DE60220107D1 - Verfahren zur Herstellung eines Metalllaminats - Google Patents
Verfahren zur Herstellung eines MetalllaminatsInfo
- Publication number
- DE60220107D1 DE60220107D1 DE60220107T DE60220107T DE60220107D1 DE 60220107 D1 DE60220107 D1 DE 60220107D1 DE 60220107 T DE60220107 T DE 60220107T DE 60220107 T DE60220107 T DE 60220107T DE 60220107 D1 DE60220107 D1 DE 60220107D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- metal laminate
- laminate
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/06—Embossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/55—Liquid crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001063382 | 2001-03-07 | ||
JP2001063382 | 2001-03-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60220107D1 true DE60220107D1 (de) | 2007-06-28 |
DE60220107T2 DE60220107T2 (de) | 2007-11-22 |
Family
ID=18922383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60220107T Expired - Lifetime DE60220107T2 (de) | 2001-03-07 | 2002-03-07 | Verfahren zur Herstellung eines Metalllaminats |
Country Status (6)
Country | Link |
---|---|
US (1) | US7052574B2 (de) |
EP (1) | EP1238800B1 (de) |
KR (1) | KR100855925B1 (de) |
CN (1) | CN1233521C (de) |
DE (1) | DE60220107T2 (de) |
TW (1) | TW528676B (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004358677A (ja) * | 2003-06-02 | 2004-12-24 | Nippon Steel Chem Co Ltd | 積層体の製造方法 |
JP3968068B2 (ja) * | 2003-09-30 | 2007-08-29 | 株式会社クラレ | 液晶ポリマーフィルムの製造方法 |
JP4718197B2 (ja) * | 2004-03-23 | 2011-07-06 | 宇部日東化成株式会社 | フレキシブル金属箔積層体製造装置と該装置を用いた製造方法 |
DE112005000716T5 (de) * | 2004-03-30 | 2007-02-15 | Noritsu Koki Co., Ltd. | Laminiergerät und Laminierverfahren |
KR101366906B1 (ko) * | 2005-07-27 | 2014-02-24 | 가부시키가이샤 구라레 | 열가소성 액정 폴리머 필름으로 피복한 배선판의 제조 방법 |
US9145469B2 (en) | 2012-09-27 | 2015-09-29 | Ticona Llc | Aromatic polyester containing a biphenyl chain disruptor |
WO2016003588A1 (en) | 2014-07-01 | 2016-01-07 | Ticona Llc | Laser activatable polymer composition |
JP6316178B2 (ja) * | 2014-12-05 | 2018-04-25 | 株式会社クラレ | 片面金属張積層板およびその製造方法 |
EP3287260B1 (de) * | 2015-04-20 | 2019-12-18 | Kuraray Co., Ltd. | Verfahren zur herstellung eines metallkaschierten laminatblatts und metallkaschiertes laminatblatt unter dessen verwendung |
JP6855441B2 (ja) * | 2016-03-03 | 2021-04-07 | 株式会社クラレ | 金属張積層板およびその製造方法 |
CN113580690B (zh) * | 2016-03-08 | 2023-12-08 | 株式会社可乐丽 | 覆金属层叠板 |
CN109334202B (zh) * | 2018-11-05 | 2024-02-06 | 江苏坤泰机械有限公司 | 大宽幅墙体增强材料热熔复合机 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5410922B2 (de) * | 1972-12-19 | 1979-05-10 | ||
CA1298451C (en) * | 1985-08-02 | 1992-04-07 | Hiromi Shigemoto | Surface-roughened film and sheet, and process for production and use thereof |
WO1987005919A1 (en) * | 1986-04-01 | 1987-10-08 | Toray Industries, Inc. | Biaxially oriented polyester film |
EP0311232B2 (de) | 1987-10-02 | 1999-08-04 | Polyplastics Co. Ltd. | Verfahren zur Oberflächenbehandlung von Gegenständen aus flüssigkristallinem Polyesterharz |
JPH0630296Y2 (ja) * | 1987-11-30 | 1994-08-17 | 大日本スクリーン製造株式会社 | ロールコーティング装置 |
JP3245437B2 (ja) | 1991-04-05 | 2002-01-15 | 株式会社クラレ | 積層体の製造方法 |
JP3090706B2 (ja) * | 1991-04-08 | 2000-09-25 | 株式会社クラレ | 液晶高分子よりなるフィルムの製造方法 |
US5843562A (en) | 1992-12-22 | 1998-12-01 | Hoechst Celanese Corporation | LCP films having roughened surface and process therefor |
DE69431243T2 (de) | 1994-06-30 | 2003-04-10 | Cna Holdings Inc N D Ges Des S | Folien aus flüssigkristallinen Polymeren mit einer rauhen Oberfläche und Verfahren zu deren Herstellung |
US5719354A (en) | 1994-09-16 | 1998-02-17 | Hoechst Celanese Corp. | Monolithic LCP polymer microelectronic wiring modules |
US5529740A (en) | 1994-09-16 | 1996-06-25 | Jester; Randy D. | Process for treating liquid crystal polymer film |
DE69632222T2 (de) | 1995-03-31 | 2004-08-26 | Sumitomo Chemical Co., Ltd. | Verbundstoff aus flüssigkristallinem Polyesterharzzusammensetzungsfilm und Metallfolie und Leiterplatte daraus |
US6159412A (en) * | 1996-09-11 | 2000-12-12 | Dupont Canada Inc. | Method for manufacture of liquid crystalline polymer films |
JP2000044797A (ja) | 1998-04-06 | 2000-02-15 | Kuraray Co Ltd | 液晶ポリマ―フィルムと積層体及びそれらの製造方法並びに多層実装回路基板 |
CN1116164C (zh) | 1998-04-09 | 2003-07-30 | 可乐丽股份有限公司 | 使用聚合物薄膜的涂层方法和由此得到的涂层体 |
JP4184529B2 (ja) | 1999-03-25 | 2008-11-19 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムとその改質方法 |
JP4216433B2 (ja) | 1999-03-29 | 2009-01-28 | 株式会社クラレ | 回路基板用金属張積層板の製造方法 |
-
2002
- 2002-03-05 TW TW091103985A patent/TW528676B/zh not_active IP Right Cessation
- 2002-03-06 US US10/090,747 patent/US7052574B2/en not_active Expired - Lifetime
- 2002-03-07 KR KR1020020012164A patent/KR100855925B1/ko active IP Right Grant
- 2002-03-07 EP EP02005223A patent/EP1238800B1/de not_active Expired - Lifetime
- 2002-03-07 DE DE60220107T patent/DE60220107T2/de not_active Expired - Lifetime
- 2002-03-07 CN CNB021068631A patent/CN1233521C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1238800A3 (de) | 2003-12-03 |
TW528676B (en) | 2003-04-21 |
US7052574B2 (en) | 2006-05-30 |
DE60220107T2 (de) | 2007-11-22 |
EP1238800B1 (de) | 2007-05-16 |
EP1238800A2 (de) | 2002-09-11 |
CN1233521C (zh) | 2005-12-28 |
KR100855925B1 (ko) | 2008-09-02 |
CN1374192A (zh) | 2002-10-16 |
KR20020071784A (ko) | 2002-09-13 |
US20020170939A1 (en) | 2002-11-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |