TW200845270A - Device to transport support elements for electronic circuits, in particular photovoltaic cells, along a working line - Google Patents

Device to transport support elements for electronic circuits, in particular photovoltaic cells, along a working line Download PDF

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Publication number
TW200845270A
TW200845270A TW097110750A TW97110750A TW200845270A TW 200845270 A TW200845270 A TW 200845270A TW 097110750 A TW097110750 A TW 097110750A TW 97110750 A TW97110750 A TW 97110750A TW 200845270 A TW200845270 A TW 200845270A
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Taiwan
Prior art keywords
film
plastic material
flexible plastic
support
support elements
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TW097110750A
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Chinese (zh)
Inventor
Andrea Baccini
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Baccini Spa
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Publication of TW200845270A publication Critical patent/TW200845270A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G15/00Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
    • B65G15/30Belts or like endless load-carriers
    • B65G15/58Belts or like endless load-carriers with means for holding or retaining the loads in fixed position, e.g. magnetic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G35/00Mechanical conveyors not otherwise provided for
    • B65G35/04Mechanical conveyors not otherwise provided for comprising a flexible load carrier, e.g. a belt, which is wound up at one end and paid out at the other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Transport device (10) to transport support elements (11) in order to make photovoltaic cells or other electronic circuits, comprising a conveyor belt having a supporting surface on which the support elements (11) are positioned. The conveyor belt comprises at least a film (13) made of flexible plastic material and having a surface (15) covered, at least partly, with an adhesive material, and which defines the supporting surface. The adhesive material prevents the movement of the support elements (11) with respect to the film (13).

Description

200845270 九、發明說明: 【發明所屬^技術領域】 發明領域 月係H種用來在一作業或生產線的不同操作位 ^工站之間輸送—歧多支持元件(舉例來說,以石夕為 二二:為晶圓者),以製造光伏打電池、多層印刷電路 或疋更廣泛之任何電子電路的裝置有關。 t my 】 發明背景 10 15 =光伏打電池、犠路或是更廣泛之電子電路200845270 IX. INSTRUCTIONS: [Technical field of the invention] Field of the invention H-type H is used to transport between different operation stations of a work or production line - multiple support components (for example, Shi Xiwei 22: for the waferr), for the manufacture of photovoltaic cells, multilayer printed circuits or devices for any of a wider range of electronic circuits. t my 】 Background of the invention 10 15 = Photovoltaic cells, circuits or a wider range of electronic circuits

/夕支持元件或晶圓所構成,在其等之上設置有 數個導電條或是其他之經金屬化或是金屬化元件。X 通常在用來生產電子電路的方法中, 藉著-輸送m自—财料移以、辑係 至少-網版印刷站。在其他的已知溶液;,•導:條之 在其他的作業或工作站(舉例來說,用來修破置會 邊緣、絲完成該等導電條、將其等乾燥或是進持几件的 業)之間移動該等支持元件。 订其他作 在此-生產方法中所出現的需求,係要 地並且係非常地精確之(甚至係為一 、可重覆 a厘的數千分 對於該工作站之\的矽支持元件定位 &之〜)相 版印刷站中。 別是在該網 為了要確保滿足此-需求,已知被提供 昂貴的輸送裝置來移動並且設置支 咬用啜雜而 炎持疋件之不同技術。 20 200845270 特別是’目則已知可以使用一由織物或橡膠所製成之 具有通孔或被製成具有孔洞之篩網的輸送帶,在其之下方 具有-會產生-將該支持元件轉在與該輸送帶接觸之低 壓的吸附單it,因而聽該场元件㈣於其而移動。 已知的輸送構件不僅具有昂貴並且需要吸附單元之缺 點’並且其料於地㈣而因此易於將灰塵傳送至欲被輸 送之支持元件上。 為了要避免此-情況,已知的輸送帶必須要時常被清 潔或更換。/ 夕 support components or wafers, on which are placed a number of conductive strips or other metallized or metallized components. X is usually used in the method of producing electronic circuits by means of - transporting m------- at least-screen printing stations. In other known solutions;, • guides: in other operations or workstations (for example, to repair the edge of the set, finish the conductive strips, dry them, or hold a few pieces) Move these support elements between them. Other requirements in this-production method are required and very precise (even one, repeatable a cents of thousands of points for the workstation's 矽 support component positioning & ~) Phase printing station. In order to ensure that this is met, it is known to provide expensive conveyors to move and set different techniques for biting with noisy and sturdy components. 20 200845270 In particular, it is known that it is possible to use a conveyor belt made of fabric or rubber with a through hole or a screen made of a hole, below which there is - will be generated - the support element is turned The low pressure adsorption unit is in contact with the conveyor belt, and thus the field element (4) is moved to move therewith. Known conveying members are not only expensive and require the disadvantage of the adsorption unit' and they are fed to the ground (4) and thus are easy to transfer dust to the support member to be transported. In order to avoid this, the known conveyor belts must be cleaned or replaced from time to time.

