and metal layers
US11508605B2 (en) 2010-11-18 2022-11-22 Monolithic 3D Inc. 3D semiconductor memory device and structure
US12154817B1 (en) 2010-11-18 2024-11-26 Monolithic 3D Inc. Methods for producing a 3D semiconductor memory device and structure
US11784082B2 (en) 2010-11-18 2023-10-10 Monolithic 3D Inc. 3D semiconductor device and structure with bonding
US11482439B2 (en) 2010-11-18 2022-10-25 Monolithic 3D Inc. Methods for producing a 3D semiconductor memory device comprising charge trap junction-less transistors
US11854857B1 (en) 2010-11-18 2023-12-26 Monolithic 3D Inc. Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
US11121021B2 (en) 2010-11-18 2021-09-14 Monolithic 3D Inc. 3D semiconductor device and structure
US11521888B2 (en) 2010-11-18 2022-12-06 Monolithic 3D Inc. 3D semiconductor device and structure with high-k metal gate transistors
US11004719B1 (en) 2010-11-18 2021-05-11 Monolithic 3D Inc. Methods for producing a 3D semiconductor memory device and structure
US11862503B2 (en) 2010-11-18 2024-01-02 Monolithic 3D Inc. Method for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
US11164770B1 (en) 2010-11-18 2021-11-02 Monolithic 3D Inc. Method for producing a 3D semiconductor memory device and structure
US11355380B2 (en) 2010-11-18 2022-06-07 Monolithic 3D Inc. Methods for producing 3D semiconductor memory device and structure utilizing alignment marks
US11482438B2 (en) 2010-11-18 2022-10-25 Monolithic 3D Inc. Methods for producing a 3D semiconductor memory device and structure
US11443971B2 (en) 2010-11-18 2022-09-13 Monolithic 3D Inc. 3D semiconductor device and structure with memory
US11355381B2 (en) 2010-11-18 2022-06-07 Monolithic 3D Inc. 3D semiconductor memory device and structure
US11495484B2 (en) 2010-11-18 2022-11-08 Monolithic 3D Inc. 3D semiconductor devices and structures with at least two single-crystal layers
US11094576B1 (en) 2010-11-18 2021-08-17 Monolithic 3D Inc. Methods for producing a 3D semiconductor memory device and structure
US12144190B2 (en) 2010-11-18 2024-11-12 Monolithic 3D Inc. 3D semiconductor device and structure with bonding and memory cells preliminary class
US12100611B2 (en) 2010-11-18 2024-09-24 Monolithic 3D Inc. Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
US12033884B2 (en) 2010-11-18 2024-07-09 Monolithic 3D Inc. Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
US12243765B2 (en) 2010-11-18 2025-03-04 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and memory cells
US11923230B1 (en) 2010-11-18 2024-03-05 Monolithic 3D Inc. 3D semiconductor device and structure with bonding
US12463076B2 (en) 2010-12-16 2025-11-04 Monolithic 3D Inc. 3D semiconductor device and structure
TWI619230B (zh) 2011-01-14 2018-03-21 半導體能源研究所股份有限公司 半導體記憶裝置
US8519515B2 (en) 2011-04-13 2013-08-27 United Microlectronics Corp. TSV structure and method for forming the same
US8481425B2 (en) 2011-05-16 2013-07-09 United Microelectronics Corp. Method for fabricating through-silicon via structure
US8822336B2 (en) 2011-06-16 2014-09-02 United Microelectronics Corp. Through-silicon via forming method
US10388568B2 (en) 2011-06-28 2019-08-20 Monolithic 3D Inc. 3D semiconductor device and system
US8828745B2 (en) 2011-07-06 2014-09-09 United Microelectronics Corp. Method for manufacturing through-silicon via
US8716876B1 (en) * 2011-11-11 2014-05-06 Altera Corporation Systems and methods for stacking a memory chip above an integrated circuit chip
US20130157639A1 (en) * 2011-12-16 2013-06-20 SRC Computers, LLC Mobile electronic devices utilizing reconfigurable processing techniques to enable higher speed applications with lowered power consumption
US8518823B2 (en) 2011-12-23 2013-08-27 United Microelectronics Corp. Through silicon via and method of forming the same
US8609529B2 (en) 2012-02-01 2013-12-17 United Microelectronics Corp. Fabrication method and structure of through silicon via
US11476181B1 (en) 2012-04-09 2022-10-18 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11735501B1 (en) 2012-04-09 2023-08-22 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
US11164811B2 (en) 2012-04-09 2021-11-02 Monolithic 3D Inc. 3D semiconductor device with isolation layers and oxide-to-oxide bonding
US11694944B1 (en) 2012-04-09 2023-07-04 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
US11881443B2 (en) 2012-04-09 2024-01-23 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
US11616004B1 (en) 2012-04-09 2023-03-28 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
US11088050B2 (en) 2012-04-09 2021-08-10 Monolithic 3D Inc. 3D semiconductor device with isolation layers
US10600888B2 (en) 2012-04-09 2020-03-24 Monolithic 3D Inc. 3D semiconductor device
US11594473B2 (en) 2012-04-09 2023-02-28 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
US11410912B2 (en) 2012-04-09 2022-08-09 Monolithic 3D Inc. 3D semiconductor device with vias and isolation layers
US8691600B2 (en) 2012-05-02 2014-04-08 United Microelectronics Corp. Method for testing through-silicon-via (TSV) structures
US8691688B2 (en) 2012-06-18 2014-04-08 United Microelectronics Corp. Method of manufacturing semiconductor structure
US9275933B2 (en) 2012-06-19 2016-03-01 United Microelectronics Corp. Semiconductor device
US8900996B2 (en) 2012-06-21 2014-12-02 United Microelectronics Corp. Through silicon via structure and method of fabricating the same
US8525296B1 (en) 2012-06-26 2013-09-03 United Microelectronics Corp. Capacitor structure and method of forming the same
US8912844B2 (en) 2012-10-09 2014-12-16 United Microelectronics Corp. Semiconductor structure and method for reducing noise therein
US9098666B2 (en) 2012-11-28 2015-08-04 Qualcomm Incorporated Clock distribution network for 3D integrated circuit
US9064077B2 (en) * 2012-11-28 2015-06-23 Qualcomm Incorporated 3D floorplanning using 2D and 3D blocks
US9035457B2 (en) 2012-11-29 2015-05-19 United Microelectronics Corp. Substrate with integrated passive devices and method of manufacturing the same
