KR102939998B1 - 폴리이미드 전구체와 그것으로부터 생성되는 폴리이미드, 및 플렉시블 디바이스 - Google Patents

폴리이미드 전구체와 그것으로부터 생성되는 폴리이미드, 및 플렉시블 디바이스

Info

Publication number
KR102939998B1
KR102939998B1 KR1020217006067A KR20217006067A KR102939998B1 KR 102939998 B1 KR102939998 B1 KR 102939998B1 KR 1020217006067 A KR1020217006067 A KR 1020217006067A KR 20217006067 A KR20217006067 A KR 20217006067A KR 102939998 B1 KR102939998 B1 KR 102939998B1
Authority
KR
South Korea
Prior art keywords
polyimide
acid dianhydride
structural units
units derived
diamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020217006067A
Other languages
English (en)
Korean (ko)
Other versions
KR20210068394A (ko
Inventor
홍유안 왕
가쓰후미 히라이시
노부유키 하야시
도시히로 모리모토
Original Assignee
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 filed Critical 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Publication of KR20210068394A publication Critical patent/KR20210068394A/ko
Application granted granted Critical
Publication of KR102939998B1 publication Critical patent/KR102939998B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/16Applications used for films
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/03Viewing layer characterised by chemical composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020217006067A 2018-09-29 2019-09-30 폴리이미드 전구체와 그것으로부터 생성되는 폴리이미드, 및 플렉시블 디바이스 Active KR102939998B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018186221 2018-09-29
JPJP-P-2018-186221 2018-09-29
PCT/JP2019/038442 WO2020067558A1 (ja) 2018-09-29 2019-09-30 ポリイミド前駆体及びそれから生じるポリイミド並びにフレキシブルデバイス

Publications (2)

Publication Number Publication Date
KR20210068394A KR20210068394A (ko) 2021-06-09
KR102939998B1 true KR102939998B1 (ko) 2026-03-16

Family

ID=69951328

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217006067A Active KR102939998B1 (ko) 2018-09-29 2019-09-30 폴리이미드 전구체와 그것으로부터 생성되는 폴리이미드, 및 플렉시블 디바이스

Country Status (6)

Country Link
US (1) US20210340325A1 (https=)
JP (2) JPWO2020067558A1 (https=)
KR (1) KR102939998B1 (https=)
CN (1) CN112752787A (https=)
TW (1) TWI824023B (https=)
WO (1) WO2020067558A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7398934B2 (ja) * 2019-11-22 2023-12-15 エルジー・ケム・リミテッド 表示装置用支持基板、有機el表示装置、および有機el表示装置の製造方法
WO2023018606A1 (en) * 2021-08-13 2023-02-16 Hd Microsystems Soluble polyimides for coating on polymeric substrates
CN115850703B (zh) * 2022-11-04 2024-05-17 齐鲁工业大学 一种生物基本征型光敏形状记忆聚酰亚胺及三维智能聚酰亚胺的制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014070139A (ja) * 2012-09-28 2014-04-21 Asahi Kasei E-Materials Corp ポリイミド前駆体及びそれを含有する樹脂組成物、ポリイミドフィルム及びその製造方法、並びに、積層体及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7550194B2 (en) * 2005-08-03 2009-06-23 E. I. Du Pont De Nemours And Company Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto
TWI422645B (zh) * 2007-03-30 2014-01-11 Nippon Steel & Sumikin Chem Co 聚醯亞胺膜
JP5667392B2 (ja) 2010-08-23 2015-02-12 株式会社カネカ 積層体、及びその利用
KR102213304B1 (ko) 2012-12-21 2021-02-05 아사히 가세이 이-매터리얼즈 가부시키가이샤 폴리이미드 전구체 및 그것을 함유하는 수지 조성물
KR102268406B1 (ko) 2014-02-21 2021-06-23 미쯔비시 케미컬 주식회사 폴리이미드 전구체 및/또는 폴리이미드를 포함하는 조성물, 및 폴리이미드 필름
CN104910400B (zh) 2014-03-12 2020-03-13 日铁化学材料株式会社 显示装置及其制造方法、以及显示装置用的聚酰亚胺膜
JP6420064B2 (ja) * 2014-06-03 2018-11-07 旭化成株式会社 ポリイミド前駆体組成物及びポリイミドフィルム
CN107428934B (zh) 2015-03-31 2020-10-02 旭化成株式会社 聚酰亚胺膜、聚酰亚胺清漆、使用了聚酰亚胺膜的制品、以及层积体
KR102494637B1 (ko) * 2016-09-30 2023-02-02 스미또모 가가꾸 가부시키가이샤 폴리이미드계 고분자 바니시의 제조방법, 폴리이미드계 고분자 필름의 제조방법, 및, 투명 폴리이미드계 고분자 필름
KR20180089860A (ko) * 2017-02-01 2018-08-09 스미또모 가가꾸 가부시키가이샤 폴리이미드 필름