1U 15 ,、他提j—使用者之已知裝置係更為複雜而繁複的機 械裝置,其使用自動化單^㈣附構件來輸送該支持元 件:或是利主要制可以辨朗位置與構件,以校正該支 持7G件的位置的光學偵檢儀器之複雜的校準與調整構件。 =如何’已知的解決方式不但相對於其等之生產成 本:為=地昂貴’同時相對於其之規畫與作業管理該等 70件係為複雜的,因此盆蓉兩 安裝專㈣電⑽絲料敎關助來騎規畫與 持元係要完成―種裝置以輸送叫為基礎之支 動丄個的=該支持元件的定位在自-工作站移 係更簡單峨濟叫,並且在製造上 本案申要較面的管理與維護成本。 °月經設計、測試並具體化本發明,以克服 20 200845270 r 現^知技藝_並得到這些與其他之目的 L明内容^ 支沾 發明概要 本發明係於該等獨立項中 屬項則、力叫贿並制雜,而該等 屬棚Μ本Μ之其轉徵 基於上述之目的’—㈣士 μ峨%、之變化。 作章位置、據本發明之輸i«置可以在- 提供_至少-係基礎之支持元件’並 依據本發明之-特徵,在 ^持表面。 至少部分附著材料,其能=支表面上具有一 而移動。 μ支持7°件相對於該薄膜 該性質上係為可撓性 站而設置,並且可以被蒋…材貝機相對於該工作 送該支持元件。軸叫—巧轉另—主之間輸 該塑膠材質_係有利地 二:= 藉著這種方式,該*姓- 確而單-明確的位置:將:同的操作位置之正 蓋有一附荖材Μ、/ ϋ以僅僅藉著提供使用-外部覆 、’之塑膠材質薄膜來確保 的吸附及/或自動化構件或裝置。 ❿不—’ 5 附 10 15 ib 20 200845270 藉由本發明將可以因而減低與目前之習知技藝的輸送 裝置有關之製造輸送裝置的成本。 此外,舉例來說,如果其之附接特性失效或是如果該 支持表面變髒,該其上具有至少部分附著材料之塑膠材質 5 10 15 薄膜係可以被輕易地而快速地更換,因而可以減低維修中 止作業之時間與成本。 本發明之另一優點在於該輸送裝置易於作業管理,其 實貝上不*要任何特殊的協助或安料對其之功能的專用 設備及/或特殊之規晝。 在本^明的具體例之一形式中,該塑膠材質薄膜係藉 由-支持構件而自該下方加以支撐,該支持構件會界定一 係為八之支持表面的_實質平面。 #依據本案具體例之另-形式,該其上具有-至少部分 麥^材料之塑膠材,係被安置或覆蓋於—環狀地設 置在=個轉滑輪之_傳統輸送帶上。 圖式簡單說明 ㈣例些與其他特性將可以由17狀較佳形式的 述而變得明顯,該等具體例係為參照該等隨附 圖式喊供之非限定行具發例,其中: 為依據本發明輸送裝置部分之三維立體圖; :係為在第丨圖中之該輸送裝置的概要側視圖; 置的第一變化之概要 側視圖 =圖係為在第1圖中之該輸送裝 示之輸送裝置的放大剖面圖; 為在第3圖中所顯 20 200845270 第5圖係為在第i圖中之該輪 ^ ^ 犮置的弟貳k化之概要圖· 弟6圖係為在第丨圖中之該輪 【貧施方式】 展置㈣二變化之侧視圖。 較佳實施例之詳細說明 參考該等隨附的圖式,一 (在此一情況中為一網版印刷站 作站 上設置數個導電條,而完成例如==圓_表面 刷電路或是其他的電子線路。先伏打電池、-多層印 10 15 該依據本發明之輸送裝置 料所構成之薄膜13,並且具有二二:由可撓性塑膠材 、, 、育其上設置了該晶圓11以輪 迗通過網版印刷站12之支持表面15。 镧 t在此-情況中,形成該薄助之可撓性塑膠材料係為聚 酉曰舉例來說係為已知商業上可取得之0_叩齡淚型。 依據-第-變化,該可撓性塑膠材料係為乙烯樹脂。 依據另一變化,該可撓性塑膠材料係為mylar⑧。 依據另一變化,該可撓性塑膠材料係為kevlar⑧。 依據另一變化,該可撓性塑膠材料係為PBO,舉例來 說zyl〇n⑧。 特別是,在該薄膜13的支持表面15上帶有一附著材 料’其具有黏著力以避免每個晶圓11在被設置於後者之該 支持表面15上時,並於輸送通過網版印刷站12期間相對於 該薄膜13而移動。同樣地,在該支持表面15上出現之該附 著材料,因此允許該晶圓11可以在網版印刷站12之下游輕 200845270 易地移除。該附著㈣之一具體例係為通常初王見在用於保 存家用食物之透明薄膜上者。 在第1和2圖中所顯示之具體例的形式中,該薄膜13係 纏繞在該等二捲軸14之間,其不僅會使的其沿著-預定的 5方向前進,也可以將將在拉力下提供對應於該網版印刷站 12之一直線部分2〇。 在此一具體例中,每一新的晶圓丨丨都被設置於薄膜13 的新的4刀上以使其不會出現任何的殘渣,而因此可以絕 對的精送、度來確保一最適切的定位作用。 1〇 以在第3和4圖中所顯示之不同形式的具體例中,該薄 膜13係緊鄰於一環狀帶16的外表面而設置,該環狀帶係傳 統地由二個各別的滑輪17所拉緊並移動。 在此一情況中,在此同樣地對應於該網版印刷站丨2而 提供之該環狀帶16的直線部分2〇下方,係設置了一支持平 15面19以允許其界定一係為該環狀帶16的直線部分20之實質 平面,而結果該薄膜13係被設置於該部分2〇上。藉著這種 方式,可以確保該晶圓Π被至少對應於該網版印刷站12而 平面地定位於該薄膜13上。 在此一具體例中,在一預定數目之操作週期之後,該 20薄膜13係僅藉著將後者捲繞在該環狀帶16上而移除並以一 新的薄膜13來更換。 在第5圖中所顯示之具體例的變化中,該薄膜13係係 被纏繞於二個設置於該環狀帶16的直線部分20的該側邊之 各別的捲軸21之間,並且可以進給該薄膜13以將其維持成 200845270 沿著該環狀帶16的該直線部分2〇來設置。有利地,該捲軸 21係以一實質上對應於或無論如何係與該環狀帶μ之運動 協調的速度來進給該薄膜13。 如在第6圖中之具體例的變化所示,其提供一圍繞該 5環狀帶16而纏繞之單一薄膜13,以及一與該薄膜13之非作 用部分相連結之膠黏構件22,並且能夠在該薄膜13的支持 表面上循環地置放該附著材料。 ^ 很明顯的是,其可以如前述的進行該輸送裝置1〇之部 件的修改及/或添加,而不會背離本發明的領域和範圍。 10 舉例來說,假如該薄膜η係直接地由該支持平面19所 支撐並由該等滑輪17所移動,而不會與該環狀帶16交又的 5舌’其係落入本發明的領域裡面。 假如σ亥輸送裝置1()係與超過—個的工作站(例如一修邊 工作站、-修整m燥工作站以及其他工作站)相 連的其係落入本發明的領域裡面。在此一具體例中依 據本發明之該輸送裝置10允許在一個或另一個工作站之間 進,以確保其可以維持該晶圓11之相對位置。 同樣也报清楚的是,雖然本發明已經參照特定的具體 幻來加以4田述’但是—習於此藝者將無疑地可以完成許多 〇 Γ料切元件之其他等效形式的裝置,以製造光伏打 電子線路’爾置係具有在該申請專利範 a之特性,且因此係落於其藉此所界定之保護範 11 200845270 t圖式簡單說明3 第1圖係為依據本發明之一輸送裝置部分之三維立體圖; 第2圖係為在第1圖中之該輸送裝置的概要側視圖; 第3圖係為在第1圖中之該輸送裝置的第一變化之概要 5 側視圖; 第4圖係為在第3圖中所顯示之輸送裝置的放大剖面圖; 第5圖係為在第1圖中之該輸送裝置的第貳變化之概要圖; 第6圖係為在第1圖中之該輸送裝置的第三變化之側視圖。 【主要元件符號說明】 10···輸送裝置 11…支持元件或晶圓 12···網版印刷站 13…薄膜 14,21…捲轴 15…支持表面 16…環狀帶 17…滑輪 19···支持平面 20…直線部分 22···膠黏構件 121U 15 , he mentions that the user-known device is a more complicated and complicated mechanical device, which uses an automated single (4) attachment member to transport the support member: or the main system can distinguish the position and the component, To calibrate the complex calibration and adjustment components of the optical detection instrument that supports the position of the 7G piece. = How to 'know the solution is not only relative to its production cost: it is expensive = and relative to its planning and operation management, these 70 pieces are complex, so the potted two installation special (four) electricity (10) The silk material is assisted by the riding plan and the holding system to complete the "planting device to support the call-based support" = the positioning of the support component in the self-workstation is simpler, and in manufacturing The management and maintenance costs of this case are relatively high. °The menstruation is designed, tested and embodied to overcome the problems of the present invention. Bribery and miscellaneous, and the transfer of these shackles is based on the above-mentioned