KR20030003084A - 일렉트로 루미네센스 표시 장치의 제조 방법 - Google Patents
일렉트로 루미네센스 표시 장치의 제조 방법 Download PDFInfo
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- KR20030003084A KR20030003084A KR1020020036901A KR20020036901A KR20030003084A KR 20030003084 A KR20030003084 A KR 20030003084A KR 1020020036901 A KR1020020036901 A KR 1020020036901A KR 20020036901 A KR20020036901 A KR 20020036901A KR 20030003084 A KR20030003084 A KR 20030003084A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000005401 electroluminescence Methods 0.000 title claims description 88
- 239000000758 substrate Substances 0.000 claims abstract description 219
- 238000007789 sealing Methods 0.000 claims abstract description 133
- 239000011521 glass Substances 0.000 claims abstract description 68
- 229920005989 resin Polymers 0.000 claims abstract description 47
- 239000011347 resin Substances 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims description 33
- 230000008569 process Effects 0.000 claims description 17
- 239000002274 desiccant Substances 0.000 claims description 15
- 239000011159 matrix material Substances 0.000 claims description 10
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000012466 permeate Substances 0.000 claims description 4
- 238000004020 luminiscence type Methods 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 50
- 239000010408 film Substances 0.000 description 20
- 239000003990 capacitor Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- 230000006866 deterioration Effects 0.000 description 9
- 230000005525 hole transport Effects 0.000 description 9
- 239000011229 interlayer Substances 0.000 description 7
- 238000005304 joining Methods 0.000 description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229920005591 polysilicon Polymers 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000011651 chromium Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- VBVAVBCYMYWNOU-UHFFFAOYSA-N coumarin 6 Chemical compound C1=CC=C2SC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 VBVAVBCYMYWNOU-UHFFFAOYSA-N 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- HXWWMGJBPGRWRS-CMDGGOBGSA-N 4- -2-tert-butyl-6- -4h-pyran Chemical compound O1C(C(C)(C)C)=CC(=C(C#N)C#N)C=C1\C=C\C1=CC(C(CCN2CCC3(C)C)(C)C)=C2C3=C1 HXWWMGJBPGRWRS-CMDGGOBGSA-N 0.000 description 2
- UFVXQDWNSAGPHN-UHFFFAOYSA-K bis[(2-methylquinolin-8-yl)oxy]-(4-phenylphenoxy)alumane Chemical compound [Al+3].C1=CC=C([O-])C2=NC(C)=CC=C21.C1=CC=C([O-])C2=NC(C)=CC=C21.C1=CC([O-])=CC=C1C1=CC=CC=C1 UFVXQDWNSAGPHN-UHFFFAOYSA-K 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- YOZHUJDVYMRYDM-UHFFFAOYSA-N 4-(4-anilinophenyl)-3-naphthalen-1-yl-n-phenylaniline Chemical compound C=1C=C(C=2C(=CC(NC=3C=CC=CC=3)=CC=2)C=2C3=CC=CC=C3C=CC=2)C=CC=1NC1=CC=CC=C1 YOZHUJDVYMRYDM-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- HXWWMGJBPGRWRS-UHFFFAOYSA-N b2738 Chemical compound O1C(C(C)(C)C)=CC(=C(C#N)C#N)C=C1C=CC1=CC(C(CCN2CCC3(C)C)(C)C)=C2C3=C1 HXWWMGJBPGRWRS-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (10)
- 일렉트로 루미네센스 소자가 형성되고, 그 소자면의 이면이 표시면으로 되는 투명 소자 기판의 상기 소자면과 해당 소자면을 밀봉하는 밀봉 기판을 광에 의해 경화하는 시일 수지를 이용하여 접합하는 일렉트로 루미네센스 표시 장치의 제조 방법에 있어서,상기 밀봉 기판으로서 상기 광을 투과시킬 수 있는 부재를 이용함과 함께, 해당 밀봉 기판을 통해 상기 시일 수지에 상기 광을 조사함으로써 상기 밀봉 기판과 상기 투명 소자 기판의 소자면을 접합하는 것을 특징으로 하는 일렉트로 루미네센스 표시 장치의 제조 방법.
