JP7792189B2 - 接着剤組成物 - Google Patents

接着剤組成物

Info

Publication number
JP7792189B2
JP7792189B2 JP2019068612A JP2019068612A JP7792189B2 JP 7792189 B2 JP7792189 B2 JP 7792189B2 JP 2019068612 A JP2019068612 A JP 2019068612A JP 2019068612 A JP2019068612 A JP 2019068612A JP 7792189 B2 JP7792189 B2 JP 7792189B2
Authority
JP
Japan
Prior art keywords
particles
silicone
adhesive composition
average particle
rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019068612A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020164722A (ja
JP2020164722A5 (https=
Inventor
大祐 佐藤
明史 樋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2019068612A priority Critical patent/JP7792189B2/ja
Priority to PCT/JP2020/011982 priority patent/WO2020203295A1/ja
Priority to KR1020217030338A priority patent/KR102758192B1/ko
Priority to CN202080026360.2A priority patent/CN113785027B/zh
Publication of JP2020164722A publication Critical patent/JP2020164722A/ja
Publication of JP2020164722A5 publication Critical patent/JP2020164722A5/ja
Application granted granted Critical
Publication of JP7792189B2 publication Critical patent/JP7792189B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2019068612A 2019-03-29 2019-03-29 接着剤組成物 Active JP7792189B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019068612A JP7792189B2 (ja) 2019-03-29 2019-03-29 接着剤組成物
PCT/JP2020/011982 WO2020203295A1 (ja) 2019-03-29 2020-03-18 接着剤組成物
KR1020217030338A KR102758192B1 (ko) 2019-03-29 2020-03-18 접착제 조성물
CN202080026360.2A CN113785027B (zh) 2019-03-29 2020-03-18 粘接剂组合物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019068612A JP7792189B2 (ja) 2019-03-29 2019-03-29 接着剤組成物

Publications (3)

Publication Number Publication Date
JP2020164722A JP2020164722A (ja) 2020-10-08
JP2020164722A5 JP2020164722A5 (https=) 2022-04-04
JP7792189B2 true JP7792189B2 (ja) 2025-12-25

Family

ID=72668769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019068612A Active JP7792189B2 (ja) 2019-03-29 2019-03-29 接着剤組成物

Country Status (4)

Country Link
JP (1) JP7792189B2 (https=)
KR (1) KR102758192B1 (https=)
CN (1) CN113785027B (https=)
WO (1) WO2020203295A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115124813A (zh) * 2021-03-26 2022-09-30 味之素株式会社 树脂组合物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010180334A (ja) 2009-02-06 2010-08-19 Shin-Etsu Chemical Co Ltd 接着剤組成物、接着用シート及びダイシング・ダイアタッチフィルム
JP2015185399A (ja) 2014-03-25 2015-10-22 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP2018104653A (ja) 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3353719B2 (ja) 1998-09-16 2002-12-03 日本電気株式会社 プラズマディスプレイパネルの電極端子取出し構造
JP4086296B2 (ja) 2003-04-28 2008-05-14 オプトレックス株式会社 リード電極の接続構造
WO2005002002A1 (ja) * 2003-06-25 2005-01-06 Hitachi Chemical Co., Ltd. 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
GEP20125702B (en) * 2007-06-29 2012-12-10 Pfizer Benzimidazole derivatives
JP5441954B2 (ja) * 2010-06-14 2014-03-12 日立化成株式会社 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
KR101313939B1 (ko) * 2010-06-14 2013-10-01 히타치가세이가부시끼가이샤 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
JP6371148B2 (ja) * 2014-07-16 2018-08-08 ナミックス株式会社 カメラモジュール用接着剤
JP2018168345A (ja) * 2017-03-30 2018-11-01 デクセリアルズ株式会社 異方性導電接着剤
JP6979326B2 (ja) * 2017-10-20 2021-12-15 日本化薬株式会社 樹脂組成物及び電子部品用接着剤

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010180334A (ja) 2009-02-06 2010-08-19 Shin-Etsu Chemical Co Ltd 接着剤組成物、接着用シート及びダイシング・ダイアタッチフィルム
JP2015185399A (ja) 2014-03-25 2015-10-22 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP2018104653A (ja) 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤

Also Published As

Publication number Publication date
KR102758192B1 (ko) 2025-01-21
KR20210129169A (ko) 2021-10-27
JP2020164722A (ja) 2020-10-08
WO2020203295A1 (ja) 2020-10-08
CN113785027B (zh) 2024-01-12
CN113785027A (zh) 2021-12-10

Similar Documents

Publication Publication Date Title
CN101681858B (zh) 电子部件的连接方法及接合体
JP4775377B2 (ja) 回路接続用接着フィルム、回路部材の接続構造及び回路部材の接続方法
KR101640965B1 (ko) 이방성 도전 필름, 접합체 및 접속 방법
CN104106182B (zh) 各向异性导电连接材料、连接结构体、连接结构体的制造方法和连接方法
CN101755022A (zh) 粘合薄膜、连接方法及接合体
JP2009074020A (ja) 異方性導電膜
JP2009242508A (ja) 接着剤及び接合体
JP2024175135A (ja) 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子
JP5563932B2 (ja) 異方性導電フィルム
JP2010067360A (ja) 異方性導電膜およびその使用方法
JP7792189B2 (ja) 接着剤組成物
JP6196131B2 (ja) プレス接着用金属箔及び電子部品パッケージ
JP7592399B2 (ja) 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子
JP2016177954A (ja) 異方性導電膜
JP4867805B2 (ja) 電極接続用接着剤
KR20140019235A (ko) 회로 접속 재료
CN121195312A (zh) 黏合剂及电路连接结构体的制造方法
JPH10273635A (ja) 回路用接続部材及び回路板の製造法
JP4055583B2 (ja) 回路接続用接着剤組成物、これを用いた回路端子の接続方法及び回路端子の接続構造
KR101227795B1 (ko) 접속 구조체
JP4605186B2 (ja) 基板の製造方法
JP2024063368A (ja) 接続材料、接続構造体、及び接続構造体の製造方法
JP2021089894A (ja) 異方導電性フィルム及び接続構造体
JP2008084545A (ja) 電極接続用接着剤
KR20150034645A (ko) 접속 필름, 접속 구조체, 접속 구조체의 제조 방법, 접속 방법

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220324

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220324

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230214

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230417

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230711

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230907

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20231107

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240207

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20240219

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20240412

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250918

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20251215

R150 Certificate of patent or registration of utility model

Ref document number: 7792189

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150