KR20010012685A - 처리 장치 - Google Patents

처리 장치 Download PDF

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Publication number
KR20010012685A
KR20010012685A KR1019997010646A KR19997010646A KR20010012685A KR 20010012685 A KR20010012685 A KR 20010012685A KR 1019997010646 A KR1019997010646 A KR 1019997010646A KR 19997010646 A KR19997010646 A KR 19997010646A KR 20010012685 A KR20010012685 A KR 20010012685A
Authority
KR
South Korea
Prior art keywords
processing apparatus
processing
Prior art date
Application number
KR1019997010646A
Other languages
English (en)
Other versions
KR100434790B1 (ko
Inventor
하야시가즈이치
Original Assignee
히가시 데쓰로
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히가시 데쓰로, 동경 엘렉트론 주식회사 filed Critical 히가시 데쓰로
Publication of KR20010012685A publication Critical patent/KR20010012685A/ko
Application granted granted Critical
Publication of KR100434790B1 publication Critical patent/KR100434790B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
KR10-1999-7010646A 1997-05-20 1998-05-12 처리 장치 KR100434790B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14585697 1997-05-20
JP97-145856 1997-05-20

Publications (2)

Publication Number Publication Date
KR20010012685A true KR20010012685A (ko) 2001-02-26
KR100434790B1 KR100434790B1 (ko) 2004-06-07

Family

ID=15394673

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1999-7010646A KR100434790B1 (ko) 1997-05-20 1998-05-12 처리 장치

Country Status (4)

Country Link
US (1) US6368450B2 (ko)
JP (1) JP2001525997A (ko)
KR (1) KR100434790B1 (ko)
WO (1) WO1998053484A1 (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150104813A (ko) * 2014-03-06 2015-09-16 피에스케이 주식회사 기판 처리 장치 및 방법
KR20180098704A (ko) * 2008-10-31 2018-09-04 에이에스엠 아메리카, 인코포레이티드 자가 중심설정 서셉터 링 조립체
KR20210093762A (ko) * 2020-01-20 2021-07-28 도쿄엘렉트론가부시키가이샤 기판을 처리하는 장치, 및 기판을 처리하는 방법
KR20220150493A (ko) * 2021-05-03 2022-11-11 세메스 주식회사 기판 처리 장치

