JPWO2020067558A1 - ポリイミド前駆体及びそれから生じるポリイミド並びにフレキシブルデバイス - Google Patents

ポリイミド前駆体及びそれから生じるポリイミド並びにフレキシブルデバイス Download PDF

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Publication number
JPWO2020067558A1
JPWO2020067558A1 JP2020549510A JP2020549510A JPWO2020067558A1 JP WO2020067558 A1 JPWO2020067558 A1 JP WO2020067558A1 JP 2020549510 A JP2020549510 A JP 2020549510A JP 2020549510 A JP2020549510 A JP 2020549510A JP WO2020067558 A1 JPWO2020067558 A1 JP WO2020067558A1
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Japan
Prior art keywords
polyimide
acid dianhydride
diamine
film
structural unit
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JP2020549510A
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English (en)
Japanese (ja)
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JPWO2020067558A5 (https=
Inventor
王　宏遠
宏遠 王
平石　克文
克文 平石
林　信行
信行 林
敏弘 森本
敏弘 森本
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Nippon Steel Chemical and Materials Co Ltd
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Nippon Steel Chemical and Materials Co Ltd
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Publication of JPWO2020067558A1 publication Critical patent/JPWO2020067558A1/ja
Publication of JPWO2020067558A5 publication Critical patent/JPWO2020067558A5/ja
Priority to JP2023200098A priority Critical patent/JP2024015064A/ja
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/03—Viewing layer characterised by chemical composition

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2020549510A 2018-09-29 2019-09-30 ポリイミド前駆体及びそれから生じるポリイミド並びにフレキシブルデバイス Withdrawn JPWO2020067558A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023200098A JP2024015064A (ja) 2018-09-29 2023-11-27 ポリイミド並びにフレキシブルデバイス

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018186221 2018-09-29
JP2018186221 2018-09-29
PCT/JP2019/038442 WO2020067558A1 (ja) 2018-09-29 2019-09-30 ポリイミド前駆体及びそれから生じるポリイミド並びにフレキシブルデバイス

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JP2023200098A Division JP2024015064A (ja) 2018-09-29 2023-11-27 ポリイミド並びにフレキシブルデバイス

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JPWO2020067558A1 true JPWO2020067558A1 (ja) 2021-09-24
JPWO2020067558A5 JPWO2020067558A5 (https=) 2022-07-14

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JP2020549510A Withdrawn JPWO2020067558A1 (ja) 2018-09-29 2019-09-30 ポリイミド前駆体及びそれから生じるポリイミド並びにフレキシブルデバイス
JP2023200098A Pending JP2024015064A (ja) 2018-09-29 2023-11-27 ポリイミド並びにフレキシブルデバイス

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Country Status (6)

Country Link
US (1) US20210340325A1 (https=)
JP (2) JPWO2020067558A1 (https=)
KR (1) KR102939998B1 (https=)
CN (1) CN112752787A (https=)
TW (1) TWI824023B (https=)
WO (1) WO2020067558A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024529691A (ja) * 2021-08-13 2024-08-08 エイチディー マイクロシステムズ ポリマー基板へのコーティング用可溶性ポリイミド

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7398934B2 (ja) * 2019-11-22 2023-12-15 エルジー・ケム・リミテッド 表示装置用支持基板、有機ｅｌ表示装置、および有機ｅｌ表示装置の製造方法
CN115850703B (zh) * 2022-11-04 2024-05-17 齐鲁工业大学 一种生物基本征型光敏形状记忆聚酰亚胺及三维智能聚酰亚胺的制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008126559A1 (ja) * 2007-03-30 2008-10-23 Nippon Steel Chemical Co., Ltd. ポリイミドフィルム
JP2014070139A (ja) * 2012-09-28 2014-04-21 Asahi Kasei E-Materials Corp ポリイミド前駆体及びそれを含有する樹脂組成物、ポリイミドフィルム及びその製造方法、並びに、積層体及びその製造方法
JP2015229691A (ja) * 2014-06-03 2015-12-21 旭化成イーマテリアルズ株式会社 ポリイミド前駆体組成物及びポリイミドフィルム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7550194B2 (en) * 2005-08-03 2009-06-23 E. I. Du Pont De Nemours And Company Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto
JP5667392B2 (ja) 2010-08-23 2015-02-12 株式会社カネカ 積層体、及びその利用
JP5948545B2 (ja) 2012-12-21 2016-07-06 旭化成株式会社 ポリイミド前駆体及びそれを含有する樹脂組成物
CN106029743B (zh) 2014-02-21 2019-03-29 三菱化学株式会社 含聚酰亚胺前驱体和/或聚酰亚胺的组合物，以及聚酰亚胺膜
TWI654251B (zh) 2014-03-12 2019-03-21 日商日鐵化學材料股份有限公司 顯示裝置及其製造方法、以及顯示裝置用的聚醯亞胺膜
EP3279237A4 (en) 2015-03-31 2018-04-04 Asahi Kasei Kabushiki Kaisha Polyimide film, polyimide varnish, product using polyimide film, and laminate
JP7186617B2 (ja) * 2016-09-30 2022-12-09 住友化学株式会社 ポリイミド系高分子ワニスの製造方法、ポリイミド系高分子フィルムの製造方法、及び、透明ポリイミド系高分子フィルム
KR20180089860A (ko) * 2017-02-01 2018-08-09 스미또모 가가꾸 가부시키가이샤 폴리이미드 필름

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008126559A1 (ja) * 2007-03-30 2008-10-23 Nippon Steel Chemical Co., Ltd. ポリイミドフィルム
JP2014070139A (ja) * 2012-09-28 2014-04-21 Asahi Kasei E-Materials Corp ポリイミド前駆体及びそれを含有する樹脂組成物、ポリイミドフィルム及びその製造方法、並びに、積層体及びその製造方法
JP2015229691A (ja) * 2014-06-03 2015-12-21 旭化成イーマテリアルズ株式会社 ポリイミド前駆体組成物及びポリイミドフィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024529691A (ja) * 2021-08-13 2024-08-08 エイチディー マイクロシステムズ ポリマー基板へのコーティング用可溶性ポリイミド

Also Published As

Publication number Publication date
KR20210068394A (ko) 2021-06-09
CN112752787A (zh) 2021-05-04
JP2024015064A (ja) 2024-02-01
TWI824023B (zh) 2023-12-01
WO2020067558A1 (ja) 2020-04-02
TW202012502A (zh) 2020-04-01
KR102939998B1 (ko) 2026-03-16
US20210340325A1 (en) 2021-11-04

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