JP2005512229A - 混成の積み重ねられた集積回路ダイ要素を含む再構成可能なプロセッサモジュール - Google Patents

混成の積み重ねられた集積回路ダイ要素を含む再構成可能なプロセッサモジュール Download PDF

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JP2005512229A
JP2005512229A JP2003551682A JP2003551682A JP2005512229A JP 2005512229 A JP2005512229 A JP 2005512229A JP 2003551682 A JP2003551682 A JP 2003551682A JP 2003551682 A JP2003551682 A JP 2003551682A JP 2005512229 A JP2005512229 A JP 2005512229A
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integrated circuit
circuit die
die element
array
module
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JP2005512229A5 (enExample
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ハッペンタール，ジョン・エム
グージー，ディ・ジェームス
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アーバー・カンパニー・リミテッド・ライアビリティ・パートナーシップ
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • G06F15/76—Architectures of general purpose stored program computers
    • G06F15/78—Architectures of general purpose stored program computers comprising a single central processing unit
    • G06F15/7867—Architectures of general purpose stored program computers comprising a single central processing unit with reconfigurable architecture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B20/00—Read-only memory [ROM] devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/922—Active solid-state devices, e.g. transistors, solid-state diodes with means to prevent inspection of or tampering with an integrated circuit, e.g. "smart card", anti-tamper

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Microcomputers (AREA)
JP2003551682A 2001-12-05 2002-11-08 混成の積み重ねられた集積回路ダイ要素を含む再構成可能なプロセッサモジュール Pending JP2005512229A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/012,057 US6627985B2 (en) 2001-12-05 2001-12-05 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
PCT/US2002/035972 WO2003050694A1 (en) 2001-12-05 2002-11-08 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements

Publications (2)

Publication Number Publication Date
JP2005512229A true JP2005512229A (ja) 2005-04-28
JP2005512229A5 JP2005512229A5 (enExample) 2008-10-02

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JP2003551682A Pending JP2005512229A (ja) 2001-12-05 2002-11-08 混成の積み重ねられた集積回路ダイ要素を含む再構成可能なプロセッサモジュール

Country Status (7)

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US (3) US6627985B2 (enExample)
EP (1) EP1461715A4 (enExample)
JP (1) JP2005512229A (enExample)
KR (1) KR20040072645A (enExample)
AU (1) AU2002352582A1 (enExample)
CA (1) CA2467821C (enExample)
WO (1) WO2003050694A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
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WO2014112082A1 (ja) * 2013-01-17 2014-07-24 富士通株式会社 プログラマブルロジック装置
JP2022531983A (ja) * 2019-05-21 2022-07-12 アーバー・カンパニー・エルエルエルピイ 積層集積回路ダイ素子と電池を集積するためのシステムおよび方法
JP2022554255A (ja) * 2019-10-28 2022-12-28 ザイリンクス インコーポレイテッド 適応システムの構成、セキュリティ、及び管理のためのサブシステム
JP2023531294A (ja) * 2020-06-29 2023-07-21 アーバー・カンパニー・エルエルエルピイ プロセッサ非依存５Ｇモデムを有する３Ｄダイ・スタッキングの再構成可能プロセッサ・モジュールを使用するモバイルＩｏＴエッジ・デバイス
US11797067B2 (en) 2019-04-23 2023-10-24 Arbor Company, Lllp Systems and methods for reconfiguring dual-function cell arrays
JP2023178501A (ja) * 2011-01-14 2023-12-14 株式会社半導体エネルギー研究所 半導体装置

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