TWI810443B - 基板保持裝置、光刻裝置及物品之製造方法 - Google Patents

基板保持裝置、光刻裝置及物品之製造方法 Download PDF

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Publication number
TWI810443B
TWI810443B TW109108566A TW109108566A TWI810443B TW I810443 B TWI810443 B TW I810443B TW 109108566 A TW109108566 A TW 109108566A TW 109108566 A TW109108566 A TW 109108566A TW I810443 B TWI810443 B TW I810443B
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TW
Taiwan
Prior art keywords
substrate
holding device
substrate holding
support member
aforementioned
Prior art date
Application number
TW109108566A
Other languages
English (en)
Chinese (zh)
Other versions
TW202109729A (zh
Inventor
島崎将俊
Original Assignee
日商佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商佳能股份有限公司 filed Critical 日商佳能股份有限公司
Publication of TW202109729A publication Critical patent/TW202109729A/zh
Application granted granted Critical
Publication of TWI810443B publication Critical patent/TWI810443B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Jigs For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW109108566A 2019-04-24 2020-03-16 基板保持裝置、光刻裝置及物品之製造方法 TWI810443B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019083213A JP7348744B2 (ja) 2019-04-24 2019-04-24 基板保持装置、リソグラフィ装置、および物品の製造方法
JP2019-083213 2019-04-24

Publications (2)

Publication Number Publication Date
TW202109729A TW202109729A (zh) 2021-03-01
TWI810443B true TWI810443B (zh) 2023-08-01

Family

ID=73024827

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109108566A TWI810443B (zh) 2019-04-24 2020-03-16 基板保持裝置、光刻裝置及物品之製造方法

Country Status (3)

Country Link
JP (1) JP7348744B2 (https=)
KR (1) KR102784910B1 (https=)
TW (1) TWI810443B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7810001B2 (ja) * 2022-02-10 2026-02-03 ウシオ電機株式会社 ワークステージおよび露光装置
JP2025173546A (ja) * 2024-05-15 2025-11-28 株式会社新川 ボンディングステージ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5324012A (en) * 1991-07-16 1994-06-28 Nikon Corporation Holding apparatus for holding an article such as a semiconductor wafer
US20060209490A1 (en) * 2005-02-24 2006-09-21 Kyocera Corporation Electrostatic chuck and wafer holding member and wafer treatment method
TW200721366A (en) * 2005-07-07 2007-06-01 Sumitomo Electric Industries Body for keeping a wafer, method of manufacturing the same and device using the same
TW201508200A (zh) * 2013-08-28 2015-03-01 Ａｐ系統股份有限公司 用於固持基底的設備
US20160240414A1 (en) * 2013-09-26 2016-08-18 Suss Microtec Lithography Gmbh Chuck for Suction and Holding a Wafer

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58191643U (ja) * 1982-06-15 1983-12-20 株式会社ニコン 試料台
US4448404A (en) 1980-11-18 1984-05-15 Nippon Kogaku K. K. Device for holding a sheet-like sample
JPS60142036A (ja) 1983-12-29 1985-07-27 Kogata Gas Reibou Gijutsu Kenkyu Kumiai ４サイクルエンジンのシリンダヘツド
JPS60142036U (ja) * 1984-02-29 1985-09-20 オムロン株式会社 ウエハチヤツクプレ−ト
JP2800188B2 (ja) * 1988-07-20 1998-09-21 株式会社ニコン 基板吸着装置
JP3106499B2 (ja) * 1990-11-30 2000-11-06 株式会社ニコン 露光装置
JPH05253853A (ja) * 1992-03-10 1993-10-05 Sony Corp 薄片吸着装置および薄片吸着装置の洗浄方法
KR20010018599A (ko) * 1999-08-20 2001-03-05 김영환 반도체 노광장비의 웨이퍼 척
JP6598827B2 (ja) * 2017-08-01 2019-10-30 キヤノン株式会社 光学装置、これを用いた露光装置、および物品の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5324012A (en) * 1991-07-16 1994-06-28 Nikon Corporation Holding apparatus for holding an article such as a semiconductor wafer
US20060209490A1 (en) * 2005-02-24 2006-09-21 Kyocera Corporation Electrostatic chuck and wafer holding member and wafer treatment method
TW200721366A (en) * 2005-07-07 2007-06-01 Sumitomo Electric Industries Body for keeping a wafer, method of manufacturing the same and device using the same
TW201508200A (zh) * 2013-08-28 2015-03-01 Ａｐ系統股份有限公司 用於固持基底的設備
US20160240414A1 (en) * 2013-09-26 2016-08-18 Suss Microtec Lithography Gmbh Chuck for Suction and Holding a Wafer

Also Published As

Publication number Publication date
KR102784910B1 (ko) 2025-03-21
TW202109729A (zh) 2021-03-01
JP7348744B2 (ja) 2023-09-21
JP2020181871A (ja) 2020-11-05
KR20200124604A (ko) 2020-11-03

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