JPH10513308A - 電気伝導ワイヤ - Google Patents
電気伝導ワイヤInfo
- Publication number
- JPH10513308A JPH10513308A JP9519537A JP51953797A JPH10513308A JP H10513308 A JPH10513308 A JP H10513308A JP 9519537 A JP9519537 A JP 9519537A JP 51953797 A JP51953797 A JP 51953797A JP H10513308 A JPH10513308 A JP H10513308A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- substrate
- electrically conductive
- solder
- conductive wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Abstract
(57)【要約】
本発明は、電気伝導ワイヤ(1)に関するものであり、このワイヤは、ワイヤ上に存在する2個の離間したソルダボール(2)と、基板の互いに対向する表面上の電気伝導部材間の回路接続用のソルダーボール間のスペース(3)中に位置するフラックス(4)とを備える。このワイヤ(1)は基板の貫通孔中に挿入され、ウェーブはんだ付けのような慣例のはんだ付け処理によりはんだ付けされる。
Description
【発明の詳細な説明】
電気伝導ワイヤ
本発明は、はんだ付け処理により基板の相対する表面上の電気伝導部材間に回
路接続部を作るためのソルダボールを有する電気伝導ワイヤに関するものである
。
基板の両表面に亘って回路を接続するためのものとしては、貫通孔をもつ基板
が欧州特許出願公開明細書0126164により知られている。回路を接続する
ためにはワイヤ上にソルダボールを有する電気伝導ワイヤが使用される。このワ
イヤは、基板の貫通孔に挿入される。この基板は両表面上に電気伝導部材を有し
、この伝導部材は貫通孔を通って周辺部に配列される。ワイヤ上のソルダボール
は、一つの伝導部材上に位置する。浸し塗りやフローソルダリングのようなはん
だ付け処理により、ワイヤのー端か又は両端を基板の一方の表面上の伝導部材に
はんだ付けするが、それと同時にワイヤと基板の反対表面上の伝導部材との間の
はんだ付け接続用のソルダボールを溶解するために基板の反対表面上のソルダボ
ールにはんだ付け処理中に発生する熱がワイヤを通じて伝わる。このようにして
基板の両面上の伝導部材間に回路接続が成される。
実際問題として、上述したようなワイヤ上の単一ソルダボールを使用して回路
を接続すると、伝導部材間の接続は不良なものとなる。
それ故に多くの製造者がこのような回路接続用には別個のはんだ付けロボット
を使用する。しかしながら、この方法は幾分高価であり、設計、管理、維持及び
処理制御が制限される。
本発明の目的は、基板の相対する表面上の電気伝導ワイヤ間に信頼性の高い回
路接続を成すための電気伝導ワイヤ手段を提供することである。
本発明によれば、基板の互いに対向する表面上の電気伝導部材間の回路接続用
にソルダボールを有する電気伝導ワイヤにおいて、前記ワイヤにワイヤ上にある
2個の離間したソルダボールと両ソルダボール間の空間にフラックスを設けるこ
とを特徴とする電気伝導ワイヤが提供される。
基板の両面に亘って回路を接続するためのこの種のワイヤを使用することによ
り、見事で且つ信頼性の高い接続が生じる。このワイヤをリフローやウェーブソ
ルダリングのような自動はんだ付け処理に使用することは非常に好適である。同
じ機械を用いて他の構成部品を配列処理をする間に、このワイヤを基板の貫通孔
を通して挿入できる。次の一作動段階においては、構成部品をそれらが必要とさ
れている位置にはんだ付けする。同時にワイヤを同じはんだ付け処理ではんだ付
けできる。それ故に、他の構成部品を自動はんだ付け処理する間にワイヤをはん
だ付けできることが最も重要な利点である。
本発明の実施例を図面に基づき説明する。
図1は、伝導ワイヤを示したものであり、
図2は、テープによりパックされたワイヤを示したものであり、
図3は、挿入した伝導ワイヤを有する基板用のウェーブはんだ付け処理を図示
したものである。
通常は銅のワイヤである電気伝導ワイヤ1はワイヤに固着した2個のソルダボ
ール又はドット2を備える。これらのソルダボールは離間している。ボール間の
小スペース3をフラックス4で満たす。ワイヤは例えば構成部品配置機械のフィ
ーダに使用するよく周知の方法(図2参照)でテープ5にパックすることができ
る。構成部品配置機械においては、ワイヤの端部8が基板表面10の一つに供給
された伝導トラック9と接触するか或いは接近するようにして、かつ間にフラッ
クス4をもつソルダボール2が基板の反対表面12に設けた伝導トラック11に
接触するか接近するようにしてワイヤを基板或いは回路基板の貫通孔7に挿入す
る。通常他の構成部品をもまた基板上に同様に位置させる。ワイヤと構成部品を
電気的に接続すると、基板は例えば図3に示すようなウェーブはんだ付け機械1
3を通って運搬される。基板の表面10をホットソルダ14に対向させる。この
ホットソルダはワイヤ1の端部8に接触するが、その際この端部は各々の伝導ト
ラック9にはんだ付けされる。ホットソルダ14の熱もまたワイヤ2を通って基
板の反対表面12に位置するソルダボール2に伝わる。ソルダボールは溶解し、
ソルダにより濡らされる伝導トラック表面はフラックスにより洗浄され、従って
信頼性の高い接続が得られる。
Claims (1)
- 【特許請求の範囲】 1.基板の互いに対向する表面上の電気伝導部材間の回路接続用にソルダボール (2)を有する電気伝導ワイヤ(1)において、前記ワイヤがワイヤ上にある2 個の離間したソルダボール(2)と両ソルダボール間の空間(3)に位置するフ ラックス(4)を含むことを特徴とする電気伝導ワイヤ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP95203166 | 1995-11-20 | ||
NL95203166.4 | 1995-11-20 | ||
PCT/IB1996/001203 WO1997019491A1 (en) | 1995-11-20 | 1996-11-13 | An electrically conductive wire |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10513308A true JPH10513308A (ja) | 1998-12-15 |
Family
ID=8220841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9519537A Ceased JPH10513308A (ja) | 1995-11-20 | 1996-11-13 | 電気伝導ワイヤ |
Country Status (5)
Country | Link |
---|---|
US (4) | US6410854B1 (ja) |
EP (1) | EP0804817A1 (ja) |
JP (1) | JPH10513308A (ja) |
KR (1) | KR100404275B1 (ja) |
WO (1) | WO1997019491A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997019491A1 (en) * | 1995-11-20 | 1997-05-29 | Philips Electronics N.V. | An electrically conductive wire |
US6587446B2 (en) | 1999-02-11 | 2003-07-01 | Qualcomm Incorporated | Handoff in a wireless communication system |
DE19928320A1 (de) * | 1999-06-16 | 2001-01-04 | Siemens Ag | Elektrisch leitende Verbindung zwischen einer Endelektrode und einem Anschlußdraht |
AU6299401A (en) * | 2000-05-08 | 2001-11-20 | Qtl Biosystems Llc | Improvements to the fluorescent polymer-qtl approach to biosensing |
US7464877B2 (en) | 2003-11-13 | 2008-12-16 | Metrologic Instruments, Inc. | Digital imaging-based bar code symbol reading system employing image cropping pattern generator and automatic cropped image processor |
US8042740B2 (en) | 2000-11-24 | 2011-10-25 | Metrologic Instruments, Inc. | Method of reading bar code symbols on objects at a point-of-sale station by passing said objects through a complex of stationary coplanar illumination and imaging planes projected into a 3D imaging volume |
US7540424B2 (en) | 2000-11-24 | 2009-06-02 | Metrologic Instruments, Inc. | Compact bar code symbol reading system employing a complex of coplanar illumination and imaging stations for omni-directional imaging of objects within a 3D imaging volume |
US7708205B2 (en) | 2003-11-13 | 2010-05-04 | Metrologic Instruments, Inc. | Digital image capture and processing system employing multi-layer software-based system architecture permitting modification and/or extension of system features and functions by way of third party code plug-ins |
US7490774B2 (en) | 2003-11-13 | 2009-02-17 | Metrologic Instruments, Inc. | Hand-supportable imaging based bar code symbol reader employing automatic light exposure measurement and illumination control subsystem integrated therein |
US7608114B2 (en) | 2002-12-02 | 2009-10-27 | Gi Dynamics, Inc. | Bariatric sleeve |
CA2512203C (en) * | 2002-12-02 | 2012-10-23 | Gi Dynamics, Inc. | Bariatric sleeve |
EP1610719B1 (en) * | 2003-03-28 | 2010-01-13 | GI Dynamics, Inc. | Sleeve for delayed introduction of enzymes into the intestine |
US7841533B2 (en) * | 2003-11-13 | 2010-11-30 | Metrologic Instruments, Inc. | Method of capturing and processing digital images of an object within the field of view (FOV) of a hand-supportable digitial image capture and processing system |
EP1708655A1 (en) | 2003-12-09 | 2006-10-11 | GI Dynamics, Inc. | Apparatus to be anchored within the gastrointestinal tract and anchoring method |
AU2005287010B2 (en) * | 2004-09-17 | 2010-04-15 | Gi Dynamics, Inc. | Gastrointestinal anchor |
US7976488B2 (en) * | 2005-06-08 | 2011-07-12 | Gi Dynamics, Inc. | Gastrointestinal anchor compliance |
MX2017003906A (es) * | 2014-09-26 | 2017-10-20 | Assa Abloy Inc | Sistema de cilindro integrado para asegurar puntos de acceso. |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2258750A (en) * | 1940-12-12 | 1941-10-14 | Eichwald Benjamin | Terminal block |
FR1387555A (fr) * | 1964-03-05 | 1965-01-29 | Philips Nv | Assemblage de deux corps conducteurs de l'électricité |
US3541225A (en) * | 1968-12-20 | 1970-11-17 | Gen Electric | Electrical conductor with improved solder characteristics |
US3616981A (en) * | 1969-08-08 | 1971-11-02 | Erie Technological Prod Inc | Lead and solder preform assembly and method of making the same |
DE2044494B2 (de) * | 1970-09-08 | 1972-01-13 | Siemens AG, 1000 Berlin u 8000 München | Anschlussflaechen zum anloeten von halbleiterbausteinen in flip chip technik |
US3693052A (en) * | 1971-04-15 | 1972-09-19 | Warwick Electronics Inc | Electrical component mounting |
GB1434833A (en) * | 1972-06-02 | 1976-05-05 | Siemens Ag | Solder carrying electrical connector wires |
US3925596A (en) * | 1972-06-12 | 1975-12-09 | Raychem Corp | Heat recoverable connectors |
US3889264A (en) * | 1973-05-21 | 1975-06-10 | Nasa | Vehicle locating system utilizing AM broadcasting station carriers |
CA1052475A (en) * | 1975-03-03 | 1979-04-10 | Hiroshi Fukuhara | Double faced printed circuit board interconnection |
US4189083A (en) * | 1978-06-15 | 1980-02-19 | Motorola, Inc. | Low temperature and low cost assembly process for nonlinear resistors |
US4809901A (en) * | 1981-10-05 | 1989-03-07 | Raychem Corporation | Soldering methods and devices |
JPS5998591A (ja) * | 1982-11-27 | 1984-06-06 | 松下電器産業株式会社 | 両面回路接続方法 |
US5093545A (en) * | 1988-09-09 | 1992-03-03 | Metcal, Inc. | Method, system and composition for soldering by induction heating |
US5110034A (en) * | 1990-08-30 | 1992-05-05 | Quantum Magnetics, Inc. | Superconducting bonds for thin film devices |
JPH04127547A (ja) * | 1990-09-19 | 1992-04-28 | Nec Corp | Lsi実装構造体 |
JP2756184B2 (ja) * | 1990-11-27 | 1998-05-25 | 株式会社日立製作所 | 電子部品の表面実装構造 |
US5298877A (en) * | 1993-02-19 | 1994-03-29 | Cooper Industries, Inc. | Fuse link and dual element fuse |
US5328087A (en) * | 1993-03-29 | 1994-07-12 | Microelectronics And Computer Technology Corporation | Thermally and electrically conductive adhesive material and method of bonding with same |
US5427865A (en) * | 1994-05-02 | 1995-06-27 | Motorola, Inc. | Multiple alloy solder preform |
DE69516704T2 (de) * | 1994-09-29 | 2000-10-19 | North American Specialities | Lottragender anschlussdraht und verfahren zu seiner herstellung und verwendung |
WO1997019491A1 (en) * | 1995-11-20 | 1997-05-29 | Philips Electronics N.V. | An electrically conductive wire |
-
1996
- 1996-11-13 WO PCT/IB1996/001203 patent/WO1997019491A1/en active IP Right Grant
- 1996-11-13 EP EP96935237A patent/EP0804817A1/en not_active Withdrawn
- 1996-11-13 JP JP9519537A patent/JPH10513308A/ja not_active Ceased
- 1996-11-13 KR KR1019970704831A patent/KR100404275B1/ko not_active IP Right Cessation
- 1996-11-20 US US08/752,865 patent/US6410854B1/en not_active Expired - Fee Related
-
2001
- 2001-12-11 US US10/011,741 patent/US6752310B2/en not_active Expired - Fee Related
-
2004
- 2004-04-06 US US10/817,824 patent/US6902097B2/en not_active Expired - Fee Related
-
2005
- 2005-05-20 US US11/134,693 patent/US20050224932A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP0804817A1 (en) | 1997-11-05 |
US6902097B2 (en) | 2005-06-07 |
US20040188498A1 (en) | 2004-09-30 |
US20020040804A1 (en) | 2002-04-11 |
US20050224932A1 (en) | 2005-10-13 |
US6752310B2 (en) | 2004-06-22 |
WO1997019491A1 (en) | 1997-05-29 |
KR19980701441A (ko) | 1998-05-15 |
KR100404275B1 (ko) | 2004-03-12 |
US6410854B1 (en) | 2002-06-25 |
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