US8716104B1 (en) 2012-12-20 2014-05-06 United Microelectronics Corp. Method of fabricating isolation structure
US11217565B2 (en) 2012-12-22 2022-01-04 Monolithic 3D Inc. Method to form a 3D semiconductor device and structure
US11916045B2 (en) 2012-12-22 2024-02-27 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11063024B1 (en) 2012-12-22 2021-07-13 Monlithic 3D Inc. Method to form a 3D semiconductor device and structure
US11961827B1 (en) 2012-12-22 2024-04-16 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US12051674B2 (en) 2012-12-22 2024-07-30 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11309292B2 (en) 2012-12-22 2022-04-19 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11967583B2 (en) 2012-12-22 2024-04-23 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11784169B2 (en) 2012-12-22 2023-10-10 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11018116B2 (en) 2012-12-22 2021-05-25 Monolithic 3D Inc. Method to form a 3D semiconductor device and structure
US10651054B2 (en) 2012-12-29 2020-05-12 Monolithic 3D Inc. 3D semiconductor device and structure
US11004694B1 (en) 2012-12-29 2021-05-11 Monolithic 3D Inc. 3D semiconductor device and structure
US12249538B2 (en) 2012-12-29 2025-03-11 Monolithic 3D Inc. 3D semiconductor device and structure including power distribution grids
US10892169B2 (en) 2012-12-29 2021-01-12 Monolithic 3D Inc. 3D semiconductor device and structure
US10600657B2 (en) 2012-12-29 2020-03-24 Monolithic 3D Inc 3D semiconductor device and structure
US11430667B2 (en) 2012-12-29 2022-08-30 Monolithic 3D Inc. 3D semiconductor device and structure with bonding
US11087995B1 (en) 2012-12-29 2021-08-10 Monolithic 3D Inc. 3D semiconductor device and structure
US10115663B2 (en) 2012-12-29 2018-10-30 Monolithic 3D Inc. 3D semiconductor device and structure
US10903089B1 (en) 2012-12-29 2021-01-26 Monolithic 3D Inc. 3D semiconductor device and structure
US11430668B2 (en) 2012-12-29 2022-08-30 Monolithic 3D Inc. 3D semiconductor device and structure with bonding
US11177140B2 (en) 2012-12-29 2021-11-16 Monolithic 3D Inc. 3D semiconductor device and structure
WO2014112082A1 (ja) * 2013-01-17 2014-07-24 富士通株式会社 プログラマブルロジック装置
US9536840B2 (en) 2013-02-12 2017-01-03 Qualcomm Incorporated Three-dimensional (3-D) integrated circuits (3DICS) with graphene shield, and related components and methods
US9041448B2 (en) 2013-03-05 2015-05-26 Qualcomm Incorporated Flip-flops in a monolithic three-dimensional (3D) integrated circuit (IC) (3DIC) and related methods
US9177890B2 (en) 2013-03-07 2015-11-03 Qualcomm Incorporated Monolithic three dimensional integration of semiconductor integrated circuits
US11869965B2 (en) 2013-03-11 2024-01-09 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and memory cells
US10325651B2 (en) 2013-03-11 2019-06-18 Monolithic 3D Inc. 3D semiconductor device with stacked memory
US11935949B1 (en) 2013-03-11 2024-03-19 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and memory cells
US8902663B1 (en) 2013-03-11 2014-12-02 Monolithic 3D Inc. Method of maintaining a memory state
US12094965B2 (en) 2013-03-11 2024-09-17 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and memory cells
US12100646B2 (en) 2013-03-12 2024-09-24 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11088130B2 (en) 2014-01-28 2021-08-10 Monolithic 3D Inc. 3D semiconductor device and structure
US10840239B2 (en) 2014-08-26 2020-11-17 Monolithic 3D Inc. 3D semiconductor device and structure
US11923374B2 (en) 2013-03-12 2024-03-05 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11398569B2 (en) 2013-03-12 2022-07-26 Monolithic 3D Inc. 3D semiconductor device and structure
US10224279B2 (en) 2013-03-15 2019-03-05 Monolithic 3D Inc. Semiconductor device and structure
US9171608B2 (en) 2013-03-15 2015-10-27 Qualcomm Incorporated Three-dimensional (3D) memory cell separation among 3D integrated circuit (IC) tiers, and related 3D integrated circuits (3DICS), 3DIC processor cores, and methods
US8884398B2 (en) 2013-04-01 2014-11-11 United Microelectronics Corp. Anti-fuse structure and programming method thereof
CN103207852B (zh) * 2013-04-03 2016-03-02 北京华清瑞达科技有限公司 多总线嵌入式处理装置
US11720736B2 (en) 2013-04-15 2023-08-08 Monolithic 3D Inc. Automation methods for 3D integrated circuits and devices
US9021414B1 (en) 2013-04-15 2015-04-28 Monolithic 3D Inc. Automation for monolithic 3D devices
US11574109B1 (en) 2013-04-15 2023-02-07 Monolithic 3D Inc Automation methods for 3D integrated circuits and devices
US11030371B2 (en) 2013-04-15 2021-06-08 Monolithic 3D Inc. Automation for monolithic 3D devices
US11487928B2 (en) 2013-04-15 2022-11-01 Monolithic 3D Inc. Automation for monolithic 3D devices
US11341309B1 (en) 2013-04-15 2022-05-24 Monolithic 3D Inc. Automation for monolithic 3D devices
US11270055B1 (en) 2013-04-15 2022-03-08 Monolithic 3D Inc. Automation for monolithic 3D devices
US9287173B2 (en) 2013-05-23 2016-03-15 United Microelectronics Corp. Through silicon via and process thereof
US9123730B2 (en) 2013-07-11 2015-09-01 United Microelectronics Corp. Semiconductor device having through silicon trench shielding structure surrounding RF circuit
US9024416B2 (en) 2013-08-12 2015-05-05 United Microelectronics Corp. Semiconductor structure
US8916471B1 (en) 2013-08-26 2014-12-23 United Microelectronics Corp. Method for forming semiconductor structure having through silicon via for signal and shielding structure
US9048223B2 (en) 2013-09-03 2015-06-02 United Microelectronics Corp. Package structure having silicon through vias connected to ground potential
US9117804B2 (en) 2013-09-13 2015-08-25 United Microelectronics Corporation Interposer structure and manufacturing method thereof
US9343359B2 (en) 2013-12-25 2016-05-17 United Microelectronics Corp. Integrated structure and method for fabricating the same