- 제1항에 있어서,상기 접합 시에는, 상기 밀봉 기판측을 고정하고, 해당 고정된 밀봉 기판측 방향에 대하여 상기 투명 기판측을 압압하는 것을 특징으로 하는 일렉트로 루미네센스 표시 장치의 제조 방법.
- 제1항 또는 제2항에 있어서,상기 밀봉 기판의 하방으로부터 상기 광을 조사하는 것을 특징으로 하는 일렉트로 루미네센스 표시 장치의 제조 방법.
- 제3항에 있어서,상기 접합에 앞서서, 상기 투명 소자 기판의 표시 영역을 둘러싸도록, 상기 밀봉 기판에 상기 시일 수지를 도포하는 것을 특징으로 하는 일렉트로 루미네센스 표시 장치의 제조 방법.
- 제3항에 있어서,상기 접합 시에, 상기 투명 소자 기판의 소자면에 대향하는 상기 밀봉 기판면에 건조제 충전용의 오목부를 형성함과 함께, 해당 오목부에 건조제를 사전에 도포해 두는 것을 특징으로 하는 일렉트로 루미네센스 표시 장치의 제조 방법.
- 제1항 또는 제2항에 있어서,상기 일렉트로 루미네센스 소자를 형성하는 공정으로부터 투명 소자 기판 및 밀봉 기판을 밀봉하는 공정까지, 상기 투명 소자 기판에서의 상기 밀봉 기판에 의해 밀봉되는 면을 수직 하방으로 하여 행하는 것을 특징으로 하는 일렉트로 루미네센스 표시 장치의 제조 방법.
- 제1항 또는 제2항에 있어서,상기 일렉트로 루미네센스 표시 장치가, 상기 투명 소자 기판의 표시 영역 밖에 각 일렉트로 루미네센스 소자를 직접 구동하는 구동 회로를 포함하는 단순 매트릭스 방식의 표시 장치인 것을 특징으로 하는 일렉트로 루미네센스 표시 장치의제조 방법.
- 제1항 또는 제2항에 있어서,상기 일렉트로 루미네센스 표시 장치가, 상기 투명 기판의 표시 영역에 각 일렉트로 루미네센스 소자를 구동하는 구동 소자를 포함함과 함께, 해당 표시 영역 밖에 이들 구동 소자를 구동하는 구동 회로를 포함하는 액티브 매트릭스 방식으로 구동되는 장치인 것을 특징으로 하는 일렉트로 루미네센스 표시 장치의 제조 방법.
- 제7항에 있어서,상기 구동 회로를 구성하는 트랜지스터로서, 톱 게이트 구조의 것을 이용하는 것을 특징으로 하는 일렉트로 루미네센스 표시 장치의 제조 방법.
