KR20010061982A - 구리분말 및 구리분말의 제조방법 - Google Patents
구리분말 및 구리분말의 제조방법 Download PDFInfo
- Publication number
- KR20010061982A KR20010061982A KR1020000071492A KR20000071492A KR20010061982A KR 20010061982 A KR20010061982 A KR 20010061982A KR 1020000071492 A KR1020000071492 A KR 1020000071492A KR 20000071492 A KR20000071492 A KR 20000071492A KR 20010061982 A KR20010061982 A KR 20010061982A
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- South Korea
- Prior art keywords
- copper powder
- copper
- particle diameter
- powder
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- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 98
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 101
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims abstract description 37
- 238000009826 distribution Methods 0.000 claims abstract description 19
- 229910021529 ammonia Inorganic materials 0.000 claims abstract description 18
- 239000012298 atmosphere Substances 0.000 claims abstract description 12
- 239000003985 ceramic capacitor Substances 0.000 claims abstract description 7
- 230000001186 cumulative effect Effects 0.000 claims abstract description 7
- 239000011261 inert gas Substances 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 21
- 239000000047 product Substances 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 20
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims description 14
- 239000005750 Copper hydroxide Substances 0.000 claims description 14
- 229910001956 copper hydroxide Inorganic materials 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 14
- 239000000725 suspension Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000003513 alkali Substances 0.000 claims description 9
- 239000007864 aqueous solution Substances 0.000 claims description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-O ammonium group Chemical group [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000002244 precipitate Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 3
- 239000005751 Copper oxide Substances 0.000 claims description 3
- 229910000431 copper oxide Inorganic materials 0.000 claims description 3
- HABPPAZIPDBHBW-UHFFFAOYSA-N [Cu].N#[N+][O-] Chemical compound [Cu].N#[N+][O-] HABPPAZIPDBHBW-UHFFFAOYSA-N 0.000 claims description 2
- 239000007772 electrode material Substances 0.000 claims description 2
- 230000004927 fusion Effects 0.000 claims description 2
- 238000005245 sintering Methods 0.000 abstract description 6
- 150000003863 ammonium salts Chemical class 0.000 abstract description 3
- 239000011148 porous material Substances 0.000 abstract description 3
- 239000007787 solid Substances 0.000 abstract description 2
- 239000003990 capacitor Substances 0.000 abstract 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 abstract 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 abstract 1
- 229940112669 cuprous oxide Drugs 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 238000001878 scanning electron micrograph Methods 0.000 description 10
- 230000002776 aggregation Effects 0.000 description 9
- 238000010304 firing Methods 0.000 description 9
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 7
- 235000011114 ammonium hydroxide Nutrition 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000004220 aggregation Methods 0.000 description 5
- 239000001272 nitrous oxide Substances 0.000 description 5
- 238000005054 agglomeration Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 150000001879 copper Chemical class 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000011362 coarse particle Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004438 BET method Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011246 composite particle Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000008103 glucose Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000012266 salt solution Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- XDIYNQZUNSSENW-UUBOPVPUSA-N (2R,3S,4R,5R)-2,3,4,5,6-pentahydroxyhexanal Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O XDIYNQZUNSSENW-UUBOPVPUSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 229940116318 copper carbonate Drugs 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- JVBXVOWTABLYPX-UHFFFAOYSA-L sodium dithionite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])=O JVBXVOWTABLYPX-UHFFFAOYSA-L 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000002889 sympathetic effect Effects 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
Description
예 No. | BET값㎡/g | 평균입자직경 SSS값(㎛) | 산소량(%) | 탄소량(%) | 누적분포의 입자직경(㎛) | A 값(X75-X25)/X50 | ||
X25 | X50 | X75 | ||||||
실시예 1 | 1.6 | 0.8 | 0.16 | 0.09 | 0.47 | 0.77 | 1.08 | 0.79 |
실시예 2 | 1.7 | 0.8 | 0.17 | 0.08 | 0.45 | 0.80 | 1.12 | 0.84 |
실시예 3 | 2.0 | 0.8 | 0.15 | 0.08 | 0.46 | 0.79 | 1.20 | 0.94 |
비교예 1 | 2.8 | 0.6 | 0.25 | 0.14 | 0.45 | 0.91 | 1.58 | 1.48 |
비교예 2 | 0.8 | 1.5 | 0.21 | 0.07 | 1.00 | 1.30 | 1.70 | 0.53 |
Claims (6)
- 구리염 수용액과 알칼리제를 반응시켜 수산화 구리를 석출시키고, 얻어진 수산화 구리를 아산화 구리로 액중에서 일차 환원하고, 얻어진 아산화 구리를 금속 구리로 액중에서 이차 환원하며, 얻어진 금속 구리를 액으로부터 분리하는 구리 분말의 제조 방법에 있어서,해당 이차 환원 전 또는 환원 도중의 현탁액을 암모니아(ammonia) 또는 암모늄기(ammoniate)와 접촉시키는 것을 특징으로 하는 구리 분말의 제조 방법.
- 제 1 항에 있어서,평균 입자 직경 1.2㎛ 이하이고, 또한 비응집성 구리 분말을 얻는 구리 분말의 제조 방법.
- 제 1 항 또는 제 2 항에 있어서,현탁액과 접촉시키는 암모니아 또는 암모늄기는, 액중의 구리 1몰에 대하여 암모니아 환산으로 0.01 내지 0.1몰인 분말의 제조 방법.
