KR19980701441A - 전기 전도성 와이어 - Google Patents

전기 전도성 와이어 Download PDF

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Publication number
KR19980701441A
KR19980701441A KR1019970704831A KR19970704831A KR19980701441A KR 19980701441 A KR19980701441 A KR 19980701441A KR 1019970704831 A KR1019970704831 A KR 1019970704831A KR 19970704831 A KR19970704831 A KR 19970704831A KR 19980701441 A KR19980701441 A KR 19980701441A
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South Korea
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substrate
electrically conductive
solder
solder balls
wire
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KR1019970704831A
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English (en)
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KR100404275B1 (ko
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Eddy Willy) 반호우테 에디 윌리(VANHOUTTE
Gilber) 데 클레르쿠 길베르트(DE CLERCQ
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제이. 쥐. 에이 롤페스
필립스 일렉트로닉스 엔. 브이
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Publication of KR19980701441A publication Critical patent/KR19980701441A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Abstract

본 발명은 기판의 대향 표면상의 전기 전도성 부재 사이에 회로 연결을 만들기 위해 땜납 볼 사이의 공간(3)에 있는 플럭스(4)와 2개의 공간진 땜납 볼(2)을 포함하는 전기 전도성 와이어(1)은 기판의 관통-구멍 안으로 삽입되며 물결 땜납과 같은 종래의 땜납 공정으로 땜납된다.

Description

전기 전도성 와이어
양 기판 표면을 가로 지르는 회로 연결용으로서의 관통-구멍이 있는 기판은 EP-A-0 126 164호에 공지이다. 회로 연결하기 위해서는 그 위에 땜납 볼이 있는 전기 전도성 와이어가 이용된다. 와이어는 기판의 관통-구멍 안으로 삽입된다. 기판은 양 표면에 전기 전도성 부재를 가지며 전기 전도성 부재는 관통-구멍의 주변에 배열된다. 와이어상의 땜납 볼은 전도성 부재들 중 하나위에 위치된다. 디핑(dipping) 또는 유도 땜납과 같은 땜납 공정에 의해서, 와이어의 양 단부 또는 일단부가 기판의 일 표면에서 전도성 부재와 땜납 연결되며, 이와 동시에 땜납 공정중에 발생된 열은 기판의 대향 표면에서 전도성 부재와 와이어 사이를 땜납 연결시키기 위해 땜납 볼이 녹도록 기판의 대향 표면에서 와이어를 통해서 땜납 볼까지 전달된다. 이러한 방법으로 기판의 양 표면상에 있는 전도성 부재 사이의 부재 사이의 회로 연결이 이루어진다.
와이어상의 단일 땜납 볼을 이용하여 회로 연결을 하였을때는 실제로 전도성 부재 사이에 나쁜 연결이 되곤 하였다.
따라서, 많은 제작자들은 회로 연결을 얻기 위해 분리된 땜납 로봇을 이용한다. 그러나, 상기 방법은 비용이 많이 들며 디자인, 병참, 유지 및, 공정 제어에 그 한계가 있다.
본 발명은 땜납 공정 수단에 의해 기판의 대향 표면상에 있는 전기 전도성 부재 사이를 회로 연결하기 위해 그 위에 땜납 볼(ball)을 갖는 전기 전도성 와이어에 관한 것이다.
도 1은 전도성 와이어가 도시된 도면.
도 2는 테이프로 묶인 와이어가 도시된 도면.
도 3은 전도성 와이어가 삽입된 기판에의 물결 땜납이 도시된 도면.
본 발명의 목적은 기판의 대향 표면위에 있는 전기 전도성 부재들 사이를 회로 연결시키기 위한 전기 전도성 와이어 수단을 제공하는데 있다.
본 발명은 기판의 대향 표면상에 있는 전기 전도성 부재들 사이를 회로 연결하기 위해 그 위에 땜납 볼이 있는 전기 전도성 와이어를 제공하며 2개의 공간지고 떨어진 땜납 볼과 땜납 볼 사이의 공간안에 플럭스를 포함하는 것을 특징으로 한다.
기판의 양 표면을 가로지르는 회로 연결용으로 상기의 와이어를 이용하면 양호하며 신뢰할만한 연결을 얻을 수 있다. 와이어는 역류(reflow) 또는 물결 땜납(wave soldering)과 같은 자동 땜납용으로 매우 적합하다. 와이어는 다른 구성요소들을 동일한 기계에 위치시키는 공정중에 기판의 관통 구멍안에서 삽입될 수 있다. 계속되는 공정단계들중의 하나에서 구성요소는 필요한 위치에서 땜납된다. 동시에 와이어는 동일한 땜납공정에서 땜납될 수 있다. 따라서, 본 발명의 가장 중요한 장점은 와이어가 다른 구성요소의 진행되는 자동 땜납 공정중에 땜납될 수 있다는 것이다.
통상적으로 구리 와이어인 전기 전도성 와이어(1)은 그 위에 단단하게 고정된 2개의 땜납 볼 또는 도트(dot)(2)가 제공된다. 땜납 볼은 공간지게 떨어져있다. 볼 사이의 작은 공간(3)은 플럭스(4)로 채워져 있다. 와이어는 예를 들면 구성요소 위치잡기 기계의 공급장치에 이용하기 위해 공지된 방식(도 2)으로 테이프(5)로 묶을 수 있다. 구성요소 위치잡기 기계에서, 와이어의 단부(8)가 기판 표면(10)들중 하나상에 제공된 전도성 트랙(9)과 서로 접촉되고 플럭스(4)가 있는 땜납 볼(2)과 접촉되거나 근접되는 방식으로 또는 기판의 대향된 표면(12)상에 제공된 전도성 트랙(11)에 근접되는 방식으로 프린트된 회로 보드 또는 기판(6)의 관통-구멍(7) 안으로 삽입될 수 있다. 보통 다른 구성요소들도 기판상에 잘 위치될 수 있다. 와이어와 구성요소들을 전기적으로 연결하기 위해서는, 기판은 도 3에 도시된 물결 땜납 기계(13)를 통해 이송된다. 기판의 표면(10)은 뜨거운 땜납물(14)이 있게 된다. 뜨거운 땜납물은 와이어(1)의 단부(8)와 접촉되어 각각의 전도성 트랙(9)에 땜납된다. 뜨거운 땜납물(14)의 열은 와이어(2)를 통해 기판의 대향 표면(12)에 위치된 땜납 볼(2)에 전달된다. 땜납 볼이 용융되고 땜납에 의해 젖은 전도성 트랙 표면이 플럭스 수단에 의해 깨끗해져서 신뢰할 수 있는 연결이 얻어진다.

