WO2008120248A1 - Device to transport support elements for electronic circuits, in particular photovoltaic cells, along a working line - Google Patents
Device to transport support elements for electronic circuits, in particular photovoltaic cells, along a working line Download PDFInfo
- Publication number
- WO2008120248A1 WO2008120248A1 PCT/IT2007/000238 IT2007000238W WO2008120248A1 WO 2008120248 A1 WO2008120248 A1 WO 2008120248A1 IT 2007000238 W IT2007000238 W IT 2007000238W WO 2008120248 A1 WO2008120248 A1 WO 2008120248A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- support elements
- plastic material
- flexible plastic
- transport
- Prior art date
Links
- 239000000463 material Substances 0.000 claims abstract description 33
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 229920002457 flexible plastic Polymers 0.000 claims abstract description 13
- 229920002799 BoPET Polymers 0.000 claims description 2
- 229920000271 Kevlar® Polymers 0.000 claims description 2
- 229920002577 polybenzoxazole Polymers 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 235000013305 food Nutrition 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G15/00—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
- B65G15/30—Belts or like endless load-carriers
- B65G15/58—Belts or like endless load-carriers with means for holding or retaining the loads in fixed position, e.g. magnetic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G35/00—Mechanical conveyors not otherwise provided for
- B65G35/04—Mechanical conveyors not otherwise provided for comprising a flexible load carrier, e.g. a belt, which is wound up at one end and paid out at the other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- a single film 13 is provided, wound around the annular belt 16, and a gluer member 22 associated with a non-operative segment of the film 13, and able to deposit the adhesive material cyclically on the supporting surface of the film 13.
Abstract
Transport device (10) to transport support elements (11) in order to make photovoltaic cells or other electronic circuits, comprising a conveyor belt having a supporting surface on which the support elements (11) are positioned. The conveyor belt comprises at least a film (13) made of flexible plastic material and having a surface (15) covered, at least partly, with an adhesive material, and which defines the supporting surface. The adhesive material prevents the movement of the support elements (H) with respect to the film (13).
Description
"DEVICE TO TRANSPORT SUPPORT ELEMENTS FOR ELECTRONIC CIRCUITS, IN PARTICULAR PHOTOVOLTAIC CELLS, ALONG A WORKING
LINE"
* * * * * FIELD OF THE INVENTION
The present invention concerns a device to transport one or more support elements, for example silicon-based, known as wafers, in order to make photovoltaic cells, multi-layer printed circuits or more generally any electronic circuit, between different operating positions or work stations in a working or production line.
BACKGROUND OF THE INVENTION
It is known that photovoltaic cells, printed circuits or more generally electronic circuits substantially consist of a silicon support element, or wafer, on which a plurality of conductive tracks or other metalized or metalization elements are deposited.
Normally in methods to produce electronic circuits the silicon support element is moved by means of a transport device from a storage unit to at least a serigraphic printing station, where the conductive tracks are deposited. In other known solutions, the transport device moves the support element between other operating or working stations, for example for finishing the edges of the support, for completing the tracks, drying them or other operations.
A requirement present in such production methods is to guarantee a repeatable and extremely precise positioning, even in the range of thousandths of a millimeter, of the silicon support element with respect to the operating stations, in particular the serigraphic printing station.
To guarantee this, different techniques are known to move and position the support elements, which provide to use
complex and costly transport devices.
In particular, it is known to use a conveyor belt made of fabric or rubber, provided with through holes or made with holed meshes, below which a suction unit is provided which creates a depression that keeps the support elements in contact with the belt, thus preventing it from moving with respect thereto.
Known transport means not only have the disadvantage of being costly and requiring the suction unit, but also they tend to get dirty easily, and so tend to transport the dirt onto the support element to be transported.
To prevent this, known belts have to be cleaned or replaced frequently.
Other known devices provide to use rather sophisticated and complex mechanisms, which use robotized units and sucker members to transport the support elements, or complex alignment and adjustment members that use preliminary optical detection apparatuses that identify the position, and members to correct the position of the support elements.
In any case, known solutions are extremely costly, both with regard to their production, considering the complexity of the components, and also with regard to their programming and operating management, since they require specific interventions to program and install dedicated electric and/or pneumatic plants.
Furthermore, known transport devices have the disadvantage that they require long maintenance times, with a consequent increase in management costs . Purpose of the present invention is to achieve a device to transport silicon-based support elements which not only guarantees that the positioning of the support elements is maintained with absolute precision, during their
displacement from one operating station to the other, but is also simple and economical to make and which at the same time does not entail high management and maintenance costs.