purpose '-(four) 士μ峨% change. The position of the chapter, the support element according to the invention may be provided in a - at least the basis of the support element and in accordance with the features of the invention. At least partially adhered to the material, which can have a movement on the surface of the support. The μ support 7° member is disposed relative to the film as a flexible station and can be delivered to the support member by the machine. The axis is called - the other is the other - the plastic material is transferred between the main _ is beneficially two: = by this way, the * surname - indeed and single - clear position: will: the same operating position has a cover Coffin Μ, / ϋ is an absorbent and/or automated component or device that is only secured by the use of an externally coated, plastic film. ❿不—' 5 Attachment 10 15 ib 20 200845270 By means of the invention it is thus possible to reduce the cost of manufacturing a conveyor device associated with the conveyors of the prior art. In addition, for example, if the attachment characteristic is disabled or if the support surface becomes dirty, the plastic material having the at least partially attached material can be easily and quickly replaced, thereby reducing The time and cost of repairing the suspension. Another advantage of the present invention is that the conveyor is easy to manage, and that it does not require any special assistance or special equipment and/or special rules for its functioning. In one form of the specific example of the present invention, the plastic film is supported from below by a support member which defines a substantially planar surface of the support surface of the eight. #According to another form of the specific example of the present invention, the plastic material having at least a portion of the material thereon is placed or covered in a ring-shaped manner on a conventional conveyor belt of a rotating pulley. BRIEF DESCRIPTION OF THE DRAWINGS (4) Examples and other features will be apparent from the description of the preferred form of the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; a three-dimensional view of a portion of the conveying device according to the present invention; : is a schematic side view of the conveying device in the first drawing; a schematic side view of the first variation of the first embodiment = the conveying device in the first drawing An enlarged cross-sectional view of the transport device shown in Fig. 3; Fig. 5, 200845270, Fig. 5, which is shown in Fig. 3, is a schematic diagram of the 贰K of the wheel in the i-th figure. In the second section of the figure, the "poor application method" is shown in the side view of the (four) two changes. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Referring to the accompanying drawings, one (in this case, a screen printing station is provided with a plurality of conductive strips on the station to complete, for example, a ==circle_surface brush circuit or Other electronic circuit, first voltaic battery, multi-layer printing 10 15 The film 13 composed of the conveying device according to the present invention, and having two or two: from the flexible plastic material, The circle 11 passes through the support surface 15 of the screen printing station 12 in a rim. In this case, the thin plastic flexible material is formed for the purpose of, for example, a commercially available According to another variation, the flexible plastic material is mylar 8. According to another variation, the flexible plastic is according to another variation. The material is kevlar 8. According to another variation, the flexible plastic material is PBO, for example zyl〇n 8. In particular, the support surface 15 of the film 13 is provided with an adhesive material which has an adhesive force to avoid Each wafer 11 is disposed in the latter of the latter The surface 15 is held and moved relative to the film 13 during transport through the screen printing station 12. Similarly, the attachment material appears on the support surface 15, thus allowing the wafer 11 to be screen printed The downstream of the station 12 is lightly removed by 200845270. One of the specific examples of the attachment (four) is the one