Claims (1)

  1. 기판의 대향 표면상의 전기 전도성 부재들 사이에 회로 연결을 위해 그 위에 땜납 볼(2)을 갖는 전기 전도성 와이어에 있어서, 상기 전기 전도성 와이어는 그 위에 이격된 2개의 땜납 볼(2)과 땜납 볼 사이의 공간(3)에 있는 플럭스(4)를 포함하는 것을 특징으로 하는 전기 전도성 와이어.
KR1019970704831A 1995-11-20 1996-11-13 전기전도성와이어 KR100404275B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP95203166 1995-11-20
EP95203166.4 1995-11-20

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Publication Number Publication Date
KR19980701441A true KR19980701441A (ko) 1998-05-15
KR100404275B1 KR100404275B1 (ko) 2004-03-12

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US (4) US6410854B1 (ko)
EP (1) EP0804817A1 (ko)
JP (1) JPH10513308A (ko)
KR (1) KR100404275B1 (ko)
WO (1) WO1997019491A1 (ko)

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WO1997019491A1 (en) 1997-05-29
US20020040804A1 (en) 2002-04-11
US6902097B2 (en) 2005-06-07
KR100404275B1 (ko) 2004-03-12
US6410854B1 (en) 2002-06-25
US6752310B2 (en) 2004-06-22
EP0804817A1 (en) 1997-11-05
JPH10513308A (ja) 1998-12-15
US20040188498A1 (en) 2004-09-30
US20050224932A1 (en) 2005-10-13

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