- 평균 입자 직경이 0.1㎛ 이상, 1.5㎛ 미만의 범위에 있고, 하기에 정의하는 X25, X50 및 X75의 값 사이에서 하기의 식(1)을 따르는 A 값이 1.2 이하를 나타내는 입자도 분포폭이 좁은 구리 분말이고, 불활성 가스 1기압 분위기하 800℃의 온도로 유지했을 때에 의융체 소성품이 되는 구리 분말.A 값 = (X75 - X25) / X50···(1)단, X25, X50 및 X75는, 횡축에 입자 직경 X(㎛), 종축에 Q%(그 입자 직경이하의 입자가 존재하는 비율; 단위는 입자의 용적%)로 잡은 누적 입자도 곡선(cummulative particle-size curve)에 있어서, Q%=25%, 50% 및 75%에 대응하는 각각의 입자 직경(X)의 값을 말한다.
- 제 4 항에 있어서,평균 입자 직경이 0.3 내지 1.2㎛의 범위에 있고, A 값이 1.0 이하인 구리 분말.
- 제 4 항 또는 제 5 항에 있어서,적층 세라믹스 콘덴서의 외부 전극재에 제공되는 구리 분말.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP99-342435 | 1999-12-01 | ||
JP34243599 | 1999-12-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010061982A true KR20010061982A (ko) | 2001-07-07 |
KR100743844B1 KR100743844B1 (ko) | 2007-08-02 |
Family
ID=18353724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000071492A KR100743844B1 (ko) | 1999-12-01 | 2000-11-29 | 구리 분말 및 구리 분말의 제조 방법 |
Country Status (2)
Country | Link |
---|---|
US (2) | US20010002558A1 (ko) |
KR (1) | KR100743844B1 (ko) |
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WO2004039524A1 (en) * | 2002-10-30 | 2004-05-13 | Chang Sung Corporation | Method for manufacturing nano-scaled copper powder by wet reduction process |
KR100650488B1 (ko) * | 2004-06-18 | 2006-11-29 | 쯔루미소다 가부시끼가이샤 | 구리 도금 재료 및 구리 도금 방법 |
KR20180054914A (ko) * | 2010-09-30 | 2018-05-24 | 도와 일렉트로닉스 가부시키가이샤 | 도전성 페이스트용 구리분 및 그 제조 방법 |
KR20190037256A (ko) * | 2016-08-03 | 2019-04-05 | 가부시키가이샤 아데카 | 구리 분말의 제조 방법 |
KR20200014696A (ko) * | 2018-08-01 | 2020-02-11 | 제이엑스금속주식회사 | 세라믹스층과 구리 분말 페이스트 소결체의 적층체 |
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EP0363552B1 (en) * | 1988-07-27 | 1993-10-13 | Tanaka Kikinzoku Kogyo K.K. | Process for preparing metal particles |
JPH0793051B2 (ja) | 1989-01-26 | 1995-10-09 | 第一工業製薬株式会社 | 銅導体組成物 |
JP2638271B2 (ja) * | 1990-09-06 | 1997-08-06 | 住友金属工業株式会社 | 銅微粉末の製造方法 |
US5588983A (en) * | 1994-02-16 | 1996-12-31 | Murata Manufacturing Co., Ltd. | Production of copper powder |
JP3570591B2 (ja) | 1996-03-22 | 2004-09-29 | 株式会社村田製作所 | 銅粉末の製造方法 |
US6679937B1 (en) * | 1997-02-24 | 2004-01-20 | Cabot Corporation | Copper powders methods for producing powders and devices fabricated from same |
JP2911429B2 (ja) * | 1997-06-04 | 1999-06-23 | 三井金属鉱業株式会社 | 銅微粉末の製造方法 |
US6379419B1 (en) * | 1998-08-18 | 2002-04-30 | Noranda Inc. | Method and transferred arc plasma system for production of fine and ultrafine powders |
-
2000
- 2000-11-29 KR KR1020000071492A patent/KR100743844B1/ko active IP Right Grant
- 2000-12-01 US US09/726,379 patent/US20010002558A1/en not_active Abandoned
-
2002
- 2002-08-13 US US10/216,750 patent/US6875252B2/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004039524A1 (en) * | 2002-10-30 | 2004-05-13 | Chang Sung Corporation | Method for manufacturing nano-scaled copper powder by wet reduction process |
KR100650488B1 (ko) * | 2004-06-18 | 2006-11-29 | 쯔루미소다 가부시끼가이샤 | 구리 도금 재료 및 구리 도금 방법 |
KR20180054914A (ko) * | 2010-09-30 | 2018-05-24 | 도와 일렉트로닉스 가부시키가이샤 | 도전성 페이스트용 구리분 및 그 제조 방법 |
KR20190037256A (ko) * | 2016-08-03 | 2019-04-05 | 가부시키가이샤 아데카 | 구리 분말의 제조 방법 |
KR20200014696A (ko) * | 2018-08-01 | 2020-02-11 | 제이엑스금속주식회사 | 세라믹스층과 구리 분말 페이스트 소결체의 적층체 |
US11069478B2 (en) | 2018-08-01 | 2021-07-20 | Jx Nippon Mining & Metals Corporation | Laminate of ceramic layer and sintered body of copper powder paste |
Also Published As
Publication number | Publication date |
---|---|
KR100743844B1 (ko) | 2007-08-02 |
US6875252B2 (en) | 2005-04-05 |
US20030015062A1 (en) | 2003-01-23 |
US20010002558A1 (en) | 2001-06-07 |
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