that is usually found on the transparent film for storing household food. The form of the specific example shown in Figures 1 and 2 The film 13 is wound between the two reels 14, which not only causes it to advance in a predetermined -5 direction, but also provides a linear portion corresponding to the screen printing station 12 under tension. In this specific example, each new wafer crucible is placed on the new 4 knives of the film 13 so that it does not have any residue, and thus can be absolutely finely conveyed, and the degree can be Ensuring an optimum positioning function. In a specific example of the different forms shown in Figures 3 and 4, the film 13 is disposed adjacent to the outer surface of an endless belt 16, the endless belt It is conventionally tensioned and moved by two separate pulleys 17. In this case, below the straight portion 2〇 of the endless belt 16 provided correspondingly to the screen printing station 丨2, a support flat 15 surface 19 is provided to allow it to define a The substantially planar plane of the straight portion 20 of the endless belt 16 results in the film 13 being disposed on the portion 2 。. In this manner, it is ensured that the wafer stack is at least corresponding to the screen printing station 12 Positioned on the film 13 in a planar manner. In this embodiment, after a predetermined number of operating cycles, the 20 film 13 is removed only by winding the latter on the endless belt 16 and The new film 13 is replaced. In the variation of the specific example shown in Fig. 5, the film 13 is wound around the respective sides of the two side portions of the straight portion 20 of the endless belt 16. Between the spools 21, the film 13 can be fed to maintain it at 200845270 along the straight portion 2〇 of the endless belt 16. Advantageously, the spool 21 feeds the film 13 at a speed substantially corresponding to, or in any case coordinated to, the motion of the endless belt μ. As shown in the variation of the specific example in Fig. 6, it provides a single film 13 wound around the 5 endless belt 16, and an adhesive member 22 joined to the inactive portion of the film 13, and The attachment material can be placed cyclically on the support surface of the film 13. It will be apparent that modifications and/or additions to the components of the delivery device 1 can be made as described above without departing from the field and scope of the present invention. 10 For example, if the film η is directly supported by the support plane 19 and moved by the pulleys 17, the 5 tongues that do not intersect the loop belt 16 fall into the present invention. Inside the field. It is true that if the HIH conveyor 1() is connected to more than one workstation (e.g., a trimming station, a trimming station, and other workstations), it is within the scope of the present invention. In this particular embodiment, the delivery device 10 in accordance with the present invention allows for advancement between one or another workstation to ensure that it maintains the relative position of the wafer 11. It is also apparent that although the invention has been described with reference to specific specific illusions, it will be apparent that those skilled in the art will be able to carry out many other equivalents of the sizing elements to manufacture. The photovoltaic electronic circuit has the characteristics of the patent application a, and is therefore based on the protection model 11 defined by it. 200845270 t. Brief description of the figure 3 FIG. 1 is a transmission according to one of the present invention. 3 is a schematic side view of the conveying device in Fig. 1; Fig. 3 is a schematic view of a first variation of the conveying device in Fig. 1; 4 is an enlarged cross-sectional view of the conveying device shown in FIG. 3; FIG. 5 is a schematic view showing a third variation of the conveying device in FIG. 1; FIG. 6 is a first drawing. A side view of the third variation of the delivery device. [Description of main component symbols] 10···Conveying device 11...Supporting element or wafer 12···Printing station 13...film 14,21...reel 15...support surface 16...annular belt 17...pulley 19· ··Support plane 20...straight line part 22···adhesive member 12