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US20030051974A1 (en) * 1997-05-05 2003-03-20 Semitool, Inc. Automated semiconductor processing system
JP3674896B2 (ja) * 1997-11-10 2005-07-27 東芝セラミックス株式会社 気相薄膜形成装置及びそれを用いる気相薄膜形成法
KR100583134B1 (ko) * 1999-11-16 2006-05-24 동경 엘렉트론 주식회사 기판의 처리장치 및 처리방법
US6589352B1 (en) * 1999-12-10 2003-07-08 Applied Materials, Inc. Self aligning non contact shadow ring process kit
US6521292B1 (en) * 2000-08-04 2003-02-18 Applied Materials, Inc. Substrate support including purge ring having inner edge aligned to wafer edge
JP2002231645A (ja) * 2001-02-02 2002-08-16 Ngk Insulators Ltd 窒化物半導体膜の製造方法
AU2002352262A1 (en) * 2001-06-29 2003-03-03 Tokyo Electron Limited Directed gas injection apparatus for semiconductor processing
WO2003017345A1 (en) * 2001-08-14 2003-02-27 Powdec K.K. Chemical vapor phase epitaxial device
JP4121269B2 (ja) * 2001-11-27 2008-07-23 日本エー・エス・エム株式会社 セルフクリーニングを実行するプラズマｃｖｄ装置及び方法
JP3896280B2 (ja) * 2001-12-25 2007-03-22 松下電器産業株式会社 プラズマ処理装置およびプラズマ処理方法
US6677167B2 (en) * 2002-03-04 2004-01-13 Hitachi High-Technologies Corporation Wafer processing apparatus and a wafer stage and a wafer processing method
JP2005536042A (ja) * 2002-08-08 2005-11-24 トリコン テクノロジーズ リミティド シャワーヘッドの改良
US7270713B2 (en) * 2003-01-07 2007-09-18 Applied Materials, Inc. Tunable gas distribution plate assembly
US6942753B2 (en) 2003-04-16 2005-09-13 Applied Materials, Inc. Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition
US20050092255A1 (en) * 2003-11-04 2005-05-05 Taiwan Semiconductor Manufacturing Co. Ltd. Edge-contact wafer holder for CMP load/unload station
US8317968B2 (en) 2004-04-30 2012-11-27 Lam Research Corporation Apparatus including gas distribution member supplying process gas and radio frequency (RF) power for plasma processing
JP2006049770A (ja) * 2004-08-09 2006-02-16 Taiyo Nippon Sanso Corp 気相成長装置
DE102005045718B4 (de) * 2005-09-24 2009-06-25 Applied Materials Gmbh & Co. Kg Träger für ein Substrat
JP5030542B2 (ja) * 2006-11-10 2012-09-19 株式会社日立ハイテクノロジーズ 真空処理装置
US8375890B2 (en) 2007-03-19 2013-02-19 Micron Technology, Inc. Apparatus and methods for capacitively coupled plasma vapor processing of semiconductor wafers
FR2923946A1 (fr) * 2007-11-21 2009-05-22 Alcatel Lucent Sas Equipement pour la fabrication de semi-conducteurs, dispositif de pompage et porte-substrat correspondant
JP2009147171A (ja) * 2007-12-14 2009-07-02 Tokyo Electron Ltd プラズマ処理装置
US20090165721A1 (en) * 2007-12-27 2009-07-02 Memc Electronic Materials, Inc. Susceptor with Support Bosses
US8161906B2 (en) 2008-07-07 2012-04-24 Lam Research Corporation Clamped showerhead electrode assembly
US8206506B2 (en) * 2008-07-07 2012-06-26 Lam Research Corporation Showerhead electrode
US8221582B2 (en) 2008-07-07 2012-07-17 Lam Research Corporation Clamped monolithic showerhead electrode
JP5231117B2 (ja) * 2008-07-24 2013-07-10 株式会社ニューフレアテクノロジー 成膜装置および成膜方法
US20100055330A1 (en) * 2008-08-28 2010-03-04 Hermes Systems Inc. Epitaxy Processing System and Its Processing Method
WO2010065473A2 (en) * 2008-12-01 2010-06-10 Applied Materials, Inc. Gas distribution blocker apparatus
US8760187B2 (en) 2008-12-03 2014-06-24 L-3 Communications Corp. Thermocentric alignment of elements on parts of an apparatus
US8054180B1 (en) * 2008-12-08 2011-11-08 Amazon Technologies, Inc. Location aware reminders
JP5361448B2 (ja) * 2009-02-27 2013-12-04 株式会社日立ハイテクノロジーズ プラズマ処理装置
US8402918B2 (en) * 2009-04-07 2013-03-26 Lam Research Corporation Showerhead electrode with centering feature
US8272346B2 (en) 2009-04-10 2012-09-25 Lam Research Corporation Gasket with positioning feature for clamped monolithic showerhead electrode
US8147614B2 (en) * 2009-06-09 2012-04-03 Applied Materials, Inc. Multi-gas flow diffuser
JP4758500B2 (ja) * 2009-07-21 2011-08-31 シャープ株式会社 加熱処理装置
JP5650935B2 (ja) * 2009-08-07 2015-01-07 東京エレクトロン株式会社 基板処理装置及び位置決め方法並びにフォーカスリング配置方法
SG169960A1 (en) * 2009-09-18 2011-04-29 Lam Res Corp Clamped monolithic showerhead electrode
JP3160877U (ja) 2009-10-13 2010-07-15 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ シャワーヘッド電極アセンブリの端部クランプ留めおよび機械固定される内側電極
WO2011146571A2 (en) * 2010-05-21 2011-11-24 Applied Materials, Inc. Tightly-fitted ceramic insulator on large-area electrode
JP5885939B2 (ja) * 2010-07-20 2016-03-16 東京エレクトロン株式会社 シールド部材及びシールド部材を備えた基板載置台
US8573152B2 (en) 2010-09-03 2013-11-05 Lam Research Corporation Showerhead electrode
DE102011007682A1 (de) * 2011-04-19 2012-10-25 Siltronic Ag Suszeptor zum Abstützen einer Halbleiterscheibe und Verfahren zum Abscheiden einer Schicht auf einer Vorderseite einer Halbleiterscheibe
JP5667012B2 (ja) * 2011-08-26 2015-02-12 東京エレクトロン株式会社 リング状シールド部材、その構成部品及びリング状シールド部材を備えた基板載置台
JP6013155B2 (ja) * 2012-11-28 2016-10-25 大陽日酸株式会社 気相成長装置
JP6135272B2 (ja) * 2013-04-19 2017-05-31 住友電気工業株式会社 基板固定冶具
DE102013107875A1 (de) * 2013-07-23 2015-02-19 Von Ardenne Gmbh Substrathaltevorrichtung und Prozesskammer
JP6383647B2 (ja) * 2014-11-19 2018-08-29 東京エレクトロン株式会社 測定システムおよび測定方法
KR102187839B1 (ko) * 2014-11-28 2020-12-08 (주)테크윙 테스트핸들러
JP5941971B2 (ja) * 2014-12-10 2016-06-29 東京エレクトロン株式会社 リング状シールド部材及びリング状シールド部材を備えた基板載置台
JP2016127185A (ja) * 2015-01-06 2016-07-11 東京エレクトロン株式会社 シールドリングおよび基板載置台
US10658222B2 (en) * 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
TW201641209A (zh) * 2015-05-21 2016-12-01 漢磊科技股份有限公司 工件夾持器
KR102615853B1 (ko) * 2015-10-15 2023-12-21 어플라이드 머티어리얼스, 인코포레이티드 기판 캐리어 시스템
DE102015220924B4 (de) 2015-10-27 2018-09-27 Siltronic Ag Suszeptor zum Halten einer Halbleiterscheibe mit Orientierungskerbe, Verfahren zum Abscheiden einer Schicht auf einer Halbleiterscheibe und Halbleiterscheibe
US20180033673A1 (en) * 2016-07-26 2018-02-01 Applied Materials, Inc. Substrate support with in situ wafer rotation
US10622243B2 (en) 2016-10-28 2020-04-14 Lam Research Corporation Planar substrate edge contact with open volume equalization pathways and side containment
DE102017206671A1 (de) * 2017-04-20 2018-10-25 Siltronic Ag Suszeptor zum Halten einer Halbleiterscheibe mit Orientierungskerbe während des Abscheidens einer Schicht auf einer Vorderseite der Halbleiterscheibe und Verfahren zum Abscheiden der Schicht unter Verwendung des Suszeptors
US20190048467A1 (en) * 2017-08-10 2019-02-14 Applied Materials, Inc. Showerhead and process chamber incorporating same
US20190287835A1 (en) * 2018-02-01 2019-09-19 Yield Engineering Systems, Inc. Interchangeable Edge Rings For Stabilizing Wafer Placement And System Using Same
DE102019114249A1 (de) * 2018-06-19 2019-12-19 Aixtron Se Anordnung zum Messen der Oberflächentemperatur eines Suszeptors in einem CVD-Reaktor
JP7130536B2 (ja) * 2018-11-30 2022-09-05 京セラ株式会社 試料保持具
KR20220018014A (ko) * 2019-06-06 2022-02-14 램 리써치 코포레이션 회전 정렬이 필요한 에지 링의 자동화된 이송
TW202341343A (zh) * 2021-12-23 2023-10-16 日商東京威力科創股份有限公司 基板支持器及電漿處理裝置

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KR100243784B1 (ko) * 1990-12-05 2000-02-01 조셉 제이. 스위니 웨이퍼의 전방부 모서리와후방부에서의 증착을 방지하는 cvd웨이퍼 처리용 수동 실드
US5584936A (en) * 1995-12-14 1996-12-17 Cvd, Incorporated Susceptor for semiconductor wafer processing
US5863340A (en) * 1996-05-08 1999-01-26 Flanigan; Allen Deposition ring anti-rotation apparatus
US5846332A (en) * 1996-07-12 1998-12-08 Applied Materials, Inc. Thermally floating pedestal collar in a chemical vapor deposition chamber

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180098704A (ko) * 2008-10-31 2018-09-04 에이에스엠 아메리카, 인코포레이티드 자가 중심설정 서셉터 링 조립체
US11387137B2 (en) 2008-10-31 2022-07-12 Asm Ip Holding B.V. Self-centering susceptor ring assembly
KR20150104813A (ko) * 2014-03-06 2015-09-16 피에스케이 주식회사 기판 처리 장치 및 방법
KR20210093762A (ko) * 2020-01-20 2021-07-28 도쿄엘렉트론가부시키가이샤 기판을 처리하는 장치, 및 기판을 처리하는 방법
KR20220150493A (ko) * 2021-05-03 2022-11-11 세메스 주식회사 기판 처리 장치

Also Published As

Publication number Publication date
US6368450B2 (en) 2002-04-09
US20010047762A1 (en) 2001-12-06
JP2001525997A (ja) 2001-12-11
KR100434790B1 (ko) 2004-06-07
WO1998053484A1 (en) 1998-11-26

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