KR102758192B1 - 접착제 조성물 - Google Patents

접착제 조성물 Download PDF

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Publication number
KR102758192B1
KR102758192B1 KR1020217030338A KR20217030338A KR102758192B1 KR 102758192 B1 KR102758192 B1 KR 102758192B1 KR 1020217030338 A KR1020217030338 A KR 1020217030338A KR 20217030338 A KR20217030338 A KR 20217030338A KR 102758192 B1 KR102758192 B1 KR 102758192B1
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KR
South Korea
Prior art keywords
particles
adhesive composition
silicone
electronic component
average particle
Prior art date
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KR1020217030338A
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English (en)
Korean (ko)
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KR20210129169A (ko
Inventor
다이스케 사토
아키후미 히구치
Original Assignee
데쿠세리아루즈 가부시키가이샤
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Publication of KR20210129169A publication Critical patent/KR20210129169A/ko
Application granted granted Critical
Publication of KR102758192B1 publication Critical patent/KR102758192B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020217030338A 2019-03-29 2020-03-18 접착제 조성물 Active KR102758192B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-068612 2019-03-29
JP2019068612A JP7792189B2 (ja) 2019-03-29 2019-03-29 接着剤組成物
PCT/JP2020/011982 WO2020203295A1 (ja) 2019-03-29 2020-03-18 接着剤組成物

Publications (2)

Publication Number Publication Date
KR20210129169A KR20210129169A (ko) 2021-10-27
KR102758192B1 true KR102758192B1 (ko) 2025-01-21

Family

ID=72668769

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217030338A Active KR102758192B1 (ko) 2019-03-29 2020-03-18 접착제 조성물

Country Status (4)

Country Link
JP (1) JP7792189B2 (https=)
KR (1) KR102758192B1 (https=)
CN (1) CN113785027B (https=)
WO (1) WO2020203295A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115124813A (zh) * 2021-03-26 2022-09-30 味之素株式会社 树脂组合物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012023025A (ja) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3353719B2 (ja) 1998-09-16 2002-12-03 日本電気株式会社 プラズマディスプレイパネルの電極端子取出し構造
JP4086296B2 (ja) 2003-04-28 2008-05-14 オプトレックス株式会社 リード電極の接続構造
WO2005002002A1 (ja) * 2003-06-25 2005-01-06 Hitachi Chemical Co., Ltd. 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
GEP20125702B (en) * 2007-06-29 2012-12-10 Pfizer Benzimidazole derivatives
JP5168736B2 (ja) 2009-02-06 2013-03-27 信越化学工業株式会社 接着剤組成物、接着用シート及びダイシング・ダイアタッチフィルム
KR101313939B1 (ko) * 2010-06-14 2013-10-01 히타치가세이가부시끼가이샤 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
JP6374192B2 (ja) 2014-03-25 2018-08-15 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP6371148B2 (ja) * 2014-07-16 2018-08-08 ナミックス株式会社 カメラモジュール用接着剤
JP2018104653A (ja) 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
JP2018168345A (ja) * 2017-03-30 2018-11-01 デクセリアルズ株式会社 異方性導電接着剤
JP6979326B2 (ja) * 2017-10-20 2021-12-15 日本化薬株式会社 樹脂組成物及び電子部品用接着剤

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012023025A (ja) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法

Also Published As

Publication number Publication date
JP7792189B2 (ja) 2025-12-25
KR20210129169A (ko) 2021-10-27
JP2020164722A (ja) 2020-10-08
WO2020203295A1 (ja) 2020-10-08
CN113785027B (zh) 2024-01-12
CN113785027A (zh) 2021-12-10

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