Claims (1)

200845270200845270 、申請專利範固: 元件以料光伏打電池或是其他的 持元件之支持=置’其包含具有一其上可以安置該支 送帶包含有至小少一輸送帶,其之特徵在於該輪 日士呈有至夕—由可撓性塑膠材料所製成的薄膜,同 了/、有一至少部分地覆蓋有一附著材料並且會界定該 支持表面之表面,該附著材料可以避免該支持元件相對 於該薄膜而移動。 相對 $申明專利範圍第1項的裝置,其之特徵在於該薄膜的 该可撓性塑膠材料係為聚酯。 3·如申請專利範圍第1項的裝置,其之特徵在於該薄膜的 该可撓性塑膠材料係為乙烯樹脂。 4·如申請專利範圍第1項的裝置,其之特徵在於該薄膜的 0亥了撓性塑膠材料係為mylar⑧。 5·如申請專利範圍第丨項的裝置,其之特徵在於該薄膜的 。亥可撓性塑膠材料係為]^evlar⑧。 6·如申請專利範圍第1項的裝置,其之特徵在於該薄膜的 3亥可撓性塑膠材料係為PBO,例如zylon®。 7·如前述申請專利範圍中之任何一項的裝置,其之特徵 在於該薄膜係被纏繞於二個捲軸之間。 8.如前述申請專利範圍中之任何一項的裝置,其之特徵 在於該薄膜係被設置於該一環狀帶的一直線部分上,其 係藉著分別的滑輪之方式而移動。 9·如申請專利範圍第8項的裝置,其之特徵在於該薄膜係 13 200845270 繞者該環狀帶的周圍而纏繞。 10. 如申請專利範圍第9項之裝置,其之特徵在於該薄膜係 藉著二個各別的捲軸而進給至該環狀帶上。 11. 如前述申請專利範圍中之任何一項的裝置,其之特徵 在於一支持平面係被提供於該薄膜之下方,其允許界定 一實質上為平面之部分,以確保該等支持元件可以被平 面地設置於該薄膜的該表面上。 12. 如前述申請專利範圍中之任何一項的裝置,其之特徵在 於其也包含有一與該薄膜之非作用部分相連結之膠黏 構件,並且能夠循環地在該薄膜的該表面上置放該至少 部分附著材料。 14Patent application: The component is supported by a photovoltaic cell or other supporting component. The device includes a carrier tape that can be placed thereon and includes a conveyor belt that is characterized by the wheel. The Japanese is in existence - a film made of a flexible plastic material, with/or at least partially covered with an adhesive material and defining the surface of the support surface, the attachment material avoiding the support member relative to The film moves. The device of claim 1 of the patent specification is characterized in that the flexible plastic material of the film is polyester. 3. The device of claim 1, wherein the flexible plastic material of the film is a vinyl resin. 4. The device of claim 1, wherein the flexible plastic material of the film is mylar8. 5. The device of claim 3, characterized by the film. Hai flexible plastic material is] ^evlar8. 6. The device of claim 1, wherein the film is a PBO, such as zylon®. A device according to any one of the preceding claims, characterized in that the film is wound between two reels. 8. Apparatus according to any of the preceding claims, wherein the film is disposed on a line portion of the endless belt and is moved by means of separate pulleys. 9. The device of claim 8, wherein the film is wrapped around the end of the endless belt. 10. The device of claim 9, wherein the film is fed to the endless belt by two separate reels. 11. Apparatus according to any one of the preceding claims, characterized in that a support plane is provided below the film, which allows defining a substantially planar portion to ensure that the support elements can be It is disposed flat on the surface of the film. 12. Apparatus according to any one of the preceding claims, characterized in that it also comprises an adhesive member joined to the inactive portion of the film and is capable of being placed cyclically on the surface of the film. The at least partially attached material. 14
TW097110750A 2007-03-30 2008-03-26 Device to transport support elements for electronic circuits, in particular photovoltaic cells, along a working line TW200845270A (en)

