KR20020071784A - 금속도포 적층판의 제조방법 - Google Patents
금속도포 적층판의 제조방법 Download PDFInfo
- Publication number
- KR20020071784A KR20020071784A KR1020020012164A KR20020012164A KR20020071784A KR 20020071784 A KR20020071784 A KR 20020071784A KR 1020020012164 A KR1020020012164 A KR 1020020012164A KR 20020012164 A KR20020012164 A KR 20020012164A KR 20020071784 A KR20020071784 A KR 20020071784A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- metal
- roll
- heat
- liquid crystal
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/06—Embossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/55—Liquid crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
열처리후의 필름의열치수변화율 (%) | 접착강도(Kg/㎝) | 적층체의 치수안정성 (%) | 외관 | ||
MD 방향 | TD 방향 | ||||
실시예 1 | 0.05 | 1.2±0.1 | -0.01 | +0.01 | O |
실시예 2 | 0.07 | 1.3±0.1 | +0.05 | -0.02 | O |
실시예 3 | 0.04 | 1.5±0.1 | -0.02 | +0.01 | △ |
실시예 4 | 0.10 | 1.2±0.1 | 0 | +0.01 | O |
실시예 5 | -0.05 | 1.2±0.1 | -0.03 | -0.05 | △ |
실시예 6 | 0.35 | 1.2±0.1 | +0.05 | +0.07 | △ |
비교예 1 | 1.2 | 1.2±0.5 | +0.10 | -0.05 | X |
비교예 2 | -2.0 | 0.7±0.7 | +0.25 | -0.20 | X |
Claims (6)
- 광학적 이방성의 용융상을 형성할 수 있는 열가소성 폴리머를 함유하는 필름을, 표면에 요철을 갖는 열처리롤 위에서 열처리한 후, 그 일면 이상에 금속시트를 접합시키는 것을 포함하는 금속도포 적층판의 연속 제조방법.
- 제 1 항에 있어서, 상기 요철을 갖는 열처리롤 위에서 열처리된 후의 필름의 200 ℃ 에서의 열치수변화율이 0.1 % 이하인, 금속도포 적층판의 제조방법.
- 제 1 항에 있어서, 상기 요철을 갖는 열처리롤 위에서 열처리된 후의 필름의 일면 이상에 금속시트를 연속적으로 열압착에 의해 접합시키는, 금속도포 적층판의 제조방법.
- 제 1 항에 있어서, 상기 필름을 표면에 요철을 갖는 열처리롤 위에서 실질적으로 무가압하에서 열처리하는, 금속도포 적층판의 제조방법.
- 제 1 항에 있어서, 열처리롤의 표면에 형성한 요철의 높이가 1 ㎛ 내지 15 ㎛ 인, 금속도포 적층판의 제조방법.
- 제 1 항에 있어서, 열처리롤의 온도가 상기 필름의 열변형온도보다 30 ℃ 낮은 온도에서부터 열변형온도까지의 범위내인, 금속도포 적층판의 제조방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2001-00063382 | 2001-03-07 | ||
JP2001063382 | 2001-03-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020071784A true KR20020071784A (ko) | 2002-09-13 |
KR100855925B1 KR100855925B1 (ko) | 2008-09-02 |
Family
ID=18922383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020020012164A KR100855925B1 (ko) | 2001-03-07 | 2002-03-07 | 금속도포 적층판의 제조방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7052574B2 (ko) |
EP (1) | EP1238800B1 (ko) |
KR (1) | KR100855925B1 (ko) |
CN (1) | CN1233521C (ko) |
DE (1) | DE60220107T2 (ko) |
TW (1) | TW528676B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180117659A (ko) * | 2016-03-03 | 2018-10-29 | 주식회사 쿠라레 | 금속 클래드 적층판 및 그 제조방법 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004358677A (ja) * | 2003-06-02 | 2004-12-24 | Nippon Steel Chem Co Ltd | 積層体の製造方法 |
JP3968068B2 (ja) * | 2003-09-30 | 2007-08-29 | 株式会社クラレ | 液晶ポリマーフィルムの製造方法 |
JP4718197B2 (ja) * | 2004-03-23 | 2011-07-06 | 宇部日東化成株式会社 | フレキシブル金属箔積層体製造装置と該装置を用いた製造方法 |
DE112005000716T5 (de) * | 2004-03-30 | 2007-02-15 | Noritsu Koki Co., Ltd. | Laminiergerät und Laminierverfahren |
CN101223835B (zh) * | 2005-07-27 | 2012-07-04 | 株式会社可乐丽 | 热塑性液晶聚合物薄膜覆盖的线路板的制造方法 |
US9145469B2 (en) | 2012-09-27 | 2015-09-29 | Ticona Llc | Aromatic polyester containing a biphenyl chain disruptor |
WO2016003588A1 (en) | 2014-07-01 | 2016-01-07 | Ticona Llc | Laser activatable polymer composition |
JP6316178B2 (ja) * | 2014-12-05 | 2018-04-25 | 株式会社クラレ | 片面金属張積層板およびその製造方法 |
JP6656231B2 (ja) * | 2015-04-20 | 2020-03-04 | 株式会社クラレ | 金属張積層板の製造方法およびこれを用いた金属張積層板 |