US11031394B1 (en) 2014-01-28 2021-06-08 Monolithic 3D Inc. 3D semiconductor device and structure
US12094829B2 (en) 2014-01-28 2024-09-17 Monolithic 3D Inc. 3D semiconductor device and structure
US11107808B1 (en) 2014-01-28 2021-08-31 Monolithic 3D Inc. 3D semiconductor device and structure
US10297586B2 (en) 2015-03-09 2019-05-21 Monolithic 3D Inc. Methods for processing a 3D semiconductor device
US10340203B2 (en) 2014-02-07 2019-07-02 United Microelectronics Corp. Semiconductor structure with through silicon via and method for fabricating and testing the same
US11011507B1 (en) 2015-04-19 2021-05-18 Monolithic 3D Inc. 3D semiconductor device and structure
US11056468B1 (en) 2015-04-19 2021-07-06 Monolithic 3D Inc. 3D semiconductor device and structure
US10381328B2 (en) 2015-04-19 2019-08-13 Monolithic 3D Inc. Semiconductor device and structure
US10825779B2 (en) 2015-04-19 2020-11-03 Monolithic 3D Inc. 3D semiconductor device and structure
US9886193B2 (en) 2015-05-15 2018-02-06 International Business Machines Corporation Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration
US11956952B2 (en) 2015-08-23 2024-04-09 Monolithic 3D Inc. Semiconductor memory device and structure
US11114427B2 (en) 2015-11-07 2021-09-07 Monolithic 3D Inc. 3D semiconductor processor and memory device and structure
US11937422B2 (en) 2015-11-07 2024-03-19 Monolithic 3D Inc. Semiconductor memory device and structure
US11978731B2 (en) 2015-09-21 2024-05-07 Monolithic 3D Inc. Method to produce a multi-level semiconductor memory device and structure
WO2017053329A1 (en) 2015-09-21 2017-03-30 Monolithic 3D Inc 3d semiconductor device and structure
US12250830B2 (en) 2015-09-21 2025-03-11 Monolithic 3D Inc. 3D semiconductor memory devices and structures
US12178055B2 (en) 2015-09-21 2024-12-24 Monolithic 3D Inc. 3D semiconductor memory devices and structures
US12477752B2 (en) 2015-09-21 2025-11-18 Monolithic 3D Inc. 3D semiconductor memory devices and structures
US12100658B2 (en) 2015-09-21 2024-09-24 Monolithic 3D Inc. Method to produce a 3D multilayer semiconductor device and structure
US10522225B1 (en) 2015-10-02 2019-12-31 Monolithic 3D Inc. Semiconductor device with non-volatile memory
US10847540B2 (en) 2015-10-24 2020-11-24 Monolithic 3D Inc. 3D semiconductor memory device and structure
US10418369B2 (en) 2015-10-24 2019-09-17 Monolithic 3D Inc. Multi-level semiconductor memory device and structure
US12035531B2 (en) 2015-10-24 2024-07-09 Monolithic 3D Inc. 3D semiconductor device and structure with logic and memory
US11114464B2 (en) 2015-10-24 2021-09-07 Monolithic 3D Inc. 3D semiconductor device and structure
US11991884B1 (en) 2015-10-24 2024-05-21 Monolithic 3D Inc. 3D semiconductor device and structure with logic and memory
US12120880B1 (en) 2015-10-24 2024-10-15 Monolithic 3D Inc. 3D semiconductor device and structure with logic and memory
US12219769B2 (en) 2015-10-24 2025-02-04 Monolithic 3D Inc. 3D semiconductor device and structure with logic and memory
US11296115B1 (en) 2015-10-24 2022-04-05 Monolithic 3D Inc. 3D semiconductor device and structure
US12016181B2 (en) 2015-10-24 2024-06-18 Monolithic 3D Inc. 3D semiconductor device and structure with logic and memory
US10580757B2 (en) 2016-10-07 2020-03-03 Xcelsis Corporation Face-to-face mounted IC dies with orthogonal top interconnect layers
US10580735B2 (en) 2016-10-07 2020-03-03 Xcelsis Corporation Stacked IC structure with system level wiring on multiple sides of the IC die
US10672663B2 (en) 2016-10-07 2020-06-02 Xcelsis Corporation 3D chip sharing power circuit
CN119028958A (zh) 2016-10-07 2024-11-26 艾克瑟尔西斯公司 直接键合原生互连件和有源基部管芯
US10719762B2 (en) 2017-08-03 2020-07-21 Xcelsis Corporation Three dimensional chip structure implementing machine trained network
US10672745B2 (en) 2016-10-07 2020-06-02 Xcelsis Corporation 3D processor
US11930648B1 (en) 2016-10-10 2024-03-12 Monolithic 3D Inc. 3D memory devices and structures with metal layers
US11329059B1 (en) 2016-10-10 2022-05-10 Monolithic 3D Inc. 3D memory devices and structures with thinned single crystal substrates
US11251149B2 (en) 2016-10-10 2022-02-15 Monolithic 3D Inc. 3D memory device and structure
US11812620B2 (en) 2016-10-10 2023-11-07 Monolithic 3D Inc. 3D DRAM memory devices and structures with control circuits
US11869591B2 (en) 2016-10-10 2024-01-09 Monolithic 3D Inc. 3D memory devices and structures with control circuits
US12225704B2 (en) 2016-10-10 2025-02-11 Monolithic 3D Inc. 3D memory devices and structures with memory arrays and metal layers
US11711928B2 (en) 2016-10-10 2023-07-25 Monolithic 3D Inc. 3D memory devices and structures with control circuits
US10601426B1 (en) * 2018-09-06 2020-03-24 Intel Corporation Programmable logic device with fine-grained disaggregation
US10673439B1 (en) * 2019-03-27 2020-06-02 Xilinx, Inc. Adaptive integrated programmable device platform
US11296106B2 (en) 2019-04-08 2022-04-05 Monolithic 3D Inc. 3D memory semiconductor devices and structures
US10892016B1 (en) 2019-04-08 2021-01-12 Monolithic 3D Inc. 3D memory semiconductor devices and structures
US11158652B1 (en) 2019-04-08 2021-10-26 Monolithic 3D Inc. 3D memory semiconductor devices and structures
US11018156B2 (en) 2019-04-08 2021-05-25 Monolithic 3D Inc. 3D memory semiconductor devices and structures
US11763864B2 (en) 2019-04-08 2023-09-19 Monolithic 3D Inc. 3D memory semiconductor devices and structures with bit-line pillars
CN114402271B (zh) * 2019-05-21 2023-06-09 乔木有限责任合伙公司 用于将电池与堆叠式集成电路管芯元件集成的系统和方法
US11580057B2 (en) 2019-10-28 2023-02-14 Xilinx, Inc. Subsystem for configuration, security, and management of an adaptive system
US12068257B1 (en) 2020-12-29 2024-08-20 Xilinx, Inc. Integrated circuit (IC) structure protection scheme
CN113722268B (zh) * 2021-09-02 2024-07-19 西安紫光国芯半导体有限公司 一种存算一体的堆叠芯片
US11901338B2 (en) 2021-10-29 2024-02-13 Xilinx, Inc. Interwafer connection structure for coupling wafers in a wafer stack

