KR19990067338A - 접착제와 보호벽이 있는 캐리어 테이프 - Google Patents

접착제와 보호벽이 있는 캐리어 테이프 Download PDF

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Publication number
KR19990067338A
KR19990067338A KR1019980703343A KR19980703343A KR19990067338A KR 19990067338 A KR19990067338 A KR 19990067338A KR 1019980703343 A KR1019980703343 A KR 1019980703343A KR 19980703343 A KR19980703343 A KR 19980703343A KR 19990067338 A KR19990067338 A KR 19990067338A
Authority
KR
South Korea
Prior art keywords
carrier tape
walls
wall
adhesive
receiving surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1019980703343A
Other languages
English (en)
Korean (ko)
Inventor
엘. 쉔쯔 제임스
Original Assignee
스프레이그 로버트 월터
미네소타마이닝 앤드 매뉴팩춰링 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스프레이그 로버트 월터, 미네소타마이닝 앤드 매뉴팩춰링 캄파니 filed Critical 스프레이그 로버트 월터
Publication of KR19990067338A publication Critical patent/KR19990067338A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G35/00—Mechanical conveyors not otherwise provided for
    • B65G35/04—Mechanical conveyors not otherwise provided for comprising a flexible load carrier, e.g. a belt, which is wound up at one end and paid out at the other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
KR1019980703343A 1995-11-13 1996-09-18 접착제와 보호벽이 있는 캐리어 테이프 Abandoned KR19990067338A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8/559187 1995-11-13
US08/559,187 US5765692A (en) 1995-11-13 1995-11-13 Carrier tape with adhesive and protective walls
PCT/US1996/014974 WO1997018580A1 (en) 1995-11-13 1996-09-18 Carrier tape with adhesive and protective walls

Publications (1)

Publication Number Publication Date
KR19990067338A true KR19990067338A (ko) 1999-08-16

Family

ID=24232633

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980703343A Abandoned KR19990067338A (ko) 1995-11-13 1996-09-18 접착제와 보호벽이 있는 캐리어 테이프

Country Status (6)

Country Link
US (1) US5765692A (enExample)
EP (1) EP0861502A1 (enExample)
JP (1) JP2000500720A (enExample)
KR (1) KR19990067338A (enExample)
TW (1) TW363042B (enExample)
WO (1) WO1997018580A1 (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
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WO1997043891A1 (en) * 1996-05-10 1997-11-20 Matsushita Electric Industrial Co., Ltd. Component assembling method and component assembling apparatus
JP2887110B2 (ja) * 1996-05-30 1999-04-26 日昌株式会社 電子部品の搬送帯
US6059116A (en) * 1996-06-21 2000-05-09 Thermalloy, Inc. Heat sink packaging devices
US6142306A (en) * 1997-05-21 2000-11-07 Nissho Corporation Carrier band of electronic parts
JPH10324388A (ja) * 1997-05-21 1998-12-08 Matsushita Electric Ind Co Ltd 電子部品の搬送帯
US6027802A (en) * 1997-10-23 2000-02-22 Four Piliars Enterprise Co., Ltd. Cover tape for packaging
US6329224B1 (en) * 1998-04-28 2001-12-11 Tessera, Inc. Encapsulation of microelectronic assemblies
US6205745B1 (en) * 1998-05-27 2001-03-27 Lucent Technologies Inc. High speed flip-chip dispensing
US5966903A (en) * 1998-05-27 1999-10-19 Lucent Technologies Inc. High speed flip-chip dispensing
US6357594B1 (en) * 1998-06-30 2002-03-19 Tempo G Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
DE19902196C1 (de) * 1999-01-21 2000-06-15 Lohmann Therapie Syst Lts Vorrichtung zum Verpacken von haftklebenden Substratabschnitten und ihre Verwendung
US6703120B1 (en) 1999-05-05 2004-03-09 3M Innovative Properties Company Silicone adhesives, articles, and methods
US6412641B1 (en) * 2000-06-19 2002-07-02 Advanced Micro Devices, Inc. Packaging for encapsulated dice employing EMR-sensitive adhesives
US6966440B1 (en) * 2002-08-12 2005-11-22 Autosplice Systems, Inc. Tape-packaged headed pin contact
JP4208187B2 (ja) * 2002-10-28 2009-01-14 日東電工株式会社 粘着型光学フィルム、粘着型光学フィルムの製造方法および画像表示装置
JP4517856B2 (ja) * 2004-12-27 2010-08-04 Ｔｄｋ株式会社 電子部品連
BRPI0606316A2 (pt) * 2005-01-20 2017-06-27 3M Innovative Properties Co método para formar uma película polimérica estruturada, e , artigo de processamento de amostra
US20060157381A1 (en) * 2005-01-20 2006-07-20 Adams James T Component carrier and method for making
US20060293438A1 (en) * 2005-06-23 2006-12-28 3M Innovative Properties Company Carrier tapes and compositions thereof
US20070096345A1 (en) * 2005-11-03 2007-05-03 Vishay Vitramon Inc. Frame packaged array electronic component
US20080006922A1 (en) * 2006-07-08 2008-01-10 Charles Gutentag Thermal release adhesive-backed carrier tapes
ES2322002B1 (es) * 2006-12-12 2010-03-03 Jaime Morente Heredia Procedimiento de fabricacion de envases isotermicos de poliuretano.
WO2008120248A1 (en) * 2007-03-30 2008-10-09 Baccini Spa Device to transport support elements for electronic circuits, in particular photovoltaic cells, along a working line
EP2195350B1 (en) * 2007-09-14 2013-07-24 3M Innovative Properties Company Ultra low viscosity iodine containing amorphous fluoropolymers
JP2009130317A (ja) * 2007-11-28 2009-06-11 Seiko Epson Corp フィルム状接着剤及びその搬送方法
US20090262453A1 (en) * 2008-04-22 2009-10-22 Texas Instruments, Inc. Carrier tape having localized adhesive in cavity regions
US8205766B2 (en) * 2009-05-20 2012-06-26 The Bergquist Company Method for packaging thermal interface materials
JP6238506B2 (ja) * 2011-04-07 2017-11-29 日産自動車株式会社 接合装置、および接合方法
CN104470824A (zh) * 2012-07-20 2015-03-25 3M创新有限公司 具有紫外线辐射固化性粘合剂的部件承载带
US9984914B2 (en) * 2015-09-02 2018-05-29 Qualcomm Incorporated Carrier tape
US10093468B2 (en) * 2016-05-18 2018-10-09 Semiconductor Components Industries, Llc Carrier tape with standoff units
US11452249B2 (en) * 2017-12-11 2022-09-20 Delphon Industries, Llc Carrier for reversibly immobilizing one or more objects
WO2021163651A1 (en) * 2020-02-14 2021-08-19 Sunna Chung Rigid carrier assemblies with tacky media molded thereon
USD1094325S1 (en) 2021-08-24 2025-09-23 Vishay Dale Electronics, Llc Electro-magnetic device

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1320692A (en) * 1919-11-04 Ssay-stess
US3608711A (en) * 1969-10-06 1971-09-28 Teledyne Inc Package for electronic devices and the like
US3695414A (en) * 1970-11-27 1972-10-03 Teledyne Inc Die sorting system
GB2040569B (en) * 1978-12-26 1983-09-01 Murata Manufacturing Co Chip-like electronic component series and method for supplying chip-like electronic components
DE2908624A1 (de) * 1979-03-06 1980-09-11 Elmeg Verfahren und vorrichtung zum magazinieren und/oder zum zufuehren von bauelementen
NL7907599A (nl) * 1979-10-15 1981-04-21 Philips Nv Verpakking voor electronische componenten.
NL8005052A (nl) * 1980-09-08 1982-04-01 Philips Nv Verpakking voor elektrische en/of elektronische componenten.
US4657137A (en) * 1981-05-22 1987-04-14 North American Philips Corporation Multi-chip packaging system
JPS5923597A (ja) * 1982-07-29 1984-02-07 奥井　徳次郎 小型電子部品の収納方法
JPS59158596A (ja) * 1983-02-28 1984-09-08 奥井　徳次郎 小型電子部品の収納方法
US4736841A (en) * 1985-02-20 1988-04-12 Murata Manufacturing Co., Ltd. Electronic component series
GB2203676B (en) * 1987-02-25 1991-03-20 Tdk Corp Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series
JPH0741595B2 (ja) * 1988-06-11 1995-05-10 武士 山本 紙製キャリアテープの製造方法およびその製造方法に使用する金型
US4966281A (en) * 1988-09-09 1990-10-30 Nitto Denko Corporation Electronic component carrier
US4966282A (en) * 1989-01-13 1990-10-30 Nitto Denko Corporation Electronic component carrier
JPH04128147A (ja) * 1990-09-11 1992-04-28 Toyo Chem Co Ltd チップキャリヤ―テープ
JPH0662171B2 (ja) * 1990-09-27 1994-08-17 徳次郎 奥井 電子部品収納用キャリアテープ
US5150787A (en) * 1991-02-21 1992-09-29 Minnesota Mining And Manufacturing Company Component carrier tape
US5132160A (en) * 1991-02-21 1992-07-21 Minnesota Mining And Manufacturing Company Component carrier tape
JPH05112380A (ja) * 1991-09-09 1993-05-07 Fujitsu Miyagi Electron:Kk Ｉｃ収納カセツト
US5203143A (en) * 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
US5325654A (en) * 1992-06-19 1994-07-05 Minnesota Mining And Manufacturing Company Carrier tape with cover strip
US5491013A (en) * 1994-08-31 1996-02-13 Rexam Industries Corp. Static-dissipating adhesive tape

Also Published As

Publication number Publication date
TW363042B (en) 1999-07-01
EP0861502A1 (en) 1998-09-02
US5765692A (en) 1998-06-16
WO1997018580A1 (en) 1997-05-22
JP2000500720A (ja) 2000-01-25

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 19980506

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20010918

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20031121

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20040908

NORF Unpaid initial registration fee
PC1904 Unpaid initial registration fee