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014070139A (ja) * 2012-09-28 2014-04-21 Asahi Kasei E-Materials Corp ポリイミド前駆体及びそれを含有する樹脂組成物、ポリイミドフィルム及びその製造方法、並びに、積層体及びその製造方法

Also Published As

Publication number Publication date
US20210340325A1 (en) 2021-11-04
WO2020067558A1 (ja) 2020-04-02
TW202012502A (zh) 2020-04-01
JPWO2020067558A1 (ja) 2021-09-24
TWI824023B (zh) 2023-12-01
CN112752787A (zh) 2021-05-04
JP2024015064A (ja) 2024-02-01
KR20210068394A (ko) 2021-06-09

Similar Documents

Publication Publication Date Title
TWI695855B (zh) 聚醯亞胺前驅體、樹脂組合物及樹脂膜之製造方法
KR102394341B1 (ko) 폴리이미드 전구체 및 폴리이미드, 투명 폴리이미드 필름의 제조방법
KR102482608B1 (ko) 폴리이미드 필름, 폴리이미드 전구체 및 폴리이미드
KR102519088B1 (ko) 폴리이미드 전구체, 폴리이미드 및 폴리이미드 필름
CN111757904B (zh) 聚酰亚胺前体、聚酰亚胺、聚酰亚胺膜、清漆和基板
JP7217220B2 (ja) ポリイミド前駆体組成物及びそれから生じるポリイミドフィルム及びフレキシブルデバイス、ポリイミドフィルムの製造方法
JP2024015064A (ja) ポリイミド並びにフレキシブルデバイス
KR102693896B1 (ko) 폴리이미드 전구체 및 폴리이미드
KR102373556B1 (ko) 폴리이미드 전구체 및 그로부터 생성된 폴리이미드
JP6890999B2 (ja) ポリイミド前駆体及びポリイミド
KR102744692B1 (ko) 폴리이미드, 폴리이미드 용액 조성물, 폴리이미드 필름 및 기판
JP6956486B2 (ja) フレキシブルデバイス用ポリイミドフィルム、その前駆体、及び機能層付ポリイミドフィルム
JPWO2020067558A5 (https=)
JP2018172562A (ja) ポリイミド前駆体及びポリイミド
JP7352837B2 (ja) ポリマーブレンドフィルムおよび積層体
JP2022115823A (ja) ポリイミド前駆体及びポリイミド
TWI921459B (zh) 聚醯亞胺前體清漆及其製造方法、聚醯亞胺及其製造方法、可撓性器件及配線基板用層疊體
JP6638744B2 (ja) ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
JP7265864B2 (ja) ポリイミド前駆体及びポリイミド
TW201529728A (zh) 聚醯亞胺前驅體組成物、聚醯亞胺之製造方法、聚醯亞胺、聚醯亞胺膜及基板
JP7657048B2 (ja) ポリイミドフィルム及びその製造方法並びにフレキシブルデバイス
JP7471888B2 (ja) ポリイミドフィルム及びそれを用いた表示装置並びにポリイミド前駆体
KR20260018569A (ko) 높은 투과도와 치수안정성을 갖는 폴리아믹산 조성물 및 그로부터 제조된 폴리이미드 필름

Legal Events

Date Code Title Description
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T13-X000 Administrative time limit extension granted

St.27 status event code: U-3-3-T10-T13-oth-X000

T13-X000 Administrative time limit extension granted

St.27 status event code: U-3-3-T10-T13-oth-X000

E12 Pre-grant re-examination requested

Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E12-REX-PX0901 (AS PROVIDED BY THE NATIONAL OFFICE)

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13 Application amended

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901

F13 Ip right granted in full following pre-grant review

Free format text: ST27 STATUS EVENT CODE: A-3-4-F10-F13-REX-PX0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PX0701 Decision of registration after re-examination

St.27 status event code: A-3-4-F10-F13-rex-PX0701

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

U12 Designation fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)