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995004402A1 (en) 1993-08-03 1995-02-09 Xilinx, Inc. Microprocessor-based fpga
JPH09503622A (ja) * 1993-09-30 1997-04-08 コピン・コーポレーシヨン 転写薄膜回路を使用した３次元プロセッサー
US5585675A (en) 1994-05-11 1996-12-17 Harris Corporation Semiconductor die packaging tub having angularly offset pad-to-pad via structure configured to allow three-dimensional stacking and electrical interconnections among multiple identical tubs
JPH08268189A (ja) 1995-03-30 1996-10-15 Mitsubishi Motors Corp 並走車両検知装置
US5838060A (en) * 1995-12-12 1998-11-17 Comer; Alan E. Stacked assemblies of semiconductor packages containing programmable interconnect
US5953588A (en) * 1996-12-21 1999-09-14 Irvine Sensors Corporation Stackable layers containing encapsulated IC chips
JPH10268189A (ja) 1997-03-28 1998-10-09 Asahi Glass Co Ltd 投射光学装置
JPH11168185A (ja) * 1997-12-03 1999-06-22 Rohm Co Ltd 積層基板体および半導体装置
US6072233A (en) 1998-05-04 2000-06-06 Micron Technology, Inc. Stackable ball grid array package
US6092174A (en) 1998-06-01 2000-07-18 Context, Inc. Dynamically reconfigurable distributed integrated circuit processor and method
US6313522B1 (en) * 1998-08-28 2001-11-06 Micron Technology, Inc. Semiconductor structure having stacked semiconductor devices
US6051887A (en) * 1998-08-28 2000-04-18 Medtronic, Inc. Semiconductor stacked device for implantable medical apparatus
JP3754221B2 (ja) 1999-03-05 2006-03-08 ローム株式会社 マルチチップ型半導体装置
US6449170B1 (en) * 2000-08-30 2002-09-10 Advanced Micro Devices, Inc. Integrated circuit package incorporating camouflaged programmable elements
US6451626B1 (en) 2001-07-27 2002-09-17 Charles W.C. Lin Three-dimensional stacked semiconductor package
US7126214B2 (en) * 2001-12-05 2006-10-24 Arbor Company Llp Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
US6627985B2 (en) * 2001-12-05 2003-09-30 Arbor Company Llp Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
US7082591B2 (en) * 2002-01-17 2006-07-25 Irvine Sensors Corporation Method for effectively embedding various integrated circuits within field programmable gate arrays
US7183643B2 (en) * 2003-11-04 2007-02-27 Tessera, Inc. Stacked packages and systems incorporating the same
US6991947B1 (en) * 2004-03-22 2006-01-31 Tushar Gheewala Hybrid semiconductor circuit with programmable intraconnectivity