WO2017154811A1 (ja) * | 2016-03-08 | 2017-09-14 | 株式会社クラレ | 金属張積層板の製造方法および金属張積層板 |
CN109334202B (zh) * | 2018-11-05 | 2024-02-06 | 江苏坤泰机械有限公司 | 大宽幅墙体增强材料热熔复合机 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5410922B2 (ko) * | 1972-12-19 | 1979-05-10 | ||
CA1298451C (en) * | 1985-08-02 | 1992-04-07 | Hiromi Shigemoto | Surface-roughened film and sheet, and process for production and use thereof |
US4798875A (en) * | 1986-04-01 | 1989-01-17 | Toray Industries, Inc. | Biaxially oriented polyester film |
DE3884546T3 (de) | 1987-10-02 | 2000-03-23 | Polyplastics Co. Ltd., Osaka | Verfahren zur Oberflächenbehandlung von Gegenständen aus flüssigkristallinem Polyesterharz. |
JPH0630296Y2 (ja) * | 1987-11-30 | 1994-08-17 | 大日本スクリーン製造株式会社 | ロールコーティング装置 |
JP3245437B2 (ja) | 1991-04-05 | 2002-01-15 | 株式会社クラレ | 積層体の製造方法 |
JP3090706B2 (ja) * | 1991-04-08 | 2000-09-25 | 株式会社クラレ | 液晶高分子よりなるフィルムの製造方法 |
US5843562A (en) * | 1992-12-22 | 1998-12-01 | Hoechst Celanese Corporation | LCP films having roughened surface and process therefor |
EP0689927B1 (en) | 1994-06-30 | 2002-08-28 | Hoechst Celanese Corporation | LCP films having roughened surface and process therefor |
US5529740A (en) * | 1994-09-16 | 1996-06-25 | Jester; Randy D. | Process for treating liquid crystal polymer film |
US5719354A (en) * | 1994-09-16 | 1998-02-17 | Hoechst Celanese Corp. | Monolithic LCP polymer microelectronic wiring modules |
US5759674A (en) | 1995-03-31 | 1998-06-02 | Sumitomo Chemical Company, Limited | Laminate of liquid crystal polyester resin composition film and metallic foil, and printed-wiring board using the same |
US6159412A (en) * | 1996-09-11 | 2000-12-12 | Dupont Canada Inc. | Method for manufacture of liquid crystalline polymer films |
JP2000044797A (ja) * | 1998-04-06 | 2000-02-15 | Kuraray Co Ltd | 液晶ポリマ―フィルムと積層体及びそれらの製造方法並びに多層実装回路基板 |
CN1116164C (zh) * | 1998-04-09 | 2003-07-30 | 可乐丽股份有限公司 | 使用聚合物薄膜的涂层方法和由此得到的涂层体 |
JP4184529B2 (ja) | 1999-03-25 | 2008-11-19 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムとその改質方法 |
JP4216433B2 (ja) | 1999-03-29 | 2009-01-28 | 株式会社クラレ | 回路基板用金属張積層板の製造方法 |
-
2002
- 2002-03-05 TW TW091103985A patent/TW528676B/zh not_active IP Right Cessation
- 2002-03-06 US US10/090,747 patent/US7052574B2/en not_active Expired - Lifetime
- 2002-03-07 CN CNB021068631A patent/CN1233521C/zh not_active Expired - Lifetime
- 2002-03-07 EP EP02005223A patent/EP1238800B1/en not_active Expired - Lifetime
- 2002-03-07 KR KR1020020012164A patent/KR100855925B1/ko active IP Right Grant
- 2002-03-07 DE DE60220107T patent/DE60220107T2/de not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180117659A (ko) * | 2016-03-03 | 2018-10-29 | 주식회사 쿠라레 | 금속 클래드 적층판 및 그 제조방법 |
US11052638B2 (en) | 2016-03-03 | 2021-07-06 | Kuraray Co., Ltd. | Metal-clad laminate and manufacturing method for same |
Also Published As
Publication number | Publication date |
---|---|
EP1238800A3 (en) | 2003-12-03 |
EP1238800A2 (en) | 2002-09-11 |
US7052574B2 (en) | 2006-05-30 |
DE60220107T2 (de) | 2007-11-22 |
DE60220107D1 (de) | 2007-06-28 |
EP1238800B1 (en) | 2007-05-16 |
US20020170939A1 (en) | 2002-11-21 |
CN1374192A (zh) | 2002-10-16 |
CN1233521C (zh) | 2005-12-28 |
TW528676B (en) | 2003-04-21 |
KR100855925B1 (ko) | 2008-09-02 |
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