CN112752787A - 聚酰亚胺前驱体以及由其所得的聚酰亚胺和可挠性器件 - Google Patents

聚酰亚胺前驱体以及由其所得的聚酰亚胺和可挠性器件 Download PDF

Info

Publication number
CN112752787A
CN112752787A CN201980062761.0A CN201980062761A CN112752787A CN 112752787 A CN112752787 A CN 112752787A CN 201980062761 A CN201980062761 A CN 201980062761A CN 112752787 A CN112752787 A CN 112752787A
Authority
CN
China
Prior art keywords
polyimide
dianhydride
film
diamine
derived
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980062761.0A
Other languages
English (en)
Chinese (zh)
Inventor
王宏远
平石克文
林信行
森本敏弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel and Sumikin Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel and Sumikin Chemical Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Publication of CN112752787A publication Critical patent/CN112752787A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/03—Viewing layer characterised by chemical composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CN201980062761.0A 2018-09-29 2019-09-30 聚酰亚胺前驱体以及由其所得的聚酰亚胺和可挠性器件 Pending CN112752787A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-186221 2018-09-29
JP2018186221 2018-09-29
PCT/JP2019/038442 WO2020067558A1 (ja) 2018-09-29 2019-09-30 ポリイミド前駆体及びそれから生じるポリイミド並びにフレキシブルデバイス

Publications (1)

Publication Number Publication Date
CN112752787A true CN112752787A (zh) 2021-05-04

Family

ID=69951328

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980062761.0A Pending CN112752787A (zh) 2018-09-29 2019-09-30 聚酰亚胺前驱体以及由其所得的聚酰亚胺和可挠性器件

Country Status (6)

Country Link
US (1) US20210340325A1 (https=)
JP (2) JPWO2020067558A1 (https=)
KR (1) KR102939998B1 (https=)
CN (1) CN112752787A (https=)
TW (1) TWI824023B (https=)
WO (1) WO2020067558A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7398934B2 (ja) * 2019-11-22 2023-12-15 エルジー・ケム・リミテッド 表示装置用支持基板、有機ｅｌ表示装置、および有機ｅｌ表示装置の製造方法
WO2023018606A1 (en) * 2021-08-13 2023-02-16 Hd Microsystems Soluble polyimides for coating on polymeric substrates
CN115850703B (zh) * 2022-11-04 2024-05-17 齐鲁工业大学 一种生物基本征型光敏形状记忆聚酰亚胺及三维智能聚酰亚胺的制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014070139A (ja) * 2012-09-28 2014-04-21 Asahi Kasei E-Materials Corp ポリイミド前駆体及びそれを含有する樹脂組成物、ポリイミドフィルム及びその製造方法、並びに、積層体及びその製造方法
JP2015229691A (ja) * 2014-06-03 2015-12-21 旭化成イーマテリアルズ株式会社 ポリイミド前駆体組成物及びポリイミドフィルム
WO2018062296A1 (ja) * 2016-09-30 2018-04-05 住友化学株式会社 ポリイミド系高分子ワニスの製造方法、ポリイミド系高分子フィルムの製造方法、及び、透明ポリイミド系高分子フィルム
CN108373543A (zh) * 2017-02-01 2018-08-07 住友化学株式会社 聚酰亚胺膜