The Applicant has devised, tested and embodied the present invention to overcome the shortcomings of the state of the art and to obtain these and other purposes and advantages .
SUMMARY OF THE INVENTION
The present invention is set forth and characterized in the independent claim, while the dependent claims describe other characteristics of the invention or variants to the main inventive idea.
In accordance with the above purpose, a transport device according to the present invention is able to transport silicon-based support elements between several operating positions or work stations, and provides to use at least a conveyor belt made using at least a film of plastic material, having at least a supporting surface on which the support elements are able to be positioned. According to a characteristic feature of the present invention, on the supporting surface of the film there is an at least partly adhesive material, able to prevent the support elements from moving with respect to the film.
The film of plastic material, which by its nature is flexible, is disposed in association with said work stations, and is able to be moved in order to transport the support elements between one work station and the other.
The film of plastic material advantageously consists of a product already on the market, and currently used for other purposes, such as for example films for wrapping food or other products. The thickness of the film, and hence its resistance to traction and/or breakage, is chosen according to the specific applications and size of the conveyor belt
to be made .
In this way, simple by providing to use a film of plastic material covered externally with an adhesive material, the correct and univocal positioning of the support element through the different operating positions is guaranteed, without needing to provide complex suction and/or robotized members or devices .
With the present invention it is therefore possible to reduce the costs of producing transport devices with respect to those of transport devices in the state of the art.
Moreover, the film of plastic material on which the at least partly adhesive material is present is easily and quickly replaceable, for example if its adhesive characteristics should fail, or if the supporting surface should get dirty, thus determining a reduction in the times and costs of maintenance interventions .
Another advantage of the present invention is the easy operating management of the transport device, which substantially does not require any specialized intervention or the installation of dedicated plants and/or specific programs for the functioning thereof .
In one form of embodiment of the present invention, the film of plastic material is supported from below by a support means, which defines a substantial planarity of its supporting surface.
According to another form of embodiment, the film of plastic material on which the at least partly adhesive material is present is disposed above, or to cover, a traditional conveyor belt disposed annularly between two drive pulleys.
BRIEF DESCRIPTION OF THE DRAWINGS These and other characteristics of the present invention
will become apparent from the following description of a preferential form of embodiment, given as a non-restrictive example with reference to the attached drawings wherein:
- fig. 1 is a three-dimensional view of a segment of the transport device according to the present invention;
- fig. 2 is a schematic and lateral view of the transport device in fig. 1;
- fig. 3 is a schematic and lateral view of a first variant of the transport device in fig. 1;
- fig. 4 shows an enlarged section of the transport device in fig. 3;
- fig. 5 is a schematic view of a second variant of the transport device in fig. 1; - fig. 6 is a schematic view of a third variant of the transport device in fig. 1. DETAILED DESCRIPTION OF A PREFERENTIAL FORM OF EMBODIMENT
With reference to the attached drawings, a transport device 10 according to the present invention is able to transport a plurality of support elements or wafers 11, silicon based, through an operating station, in this case a serigraphic printing station 12, in order to deposit on the surface of the wafers 11 a plurality of conductive tracks, in order to achieve for example a photovoltaic cell, a multi-layer printed circuit or other electronic circuits.
The transport device 10 according to the invention comprises a film 13 made of flexible plastic material and having a supporting surface 15 on which the wafers 11 are positioned in order to be transported through the serigraphic printing station 12.
In this case, the flexible plastic material that forms the film 13 is polyester, for example of the type known commercially as Domopack®.
According to a first variant, the flexible plastic material is vinyl.
According to another variant, the flexible plastic material is mylar®. According to another variant, the flexible plastic material is kevlar®.
According to another variant, the flexible plastic material is PBO, for example zylon®.
In particular, on the supporting surface 15 of the film 13 there is an adhesive material having an adhesion force such as to prevent each wafer 11 from moving with respect to the film 13, once it is positioned on the supporting surface 15 of the latter and during its transportation through the serigraphic printing station 12. In the same way, the adhesive material present on the supporting surface 15 is such as to allow the wafer 11 to be easily removed downstream of . the serigraphic printing station 12.
An example of the adhesive material is that present on the transparent films normally used for the preservation of food in the house.
