KR102784910B1 - 기판 유지장치, 리소그래피 장치, 및 물품의 제조방법 - Google Patents

기판 유지장치, 리소그래피 장치, 및 물품의 제조방법 Download PDF

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Publication number
KR102784910B1
KR102784910B1 KR1020200044440A KR20200044440A KR102784910B1 KR 102784910 B1 KR102784910 B1 KR 102784910B1 KR 1020200044440 A KR1020200044440 A KR 1020200044440A KR 20200044440 A KR20200044440 A KR 20200044440A KR 102784910 B1 KR102784910 B1 KR 102784910B1
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KR
South Korea
Prior art keywords
substrate
holding device
substrate holding
support member
turn portion
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Active
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KR1020200044440A
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English (en)
Korean (ko)
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KR20200124604A (ko
Inventor
마사토시 시마자키
Original Assignee
캐논 가부시끼가이샤
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Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20200124604A publication Critical patent/KR20200124604A/ko
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Publication of KR102784910B1 publication Critical patent/KR102784910B1/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • H01L21/027—
    • H01L21/6838—
    • H01L21/6875—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Jigs For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020200044440A 2019-04-24 2020-04-13 기판 유지장치, 리소그래피 장치, 및 물품의 제조방법 Active KR102784910B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019083213A JP7348744B2 (ja) 2019-04-24 2019-04-24 基板保持装置、リソグラフィ装置、および物品の製造方法
JPJP-P-2019-083213 2019-04-24

Publications (2)

Publication Number Publication Date
KR20200124604A KR20200124604A (ko) 2020-11-03
KR102784910B1 true KR102784910B1 (ko) 2025-03-21

Family

ID=73024827

Family Applications (1)

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KR1020200044440A Active KR102784910B1 (ko) 2019-04-24 2020-04-13 기판 유지장치, 리소그래피 장치, 및 물품의 제조방법

Country Status (3)

Country Link
JP (1) JP7348744B2 (https=)
KR (1) KR102784910B1 (https=)
TW (1) TWI810443B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7810001B2 (ja) * 2022-02-10 2026-02-03 ウシオ電機株式会社 ワークステージおよび露光装置
JP2025173546A (ja) * 2024-05-15 2025-11-28 株式会社新川 ボンディングステージ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4448404A (en) 1980-11-18 1984-05-15 Nippon Kogaku K. K. Device for holding a sheet-like sample

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58191643U (ja) * 1982-06-15 1983-12-20 株式会社ニコン 試料台
JPS60142036A (ja) 1983-12-29 1985-07-27 Kogata Gas Reibou Gijutsu Kenkyu Kumiai ４サイクルエンジンのシリンダヘツド
JPS60142036U (ja) * 1984-02-29 1985-09-20 オムロン株式会社 ウエハチヤツクプレ−ト
JP2800188B2 (ja) * 1988-07-20 1998-09-21 株式会社ニコン 基板吸着装置
JP3106499B2 (ja) * 1990-11-30 2000-11-06 株式会社ニコン 露光装置
JPH0521584A (ja) * 1991-07-16 1993-01-29 Nikon Corp 保持装置
JPH05253853A (ja) * 1992-03-10 1993-10-05 Sony Corp 薄片吸着装置および薄片吸着装置の洗浄方法
KR20010018599A (ko) * 1999-08-20 2001-03-05 김영환 반도체 노광장비의 웨이퍼 척
US7646580B2 (en) * 2005-02-24 2010-01-12 Kyocera Corporation Electrostatic chuck and wafer holding member and wafer treatment method
JP2007043042A (ja) * 2005-07-07 2007-02-15 Sumitomo Electric Ind Ltd ウェハ保持体およびその製造方法、ならびにそれを搭載したウェハプローバ及び半導体加熱装置
KR101821636B1 (ko) * 2013-08-28 2018-03-08 에이피시스템 주식회사 기판 안착 장치
US20160240414A1 (en) * 2013-09-26 2016-08-18 Suss Microtec Lithography Gmbh Chuck for Suction and Holding a Wafer
JP6598827B2 (ja) * 2017-08-01 2019-10-30 キヤノン株式会社 光学装置、これを用いた露光装置、および物品の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4448404A (en) 1980-11-18 1984-05-15 Nippon Kogaku K. K. Device for holding a sheet-like sample

Also Published As

Publication number Publication date
TW202109729A (zh) 2021-03-01
TWI810443B (zh) 2023-08-01
JP7348744B2 (ja) 2023-09-21
JP2020181871A (ja) 2020-11-05
KR20200124604A (ko) 2020-11-03

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