JP2020164722A5 - - Google Patents

Download PDF

Info

Publication number
JP2020164722A5
JP2020164722A5 JP2019068612A JP2019068612A JP2020164722A5 JP 2020164722 A5 JP2020164722 A5 JP 2020164722A5 JP 2019068612 A JP2019068612 A JP 2019068612A JP 2019068612 A JP2019068612 A JP 2019068612A JP 2020164722 A5 JP2020164722 A5 JP 2020164722A5
Authority
JP
Japan
Prior art keywords
silicone
adhesive composition
particles
particle size
average particle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019068612A
Other languages
English (en)
Japanese (ja)
Other versions
JP7792189B2 (ja
JP2020164722A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2019068612A priority Critical patent/JP7792189B2/ja
Priority claimed from JP2019068612A external-priority patent/JP7792189B2/ja
Priority to PCT/JP2020/011982 priority patent/WO2020203295A1/ja
Priority to KR1020217030338A priority patent/KR102758192B1/ko
Priority to CN202080026360.2A priority patent/CN113785027B/zh
Publication of JP2020164722A publication Critical patent/JP2020164722A/ja
Publication of JP2020164722A5 publication Critical patent/JP2020164722A5/ja
Application granted granted Critical
Publication of JP7792189B2 publication Critical patent/JP7792189B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2019068612A 2019-03-29 2019-03-29 接着剤組成物 Active JP7792189B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019068612A JP7792189B2 (ja) 2019-03-29 2019-03-29 接着剤組成物
PCT/JP2020/011982 WO2020203295A1 (ja) 2019-03-29 2020-03-18 接着剤組成物
KR1020217030338A KR102758192B1 (ko) 2019-03-29 2020-03-18 접착제 조성물
CN202080026360.2A CN113785027B (zh) 2019-03-29 2020-03-18 粘接剂组合物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019068612A JP7792189B2 (ja) 2019-03-29 2019-03-29 接着剤組成物

Publications (3)

Publication Number Publication Date
JP2020164722A JP2020164722A (ja) 2020-10-08
JP2020164722A5 true JP2020164722A5 (https=) 2022-04-04
JP7792189B2 JP7792189B2 (ja) 2025-12-25

Family

ID=72668769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019068612A Active JP7792189B2 (ja) 2019-03-29 2019-03-29 接着剤組成物

Country Status (4)

Country Link
JP (1) JP7792189B2 (https=)
KR (1) KR102758192B1 (https=)
CN (1) CN113785027B (https=)
WO (1) WO2020203295A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115124813A (zh) * 2021-03-26 2022-09-30 味之素株式会社 树脂组合物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3353719B2 (ja) 1998-09-16 2002-12-03 日本電気株式会社 プラズマディスプレイパネルの電極端子取出し構造
JP4086296B2 (ja) 2003-04-28 2008-05-14 オプトレックス株式会社 リード電極の接続構造
WO2005002002A1 (ja) * 2003-06-25 2005-01-06 Hitachi Chemical Co., Ltd. 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
GEP20125702B (en) * 2007-06-29 2012-12-10 Pfizer Benzimidazole derivatives
JP5168736B2 (ja) 2009-02-06 2013-03-27 信越化学工業株式会社 接着剤組成物、接着用シート及びダイシング・ダイアタッチフィルム
JP5441954B2 (ja) * 2010-06-14 2014-03-12 日立化成株式会社 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
KR101313939B1 (ko) * 2010-06-14 2013-10-01 히타치가세이가부시끼가이샤 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
JP6374192B2 (ja) 2014-03-25 2018-08-15 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP6371148B2 (ja) * 2014-07-16 2018-08-08 ナミックス株式会社 カメラモジュール用接着剤
JP2018104653A (ja) 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
JP2018168345A (ja) * 2017-03-30 2018-11-01 デクセリアルズ株式会社 異方性導電接着剤
JP6979326B2 (ja) * 2017-10-20 2021-12-15 日本化薬株式会社 樹脂組成物及び電子部品用接着剤

Similar Documents

Publication Publication Date Title
CN106575625B (zh) 膜状粘接剂、使用膜状粘接剂的半导体封装及其制造方法
CN103320022B (zh) 用于半导体芯片封装的低模量丙烯酸酯导电胶及制备方法
CN105451529B (zh) 电磁波屏蔽膜、柔性印刷布线板以及它们的制造方法
TWI456595B (zh) 異向性導電膜及其製造方法
CN104553113A (zh) 声波式指纹识别组件及其制造方法
CN109153155A (zh) 脱模膜
JP2016127011A5 (https=)
CN105524293A (zh) 一种具有超轻离型力的离型膜及其制备方法
CN108285747B (zh) 一种抗静电保护膜的生产工艺
KR101696268B1 (ko) 전자파 차폐필름용 수지조성물, 전도성 접착제, 및 전자파 차폐필름
JP2017179360A5 (https=)
JP2016134366A5 (https=)
JP2020164722A5 (https=)
CN101493544B (zh) 埋入复合材料的光纤光栅保护与定位方法
CN102709702A (zh) 超材料的制造方法及由该方法制得的超材料制成的天线罩
US20160181183A1 (en) Method for preventing die pad delamination
CN104425678A (zh) 发光二极管及其制造方法
US9138962B2 (en) Ceramic-and-plastic composite and electronic device using the composite
JP2017097974A5 (https=)
JP4900396B2 (ja) 導電性シート材料及び電気的接続構造
TWI616237B (zh) 金屬與非導電材料之複合體之靜電噴塗方法及殼體
CN104506685A (zh) 一种手机壳及其制作工艺
KR20180115876A (ko) 하이브리드 경화형 필름의 제조방법 및 삼차원 형상 자외선 진공 성형방법
CN114121690B (zh) 一种sip封装选择性溅镀的方法
JP2009131909A5 (https=)