In the form of embodiment shown in figs. 1 and 2, the film 13 is wound between two reels 14, which not only cause it to advance along a determinate direction but also keep it under tension for a rectilinear segment 20, provided in correspondence with the serigraphic printing station 12.
In this embodiment, each new wafer 11 is positioned on a new portion of film 13, so as not to find any residual dirt, and hence guarantee an optimum positioning with absolute precision. In the variant form of embodiment shown in figs. 3 and 4, the film 13 is disposed next to the external surface of an annular belt 16, which is traditionally tensed and moved by means of two respective pulleys 17.
In this case, under the rectilinear segment 20 of the annular belt 16, here too provided in correspondence with the serigraphic printing station 12, a supporting plane 19 is disposed that allows to define a substantial planarity of said rectilinear segment 20 of the annular belt 16 and consequently the film 13 disposed on said segment 20. In this way, the planar positioning of the wafers 11 on the film 13 is guaranteed, at least in correspondence with the serigraphic printing station 12. In this embodiment, after a predefined number of operating cycles, the film 13 is removed, and replaced by a new film 13 simply by winding the latter onto the annular belt 16.
In the variant form of embodiment shown in fig. 5, the film 13 is wound between two respective reels 21, disposed at the side of the annular belt, 16 and able to feed the film 13, in order to keep it disposed along the rectilinear segment 20 of the annular belt 16. Advantageously, the reels 21 feed the film 13 at a speed substantially corresponding, or in any case coordinated, with the speed of movement of the annular belt 16.
As shown in the variant form of embodiment in fig. 6, a single film 13 is provided, wound around the annular belt 16, and a gluer member 22 associated with a non-operative segment of the film 13, and able to deposit the adhesive material cyclically on the supporting surface of the film 13.
It is clear that modifications and/or additions of parts may be made to the transport device 10 as described heretofore, without departing from the field and scope of the present invention.
For example, it comes within the field of the present invention to provide that the film 13 is supported directly
by the supporting plane 19 and moved by the pulleys 17, without the intercession of the annular belt 16.
It also comes within the field of the present invention to provide that the transport device 10 is associated with more than one operating station, for example an edging station, a completion station, a drying station and others. In this embodiment, the transport device 10 according to the present invention allows to feed the wafer 11 between one and the other of the operating stations, guaranteeing that the relative positioning of the wafer 11 is maintained.
It is also clear that, although the present invention has been described with reference to specific examples, a person of skill in the art shall certainly be able to achieve many other equivalent forms of device to transport support elements in order to make photovoltaic cells or other electronic circuits, having the characteristics as set forth in the claims and hence all coming within the field of protection defined thereby.
Claims
1. Transport device to transport support elements (11) in order to make photovoltaic cells or other electronic circuits, comprising at least a conveyor belt having a supporting surface on which said support elements (11) are able to be positioned, characterized in that said conveyor belt comprises at least a film (13) made of flexible plastic material and having a surface (15) covered, at least partly, with an adhesive material, and which defines said supporting surface, said adhesive material preventing the movement of said support elements (11) with respect to said film ( 13) .
2. Device as in claim 1, characterized in that said flexible plastic material of said film (13) is polyester.
3. Device as in claim 1, characterized in that said flexible plastic material of said film (13) is vinyl.
4. Device as in claim 1, characterized in that said flexible plastic material of said film (13) is mylar®.
5. Device as in claim 1, characterized in that said flexible plastic material of said film (13) is kevlar®.
6. Device as in claim 1, characterized in that said flexible plastic material of said film (13) is PBO, e.g. zylon®.
7. Device as in any claim hereinbefore, characterized in that said film (13) is wound between two reels (14).
8. Device as in any claim hereinbefore, characterized in that said film (13) is disposed on a rectilinear segment (20) of an annular belt (16), which is moved by means of respective pulleys (17).
9. Device as in claim 8, characterized in that said film (13) is wound around said annular belt (16).
10. Device as in claim 9, characterized in that said film (13) is fed onto said annular belt (16) by means of two respective "reels (21).
11. Device as in any claim hereinbefore, characterized in that under said film (13) a supporting plane (19) is provided, which allows to define a substantially plane segment, so as to guarantee the positioning planarity of said support elements (11) on said surface (15) of said film (13).
12. Device as in any claim hereinbefore, characterized in that it also comprises a gluer member (22) associated with a non-operating segment of said film (13), and able to deposit said at least partly adhesive material cyclically on said surface (15) of said film (13).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/IT2007/000238 WO2008120248A1 (en) | 2007-03-30 | 2007-03-30 | Device to transport support elements for electronic circuits, in particular photovoltaic cells, along a working line |
| TW097110750A TW200845270A (en) | 2007-03-30 | 2008-03-26 | Device to transport support elements for electronic circuits, in particular photovoltaic cells, along a working line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/IT2007/000238 WO2008120248A1 (en) | 2007-03-30 | 2007-03-30 | Device to transport support elements for electronic circuits, in particular photovoltaic cells, along a working line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008120248A1 true WO2008120248A1 (en) | 2008-10-09 |
Family
ID=38578506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/IT2007/000238 WO2008120248A1 (en) | 2007-03-30 | 2007-03-30 | Device to transport support elements for electronic circuits, in particular photovoltaic cells, along a working line |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW200845270A (en) |
| WO (1) | WO2008120248A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009153160A1 (en) * | 2008-06-19 | 2009-12-23 | Applied Materials Baccini Spa Con Socio Unico | Accurate conveyance system useful for screen printing |
| EP2325121A1 (en) * | 2009-11-18 | 2011-05-25 | EV Group E. Thallner GmbH | Transport system for holding and transporting flexible substrates |
| CN103138009A (en) * | 2013-03-25 | 2013-06-05 | 天津力神电池股份有限公司 | Device for automatically attaching adhesive tape on side edge of cell |
| DE102018205157A1 (en) * | 2018-04-05 | 2019-10-10 | Ekra Automatisierungssysteme Gmbh | printing device |
| US11924978B2 (en) | 2018-04-18 | 2024-03-05 | Ekra Automatisierungssysteme Gmbh | Printing system for printing substrates, method for operating the printing system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5033615A (en) * | 1988-02-15 | 1991-07-23 | Tomoegawa Paper Co., Ltd. | Wrapped glass cap article |
| WO1997018580A1 (en) * | 1995-11-13 | 1997-05-22 | Minnesota Mining And Manufacturing Company | Carrier tape with adhesive and protective walls |
| US7097040B1 (en) * | 2005-08-05 | 2006-08-29 | Charles Gutentag | Adhesive backed carrier tape with calibrated levels of low tack adhesion for retention of small components |
-
2007
- 2007-03-30 WO PCT/IT2007/000238 patent/WO2008120248A1/en unknown
-
2008
- 2008-03-26 TW TW097110750A patent/TW200845270A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5033615A (en) * | 1988-02-15 | 1991-07-23 | Tomoegawa Paper Co., Ltd. | Wrapped glass cap article |
| WO1997018580A1 (en) * | 1995-11-13 | 1997-05-22 | Minnesota Mining And Manufacturing Company | Carrier tape with adhesive and protective walls |
| US7097040B1 (en) * | 2005-08-05 | 2006-08-29 | Charles Gutentag | Adhesive backed carrier tape with calibrated levels of low tack adhesion for retention of small components |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009153160A1 (en) * | 2008-06-19 | 2009-12-23 | Applied Materials Baccini Spa Con Socio Unico | Accurate conveyance system useful for screen printing |
| EP2325121A1 (en) * | 2009-11-18 | 2011-05-25 | EV Group E. Thallner GmbH | Transport system for holding and transporting flexible substrates |
| US8931624B2 (en) | 2009-11-18 | 2015-01-13 | Ev Group E. Thallner Gmbh | Transport system for accommodating and transporting flexible substrates |
| CN103138009A (en) * | 2013-03-25 | 2013-06-05 | 天津力神电池股份有限公司 | Device for automatically attaching adhesive tape on side edge of cell |
| DE102018205157A1 (en) * | 2018-04-05 | 2019-10-10 | Ekra Automatisierungssysteme Gmbh | printing device |
| CN111989221A (en) * | 2018-04-05 | 2020-11-24 | Ekra自动化系统有限公司 | Printing equipment |
| CN111989221B (en) * | 2018-04-05 | 2022-05-31 | Ekra自动化系统有限公司 | Printing equipment |
| US11577502B2 (en) | 2018-04-05 | 2023-02-14 | Ekra Automatisierungssysteme Gmbh | Printing device |
| US11924978B2 (en) | 2018-04-18 | 2024-03-05 | Ekra Automatisierungssysteme Gmbh | Printing system for printing substrates, method for operating the printing system |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200845270A (en) | 2008-11-16 |
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