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7550194B2 (en) * 2005-08-03 2009-06-23 E. I. Du Pont De Nemours And Company Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto
TWI422645B (zh) * 2007-03-30 2014-01-11 Nippon Steel & Sumikin Chem Co 聚醯亞胺膜
JP5667392B2 (ja) 2010-08-23 2015-02-12 株式会社カネカ 積層体、及びその利用
JP5948545B2 (ja) 2012-12-21 2016-07-06 旭化成株式会社 ポリイミド前駆体及びそれを含有する樹脂組成物
CN106029743B (zh) 2014-02-21 2019-03-29 三菱化学株式会社 含聚酰亚胺前驱体和/或聚酰亚胺的组合物，以及聚酰亚胺膜
TWI654251B (zh) 2014-03-12 2019-03-21 日商日鐵化學材料股份有限公司 顯示裝置及其製造方法、以及顯示裝置用的聚醯亞胺膜
EP3279237A4 (en) 2015-03-31 2018-04-04 Asahi Kasei Kabushiki Kaisha Polyimide film, polyimide varnish, product using polyimide film, and laminate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014070139A (ja) * 2012-09-28 2014-04-21 Asahi Kasei E-Materials Corp ポリイミド前駆体及びそれを含有する樹脂組成物、ポリイミドフィルム及びその製造方法、並びに、積層体及びその製造方法
JP2015229691A (ja) * 2014-06-03 2015-12-21 旭化成イーマテリアルズ株式会社 ポリイミド前駆体組成物及びポリイミドフィルム
WO2018062296A1 (ja) * 2016-09-30 2018-04-05 住友化学株式会社 ポリイミド系高分子ワニスの製造方法、ポリイミド系高分子フィルムの製造方法、及び、透明ポリイミド系高分子フィルム
CN108373543A (zh) * 2017-02-01 2018-08-07 住友化学株式会社 聚酰亚胺膜

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LINSHUANG LI,ET AL.: "Preparation, characterization and degradation kinetics of transparent fluorinated polyimides with low dielectric constants and excellent hydrophobic properties", 《POLYMER BULLETIN》 *

Also Published As

Publication number Publication date
KR20210068394A (ko) 2021-06-09
JPWO2020067558A1 (ja) 2021-09-24
JP2024015064A (ja) 2024-02-01
TWI824023B (zh) 2023-12-01
WO2020067558A1 (ja) 2020-04-02
TW202012502A (zh) 2020-04-01
KR102939998B1 (ko) 2026-03-16
US20210340325A1 (en) 2021-11-04

Similar Documents

Publication Publication Date Title
US11993678B2 (en) Polyamic acid, polyamic acid solution, polyimide, polyimide film, laminate and flexible device, and method for producing polyimide film
TWI813543B (zh) 聚醯亞胺前驅物、聚醯亞胺及透明聚醯亞胺膜的製造方法
CN108026273B (zh) 聚酰亚胺前体、树脂组合物和树脂薄膜的制造方法
CN113136103B (zh) 聚酰亚胺前体树脂组合物
KR102482608B1 (ko) 폴리이미드 필름, 폴리이미드 전구체 및 폴리이미드
CN109679094B (zh) 聚酰亚胺前体及聚酰亚胺、层叠体、可挠性器件
TWI859238B (zh) 聚醯亞胺前驅體及聚醯亞胺樹脂組合物
JP2024015064A (ja) ポリイミド並びにフレキシブルデバイス
CN107722267B (zh) 聚酰亚胺前体及由所述聚酰亚胺前体生成的聚酰亚胺
CN111378280A (zh) 聚酰亚胺前体组合物及由其产生的聚酰亚胺膜以及柔性器件、聚酰亚胺膜的制造方法
JPWO2019131896A1 (ja) ポリイミド、ポリイミド溶液組成物、ポリイミドフィルム、及び基板
JP6974956B2 (ja) ポリイミド前駆体及びポリイミド
CN120858128A (zh) 聚酰亚胺前体组合物、聚酰亚胺膜、层叠体、电子器件、层叠体的制造方法、聚酰亚胺膜的制造方法和电子器件的制造方法
JPWO2020067558A5 (https=)
JP2019119755A (ja) 光電表示装置形成用ポリイミド原料のジアミン化合物、これを用いたポリアミド酸及びポリイミド
CN113549217B (zh) 聚酰亚胺前体和包含其的树脂组合物、聚酰亚胺树脂膜、树脂薄膜及其制造方法
JP2022115823A (ja) ポリイミド前駆体及びポリイミド
CN117120516A (zh) 聚酰亚胺、树脂组合物、聚酰亚胺薄膜和其制造方法
TWI921459B (zh) 聚醯亞胺前體清漆及其製造方法、聚醯亞胺及其製造方法、可撓性器件及配線基板用層疊體
JP7265864B2 (ja) ポリイミド前駆体及びポリイミド
CN120712309A (zh) 聚酰亚胺前体组合物、聚酰亚胺膜、层叠体、电子器件、层叠体的制造方法、聚酰亚胺膜的制造方法和电子器件的制造方法
CN118852618A (zh) 树脂组合物

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination