KR20010108288A - 전해동박 및 그 물성 검사방법 및 그 전해동박을 사용한동 클래드 적층판 - Google Patents
전해동박 및 그 물성 검사방법 및 그 전해동박을 사용한동 클래드 적층판 Download PDFInfo
- Publication number
- KR20010108288A KR20010108288A KR1020017011102A KR20017011102A KR20010108288A KR 20010108288 A KR20010108288 A KR 20010108288A KR 1020017011102 A KR1020017011102 A KR 1020017011102A KR 20017011102 A KR20017011102 A KR 20017011102A KR 20010108288 A KR20010108288 A KR 20010108288A
- Authority
- KR
- South Korea
- Prior art keywords
- copper foil
- tensile strength
- foil
- electrolytic copper
- electrolytic
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/32—Investigating strength properties of solid materials by application of mechanical stress by applying repeated or pulsating forces
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0023—Bending
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/022—Environment of the test
- G01N2203/0222—Temperature
- G01N2203/0226—High temperature; Heating means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/026—Specifications of the specimen
- G01N2203/0262—Shape of the specimen
- G01N2203/0278—Thin specimens
- G01N2203/0282—Two dimensional, e.g. tapes, webs, sheets, strips, disks or membranes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/20—Metals
- G01N33/208—Coatings, e.g. platings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Thermal Sciences (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Description
Claims (3)
- 전해동박을 사용한 동 클래드 적층판을 제조할 때의 열이력에 의해, 해당 전해동박의 결정 조직이 재결정화하는 저온 어닐링성을 가지며, 180℃의 열간 분위기 속에서 18% 이상의 높은 신장율을 나타내는 전해동박에 있어서,170℃의 열간 분위기 속에서 시효처리된 경우의 인장강도가 시간이 지남에 따라서 감소하는 과정에서, 최대 인장강도의 최대 감소속도가 5∼10분의 시효시간의 범위 내에 있고,종축(縱軸)에 인장강도, 횡축(橫軸)에 시효시간을 채택하여 작성된 크닉을 가지는 [인장강도]-[시효시간] 곡선의 크닉부에서의 인장강도의 변화량이 3kg/mm2이상이 되는 물성을 가지는 전해동박.
- 동일 로트의 해당 전해동박을 1cm ×10cm인 직사각형 형상의 2개의 시료로 하고, 이 2개의 시료의 한쪽에 170℃ ×5분의 시효처리를 실시하며, 다른 쪽의 시료에 170℃ ×10분간의 시효처리를 행한 후에, 각각의 시료를 실온 상태로 되돌린 후, 각 시료를 인장 시험기에 설치하여 로드 속도 10mm/min. 에서 수행하고, 이 때 각각의 시료의 최대 인장강도를 구하여, 그 차가 3kg/mm2이상이 되는 것을 확인하는 것을 특징으로 하는 제1항에 따른 전해동박의 물성 검사방법.
- 제1항에 따른 전해동박을 사용한 동 클래드 적층판.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2000-00001122 | 2000-01-06 | ||
JP2000001122A JP3521074B2 (ja) | 2000-01-06 | 2000-01-06 | 電解銅箔の物性検査方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010108288A true KR20010108288A (ko) | 2001-12-07 |
KR100437570B1 KR100437570B1 (ko) | 2004-06-30 |
Family
ID=18530380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2001-7011102A KR100437570B1 (ko) | 2000-01-06 | 2000-12-18 | 전해동박 및 그 물성 검사방법 및 그 전해동박을 사용한동 클래드 적층판 |
Country Status (11)
Country | Link |
---|---|
US (1) | US6479170B2 (ko) |
EP (1) | EP1167581B1 (ko) |
JP (1) | JP3521074B2 (ko) |
KR (1) | KR100437570B1 (ko) |
CN (1) | CN1179070C (ko) |
AT (1) | ATE359385T1 (ko) |
DE (1) | DE60034323T2 (ko) |
HK (1) | HK1044971A1 (ko) |
MY (1) | MY124186A (ko) |
TW (1) | TW491003B (ko) |
WO (1) | WO2001049903A1 (ko) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3743702B2 (ja) * | 2000-04-28 | 2006-02-08 | 三井金属鉱業株式会社 | プリント配線板のセミアディティブ製造法 |
JP3396465B2 (ja) * | 2000-08-25 | 2003-04-14 | 三井金属鉱業株式会社 | 銅張積層板 |
CN100564612C (zh) | 2002-06-17 | 2009-12-02 | 东丽株式会社 | 镀膜的制备方法、电镀用阴极辊和制造电路板的方法 |
JP5170866B2 (ja) * | 2006-10-10 | 2013-03-27 | 古河電気工業株式会社 | 電気・電子部品用銅合金材およびその製造方法 |
CN102959135B (zh) * | 2010-07-01 | 2016-03-09 | 三井金属矿业株式会社 | 电解铜箔以及其制造方法 |
JP5822669B2 (ja) | 2011-02-18 | 2015-11-24 | Jx日鉱日石金属株式会社 | グラフェン製造用銅箔及びそれを用いたグラフェンの製造方法 |
JP5850720B2 (ja) | 2011-06-02 | 2016-02-03 | Jx日鉱日石金属株式会社 | グラフェン製造用銅箔、及びグラフェンの製造方法 |
CN102393333A (zh) * | 2011-08-25 | 2012-03-28 | 灵宝华鑫铜箔有限责任公司 | 一种测试铜箔高温抗拉强度及高温伸长率的方法 |
JP5721609B2 (ja) * | 2011-11-15 | 2015-05-20 | Jx日鉱日石金属株式会社 | グラフェン製造用銅箔、及びグラフェンの製造方法 |
JP6078024B2 (ja) | 2014-06-13 | 2017-02-08 | Jx金属株式会社 | 2次元六角形格子化合物製造用圧延銅箔、及び2次元六角形格子化合物の製造方法 |
CN105223329B (zh) * | 2015-09-18 | 2017-08-08 | 重庆大学 | 基于热电效应的变压器绕组材质鉴别方法 |
KR20170036262A (ko) * | 2015-09-24 | 2017-04-03 | 엘에스엠트론 주식회사 | 초고강도 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
US9397343B1 (en) | 2015-10-15 | 2016-07-19 | Chang Chun Petrochemical Co., Ltd. | Copper foil exhibiting anti-swelling properties |
KR102218889B1 (ko) * | 2016-06-14 | 2021-02-22 | 후루카와 덴키 고교 가부시키가이샤 | 전해 동박, 리튬 이온 2차 전지용 부극 전극 및 리튬 이온 2차 전지 그리고 프린트 배선판 |
KR20210158055A (ko) * | 2020-06-23 | 2021-12-30 | 주식회사 엘지에너지솔루션 | 금속 호일 피로 시험 장치 및 이를 사용한 방법 |
CN111793779B (zh) * | 2020-07-07 | 2021-10-26 | 铜陵市华创新材料有限公司 | 一种降低4.5微米铜箔翘曲度的去应力退火工艺 |
KR102617146B1 (ko) | 2021-08-02 | 2023-12-27 | 에스티에스 주식회사 | 금속 포일용 비전 검사 장치 및 그에 의한 검사 방법 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NZ206264A (en) | 1982-11-23 | 1986-02-21 | Injectall Ltd | Apparatus for introducing substance into metal melts |
JPS6210291A (ja) * | 1985-07-05 | 1987-01-19 | Mitsui Mining & Smelting Co Ltd | 電解銅箔 |
EP0207244B2 (en) * | 1985-07-05 | 1999-03-31 | Mitsui Mining & Smelting Co., Ltd. | Process for the production of an electroposited copper foil. |
US5431803A (en) * | 1990-05-30 | 1995-07-11 | Gould Electronics Inc. | Electrodeposited copper foil and process for making same |
JPH07142831A (ja) * | 1993-11-15 | 1995-06-02 | Mitsui Mining & Smelting Co Ltd | 銅張積層板 |
JP3608840B2 (ja) * | 1995-04-07 | 2005-01-12 | 古河サーキットフォイル株式会社 | フレキシブル配線板用電解銅箔 |
US6132887A (en) * | 1995-06-16 | 2000-10-17 | Gould Electronics Inc. | High fatigue ductility electrodeposited copper foil |
JP3340307B2 (ja) * | 1996-03-11 | 2002-11-05 | 三井金属鉱業株式会社 | プリント配線板用銅箔の製造方法 |
JPH1036991A (ja) * | 1996-07-19 | 1998-02-10 | Japan Energy Corp | 電解銅箔の製造方法 |
JP4572423B2 (ja) * | 1998-03-17 | 2010-11-04 | 日立化成工業株式会社 | 銅張積層板の製造方法及びこれを用いたプリント配線板、多層プリント配線板 |
JP3850155B2 (ja) * | 1998-12-11 | 2006-11-29 | 日本電解株式会社 | 電解銅箔、二次電池の集電体用銅箔及び二次電池 |
-
2000
- 2000-01-06 JP JP2000001122A patent/JP3521074B2/ja not_active Expired - Fee Related
- 2000-12-01 TW TW089125579A patent/TW491003B/zh not_active IP Right Cessation
- 2000-12-05 MY MYPI20005704A patent/MY124186A/en unknown
- 2000-12-18 EP EP00981793A patent/EP1167581B1/en not_active Expired - Lifetime
- 2000-12-18 KR KR10-2001-7011102A patent/KR100437570B1/ko active IP Right Grant
- 2000-12-18 WO PCT/JP2000/008947 patent/WO2001049903A1/ja active IP Right Grant
- 2000-12-18 AT AT00981793T patent/ATE359385T1/de not_active IP Right Cessation
- 2000-12-18 DE DE60034323T patent/DE60034323T2/de not_active Expired - Lifetime
- 2000-12-18 CN CNB008043280A patent/CN1179070C/zh not_active Expired - Fee Related
-
2001
- 2001-01-05 US US09/755,772 patent/US6479170B2/en not_active Expired - Lifetime
-
2002
- 2002-09-05 HK HK02106530.2A patent/HK1044971A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2001192793A (ja) | 2001-07-17 |
HK1044971A1 (zh) | 2002-11-08 |
CN1341165A (zh) | 2002-03-20 |
JP3521074B2 (ja) | 2004-04-19 |
TW491003B (en) | 2002-06-11 |
EP1167581A1 (en) | 2002-01-02 |
MY124186A (en) | 2006-06-30 |
KR100437570B1 (ko) | 2004-06-30 |
US20010008091A1 (en) | 2001-07-19 |
US6479170B2 (en) | 2002-11-12 |
EP1167581B1 (en) | 2007-04-11 |
CN1179070C (zh) | 2004-12-08 |
DE60034323T2 (de) | 2007-12-20 |
EP1167581A4 (en) | 2005-06-08 |
DE60034323D1 (de) | 2007-05-24 |
WO2001049903A1 (fr) | 2001-07-12 |
ATE359385T1 (de) | 2007-05-15 |
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