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8093717B2 (en) 2005-12-09 2012-01-10 Intel Corporation Microstrip spacer for stacked chip scale packages, methods of making same, methods of operating same, and systems containing same
KR100883655B1 (ko) * 2006-12-04 2009-02-18 삼성전자주식회사 재구성 가능한 프로세서를 갖는 문맥 교환 시스템 및 방법
US9753769B2 (en) 2013-01-28 2017-09-05 Samsung Electronics Co., Ltd. Apparatus and method for sharing function logic between functional units, and reconfigurable processor thereof
KR20170016450A (ko) * 2014-06-23 2017-02-13 지글루, 인크. 모듈형 적층 집적 회로를 제조하기 위한 시스템 및 방법
KR20160073334A (ko) * 2014-12-16 2016-06-24 삼성전자주식회사 재설정 가능 논리 장치
US11797067B2 (en) 2019-04-23 2023-10-24 Arbor Company, Lllp Systems and methods for reconfiguring dual-function cell arrays
US12287687B2 (en) 2019-04-23 2025-04-29 Arbor Company, Lllp Systems and methods for integrating batteries to maintain volatile memories and protect the volatile memories from excessive temperatures
KR20230021147A (ko) * 2020-06-29 2023-02-13 아르보 컴퍼니 엘엘엘피 5g 프로세서 독립형 모뎀과 함께 3d 다이 스태킹 재구성 가능 프로세서 모듈을 사용하는 모바일 iot 에지 디바이스
US11895191B2 (en) 2020-06-29 2024-02-06 Arbor Company, Lllp Mobile IoT edge device using 3D-die stacking re-configurable processor module with 5G processor-independent modem
US12470628B2 (en) 2020-06-29 2025-11-11 Arbor Company, Lllp Mobile IoT edge device using 3D-die stacking re-configurable processor module with 5G processor-independent modem