- 제1항 또는 제2항에 있어서,상기 광으로서 자외광을 이용하고, 상기 밀봉 기판으로서 유리 기판 또는 투명 수지 기판을 이용하는 것을 특징으로 하는 일렉트로 루미네센스 표시 장치의 제조 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001198926A JP4614588B2 (ja) | 2001-06-29 | 2001-06-29 | エレクトロルミネッセンス表示装置の製造方法 |
JPJP-P-2001-00198926 | 2001-06-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030003084A true KR20030003084A (ko) | 2003-01-09 |
KR100512505B1 KR100512505B1 (ko) | 2005-09-07 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2002-0036901A KR100512505B1 (ko) | 2001-06-29 | 2002-06-28 | 일렉트로 루미네센스 표시 장치의 제조 방법 |
Country Status (5)
Country | Link |
---|---|
US (2) | US6890782B2 (ko) |
JP (1) | JP4614588B2 (ko) |
KR (1) | KR100512505B1 (ko) |
CN (1) | CN1214695C (ko) |
TW (1) | TWI285058B (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4614588B2 (ja) * | 2001-06-29 | 2011-01-19 | 三洋電機株式会社 | エレクトロルミネッセンス表示装置の製造方法 |
TW589915B (en) * | 2002-05-24 | 2004-06-01 | Sanyo Electric Co | Electroluminescence display device |
TWI352553B (en) * | 2002-12-26 | 2011-11-11 | Semiconductor Energy Lab | Light emitting device and a method for manufacturi |
JP2004296202A (ja) * | 2003-03-26 | 2004-10-21 | Tohoku Pioneer Corp | 有機elパネル及びその製造方法 |
US20040258957A1 (en) * | 2003-06-18 | 2004-12-23 | Pei-Chuan Yeh | Organic electroluminescent device and manufacturing method thereof |
US20050052342A1 (en) * | 2003-07-31 | 2005-03-10 | Ritdisplay Corporation | Dual display device |
US7402946B2 (en) * | 2003-11-28 | 2008-07-22 | Lg Display Co., Ltd. | Organic electroluminescence device with absorbent film and fabrication method thereof |
JP4378186B2 (ja) * | 2004-02-06 | 2009-12-02 | キヤノン株式会社 | 有機el素子アレイ |
US7211881B2 (en) * | 2004-03-24 | 2007-05-01 | Hewlett-Packard Development Company, L.P. | Structure for containing desiccant |
JP4393402B2 (ja) * | 2004-04-22 | 2010-01-06 | キヤノン株式会社 | 有機電子素子の製造方法および製造装置 |
CN100501808C (zh) * | 2004-07-02 | 2009-06-17 | 清华大学 | 双面发光二极管显示器 |
KR100711875B1 (ko) | 2005-07-29 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 제조용 석영 플레이트 지지장치 |
US7918705B2 (en) * | 2006-06-16 | 2011-04-05 | Lg Display Co., Ltd. | Organic light emitting device and method of fabricating the same |
JP5793302B2 (ja) | 2007-10-05 | 2015-10-14 | コーニング インコーポレイテッド | ガラスパッケージを封止する方法および装置 |
EP2404125A2 (de) * | 2009-10-05 | 2012-01-11 | Inova Lisec Technologiezentrum GmbH | Vakuumelement und verfahren zum herstellen desselben |
TW201114317A (en) * | 2009-10-07 | 2011-04-16 | Au Optronics Corp | Organic electro-luminescent device and packaging process thereof |
CN102690045A (zh) * | 2011-03-21 | 2012-09-26 | 上海微电子装备有限公司 | 封装装置及封装方法 |
CN103869519B (zh) * | 2012-12-13 | 2016-06-01 | 京东方科技集团股份有限公司 | 制造薄膜晶体管液晶显示器的方法 |
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-
2001
- 2001-06-29 JP JP2001198926A patent/JP4614588B2/ja not_active Expired - Lifetime
-
2002
- 2002-06-12 TW TW091112760A patent/TWI285058B/zh not_active IP Right Cessation
- 2002-06-28 CN CNB021251673A patent/CN1214695C/zh not_active Expired - Lifetime
- 2002-06-28 US US10/185,546 patent/US6890782B2/en not_active Expired - Lifetime
- 2002-06-28 KR KR10-2002-0036901A patent/KR100512505B1/ko active IP Right Grant
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2004
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Also Published As
Publication number | Publication date |
---|---|
CN1214695C (zh) | 2005-08-10 |
US6890782B2 (en) | 2005-05-10 |
US20040259455A1 (en) | 2004-12-23 |
US7074103B2 (en) | 2006-07-11 |
CN1395450A (zh) | 2003-02-05 |
JP2003017257A (ja) | 2003-01-17 |
JP4614588B2 (ja) | 2011-01-19 |
US20030020181A1 (en) | 2003-01-30 |
KR100512505B1 (ko) | 2005-09-07 |
TWI285058B (en) | 2007-08-01 |
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