JP7348744B2 - 基板保持装置、リソグラフィ装置、および物品の製造方法 - Google Patents

基板保持装置、リソグラフィ装置、および物品の製造方法 Download PDF

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Publication number
JP7348744B2
JP7348744B2 JP2019083213A JP2019083213A JP7348744B2 JP 7348744 B2 JP7348744 B2 JP 7348744B2 JP 2019083213 A JP2019083213 A JP 2019083213A JP 2019083213 A JP2019083213 A JP 2019083213A JP 7348744 B2 JP7348744 B2 JP 7348744B2
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JP
Japan
Prior art keywords
substrate
holding device
support member
substrate holding
round part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019083213A
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English (en)
Japanese (ja)
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JP2020181871A (ja
JP2020181871A5 (https=
Inventor
将俊 島崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2019083213A priority Critical patent/JP7348744B2/ja
Priority to TW109108566A priority patent/TWI810443B/zh
Priority to KR1020200044440A priority patent/KR102784910B1/ko
Publication of JP2020181871A publication Critical patent/JP2020181871A/ja
Publication of JP2020181871A5 publication Critical patent/JP2020181871A5/ja
Application granted granted Critical
Publication of JP7348744B2 publication Critical patent/JP7348744B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Jigs For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2019083213A 2019-04-24 2019-04-24 基板保持装置、リソグラフィ装置、および物品の製造方法 Active JP7348744B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019083213A JP7348744B2 (ja) 2019-04-24 2019-04-24 基板保持装置、リソグラフィ装置、および物品の製造方法
TW109108566A TWI810443B (zh) 2019-04-24 2020-03-16 基板保持裝置、光刻裝置及物品之製造方法
KR1020200044440A KR102784910B1 (ko) 2019-04-24 2020-04-13 기판 유지장치, 리소그래피 장치, 및 물품의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019083213A JP7348744B2 (ja) 2019-04-24 2019-04-24 基板保持装置、リソグラフィ装置、および物品の製造方法

Publications (3)

Publication Number Publication Date
JP2020181871A JP2020181871A (ja) 2020-11-05
JP2020181871A5 JP2020181871A5 (https=) 2022-04-15
JP7348744B2 true JP7348744B2 (ja) 2023-09-21

Family

ID=73024827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019083213A Active JP7348744B2 (ja) 2019-04-24 2019-04-24 基板保持装置、リソグラフィ装置、および物品の製造方法

Country Status (3)

Country Link
JP (1) JP7348744B2 (https=)
KR (1) KR102784910B1 (https=)
TW (1) TWI810443B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7810001B2 (ja) * 2022-02-10 2026-02-03 ウシオ電機株式会社 ワークステージおよび露光装置
JP2025173546A (ja) * 2024-05-15 2025-11-28 株式会社新川 ボンディングステージ

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58191643U (ja) * 1982-06-15 1983-12-20 株式会社ニコン 試料台
US4448404A (en) 1980-11-18 1984-05-15 Nippon Kogaku K. K. Device for holding a sheet-like sample
JPS60142036A (ja) 1983-12-29 1985-07-27 Kogata Gas Reibou Gijutsu Kenkyu Kumiai ４サイクルエンジンのシリンダヘツド
JPS60142036U (ja) * 1984-02-29 1985-09-20 オムロン株式会社 ウエハチヤツクプレ−ト
JP2800188B2 (ja) * 1988-07-20 1998-09-21 株式会社ニコン 基板吸着装置
JP3106499B2 (ja) * 1990-11-30 2000-11-06 株式会社ニコン 露光装置
JPH0521584A (ja) * 1991-07-16 1993-01-29 Nikon Corp 保持装置
JPH05253853A (ja) * 1992-03-10 1993-10-05 Sony Corp 薄片吸着装置および薄片吸着装置の洗浄方法
KR20010018599A (ko) * 1999-08-20 2001-03-05 김영환 반도체 노광장비의 웨이퍼 척
US7646580B2 (en) * 2005-02-24 2010-01-12 Kyocera Corporation Electrostatic chuck and wafer holding member and wafer treatment method
JP2007043042A (ja) * 2005-07-07 2007-02-15 Sumitomo Electric Ind Ltd ウェハ保持体およびその製造方法、ならびにそれを搭載したウェハプローバ及び半導体加熱装置
KR101821636B1 (ko) * 2013-08-28 2018-03-08 에이피시스템 주식회사 기판 안착 장치
US20160240414A1 (en) * 2013-09-26 2016-08-18 Suss Microtec Lithography Gmbh Chuck for Suction and Holding a Wafer
JP6598827B2 (ja) * 2017-08-01 2019-10-30 キヤノン株式会社 光学装置、これを用いた露光装置、および物品の製造方法

Also Published As

Publication number Publication date
KR102784910B1 (ko) 2025-03-21
TW202109729A (zh) 2021-03-01
TWI810443B (zh) 2023-08-01
JP2020181871A (ja) 2020-11-05
KR20200124604A (ko) 2020-11-03

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