KR20010090483A - 부품 장착 장치 - Google Patents

부품 장착 장치 Download PDF

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Publication number
KR20010090483A
KR20010090483A KR1020010013728A KR20010013728A KR20010090483A KR 20010090483 A KR20010090483 A KR 20010090483A KR 1020010013728 A KR1020010013728 A KR 1020010013728A KR 20010013728 A KR20010013728 A KR 20010013728A KR 20010090483 A KR20010090483 A KR 20010090483A
Authority
KR
South Korea
Prior art keywords
component
mounting
head
mounting head
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020010013728A
Other languages
English (en)
Korean (ko)
Inventor
다무라고우타
이시베도시유키
나시마호즈미
니시데루키
가지와라마사토시
Original Assignee
무라타 야스타카
가부시키가이샤 무라타 세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 무라타 야스타카, 가부시키가이샤 무라타 세이사쿠쇼 filed Critical 무라타 야스타카
Publication of KR20010090483A publication Critical patent/KR20010090483A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020010013728A 2000-03-17 2001-03-16 부품 장착 장치 Ceased KR20010090483A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-075828 2000-03-17
JP2000075828A JP2001267798A (ja) 2000-03-17 2000-03-17 部品装着装置

Publications (1)

Publication Number Publication Date
KR20010090483A true KR20010090483A (ko) 2001-10-18

Family

ID=18593659

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010013728A Ceased KR20010090483A (ko) 2000-03-17 2001-03-16 부품 장착 장치

Country Status (4)

Country Link
JP (1) JP2001267798A (https=)
KR (1) KR20010090483A (https=)
CN (2) CN1323574C (https=)
TW (1) TW488191B (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003067757A1 (en) * 2002-02-06 2003-08-14 Mirim Intellectual Robot Technology Co., Ltd Blank mounting apparatus for fabrication of quartz oscillator
KR100552884B1 (ko) * 2003-11-04 2006-02-20 티디케이가부시기가이샤 전자 부품을 장착하기 위한 장치 및 방법
US7181833B2 (en) 2002-09-11 2007-02-27 Tdk Corporation Method of mounting an electronic part
KR100954936B1 (ko) * 2002-03-28 2010-04-27 쥬키 가부시키가이샤 전자 부품 장착 장치

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10236004B4 (de) * 2002-08-06 2007-08-23 Siemens Ag Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen
JP4147963B2 (ja) * 2003-02-10 2008-09-10 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
JP3879679B2 (ja) * 2003-02-25 2007-02-14 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
CN1592574B (zh) * 2003-09-01 2010-06-09 重机公司 电子器件安装机中的电子器件的吸附位置修正装置
KR101009670B1 (ko) * 2004-03-30 2011-01-19 엘지디스플레이 주식회사 검사 장비
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
CN100359770C (zh) * 2004-12-31 2008-01-02 技嘉科技股份有限公司 一种针脚座送料装置
DE102005013283B4 (de) * 2005-03-22 2008-05-08 Siemens Ag Bestückautomat zum Bestücken von Substraten mit elektrischen Bauelementen
KR101308467B1 (ko) * 2009-08-04 2013-09-16 엘지디스플레이 주식회사 전자 부품 실장 장치 및 방법
CN101662928B (zh) * 2009-09-14 2011-07-06 邓智军 一种具有影像定位的电路板校位装置和钻铣装置
CN102641821A (zh) * 2011-02-17 2012-08-22 一诠精密工业股份有限公司 用于黏着光学透镜的点胶机
JP6166278B2 (ja) * 2012-11-27 2017-07-26 富士機械製造株式会社 部品実装機
CN104062073A (zh) * 2013-03-20 2014-09-24 鸿富锦精密工业（深圳）有限公司 动平衡检测装置
CN103220900B (zh) * 2013-04-09 2016-10-05 深圳市东旭发自动化有限公司 一种自动贴片机
JP6135598B2 (ja) * 2013-08-20 2017-05-31 株式会社村田製作所 チップの振込装置
CN103841764B (zh) * 2014-03-15 2017-06-06 深圳市鹰眼在线电子科技有限公司 Fpc补强片智能贴装机
KR101465125B1 (ko) * 2014-04-25 2014-11-26 안재은 오링 자동 조립 장치
CN104105356B (zh) * 2014-07-30 2017-04-05 东莞市新泽谷机械制造股份有限公司 双叉片定位送料机构
CN105149924A (zh) * 2015-09-09 2015-12-16 舒建文 一种贴件机
CN105722382A (zh) * 2016-03-23 2016-06-29 广东工业大学 一种设有横置式同步供料机构的贴片机及供料方法
JP7018709B2 (ja) * 2017-01-24 2022-02-14 Thk株式会社 加工制御システム、及び運動案内装置
CN107454820A (zh) * 2017-08-03 2017-12-08 江门市高翔电气智能化有限公司 一种插件机
KR20190091018A (ko) * 2018-01-26 2019-08-05 한화정밀기계 주식회사 부품 실장 장치
CN109287112B (zh) * 2018-09-21 2020-12-29 创维电子器件（宜春）有限公司 一种pcba自动组装设备
CN109247008A (zh) * 2018-10-30 2019-01-18 重庆隆成电子设备有限公司 一种软硬贴合机及贴片方法
CN109348701B (zh) * 2018-12-04 2023-12-15 东莞市南部佳永电子有限公司 振动型管式飞达
CN113035745B (zh) * 2021-02-25 2022-03-18 东莞普莱信智能技术有限公司 一种芯片贴装装置
CN114496848A (zh) * 2022-01-06 2022-05-13 浙江鼎炬电子科技股份有限公司 一种半导体元件组装方法
IT202300025071A1 (it) * 2023-11-24 2025-05-24 Gd Spa Una stazione operativa per alimentare dei componenti elettronici, in particolare dei microprocessori, in una macchina confezionatrice di articoli

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765993A (en) * 1987-01-20 1988-08-23 Owades Joseph L Preparation of alcohol-free barley malt-based beverage
JPH0780108B2 (ja) * 1988-10-08 1995-08-30 ティーディーケイ株式会社 部品搭載機におけるランダム搭載方法
JPH03257896A (ja) * 1990-03-07 1991-11-18 Sanyo Electric Co Ltd 部品供給装置
JP3165289B2 (ja) * 1993-07-12 2001-05-14 ヤマハ発動機株式会社 表面実装機
JP3336774B2 (ja) * 1994-11-15 2002-10-21 松下電器産業株式会社 電子部品実装装置
JPH11330799A (ja) * 1998-05-21 1999-11-30 Sony Corp 部品装着装置
JPH11340686A (ja) * 1998-05-28 1999-12-10 Sony Corp チップ部品供給方法及び装置
JP3562325B2 (ja) * 1998-07-16 2004-09-08 松下電器産業株式会社 電子部品の実装方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003067757A1 (en) * 2002-02-06 2003-08-14 Mirim Intellectual Robot Technology Co., Ltd Blank mounting apparatus for fabrication of quartz oscillator
KR100954936B1 (ko) * 2002-03-28 2010-04-27 쥬키 가부시키가이샤 전자 부품 장착 장치
US7181833B2 (en) 2002-09-11 2007-02-27 Tdk Corporation Method of mounting an electronic part
KR100552884B1 (ko) * 2003-11-04 2006-02-20 티디케이가부시기가이샤 전자 부품을 장착하기 위한 장치 및 방법

Also Published As

Publication number Publication date
JP2001267798A (ja) 2001-09-28
TW488191B (en) 2002-05-21
CN1323574C (zh) 2007-06-27
CN1592575A (zh) 2005-03-09
CN1317926A (zh) 2001-10-17
CN1183818C (zh) 2005-01-05

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