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PCT/IT2007/000238 WO2008120248A1 (en) 2007-03-30 2007-03-30 Device to transport support elements for electronic circuits, in particular photovoltaic cells, along a working line

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102092558A (en) * 2009-11-18 2011-06-15 Ev集团E·索尔纳有限责任公司 Transport system for holding and transporting flexible substrates

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Publication number Priority date Publication date Assignee Title
ITUD20080141A1 (en) * 2008-06-19 2009-12-20 Baccini S P A PRECISION TRANSPORT SYSTEM FOR SCREEN PRINTING
CN103138009B (en) * 2013-03-25 2015-04-22 天津力神电池股份有限公司 Device for automatically attaching adhesive tape on side edge of cell
DE102018205157A1 (en) * 2018-04-05 2019-10-10 Ekra Automatisierungssysteme Gmbh printing device
DE102018205944A1 (en) 2018-04-18 2019-10-24 Ekra Automatisierungssysteme Gmbh Printing system for printing on substrates, method for operating the printing system

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JPH021147A (en) * 1988-02-15 1990-01-05 Tomoegawa Paper Co Ltd Wrapping body of glass cap for semiconductor device
US5765692A (en) * 1995-11-13 1998-06-16 Minnesota Mining And Manufacturing Company Carrier tape with adhesive and protective walls
US7097040B1 (en) * 2005-08-05 2006-08-29 Charles Gutentag Adhesive backed carrier tape with calibrated levels of low tack adhesion for retention of small components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102092558A (en) * 2009-11-18 2011-06-15 Ev集团E·索尔纳有限责任公司 Transport system for holding and transporting flexible substrates
CN102092558B (en) * 2009-11-18 2014-08-20 Ev集团E·索尔纳有限责任公司 Transport system for holding and transporting flexible substrates

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