Also Published As

Publication number Publication date
EP1461715A4 (en) 2007-08-01
EP1461715A1 (en) 2004-09-29
US6781226B2 (en) 2004-08-24
WO2003050694A1 (en) 2003-06-19
CA2467821A1 (en) 2003-06-19
US20040000705A1 (en) 2004-01-01
AU2002352582A1 (en) 2003-06-23
US6627985B2 (en) 2003-09-30
JP2005512229A (ja) 2005-04-28
USRE42035E1 (en) 2011-01-18
US20030102495A1 (en) 2003-06-05
CA2467821C (en) 2006-09-12

Similar Documents

Publication Publication Date Title
KR20040072645A (ko) 하이브리드 스택형 직접 회로 다이 소자들을 포함한재구성 가능 프로세서 모듈
US7282951B2 (en) Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
EP3506511B1 (en) Integrated circuit device with separate die for programmable fabric and programmable fabric support circuitry
US11764212B2 (en) Functional blocks implemented by integrated circuit
US8107311B2 (en) Software programmable multiple function integrated circuit module
US11139273B2 (en) Dynamically configurable multi-chip package
CN110046127B (zh) 用于查找计算人工智能加速器的装置及多芯片模块
US20100140750A1 (en) Parallel Plane Memory and Processor Coupling in a 3-D Micro-Architectural System
KR20160073334A (ko) 재설정 가능 논리 장치
JP2005512229A5 (enExample)
KR20210044855A (ko) 다차원 집적 회로와 집적 회로용 메모리 구조 및 이와 관련된 시스템들 및 방법들
CN216118778U (zh) 一种堆叠芯片
CN113626372A (zh) 一种存算一体的集成芯片
CN112148643A (zh) 模块化集成电路装置中的分布式i/o接口
JP3160227B2 (ja) 半導体集積回路およびシステム
JPH04112575A (ja) 半導体集積回路

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20040605

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20071108

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20090922

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20100108

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20090922

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I