KR102655137B1 - 계측 통합형 기판 프로세싱 툴 및 그 이용 방법 - Google Patents
계측 통합형 기판 프로세싱 툴 및 그 이용 방법 Download PDFInfo
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- KR102655137B1 KR102655137B1 KR1020207029987A KR20207029987A KR102655137B1 KR 102655137 B1 KR102655137 B1 KR 102655137B1 KR 1020207029987 A KR1020207029987 A KR 1020207029987A KR 20207029987 A KR20207029987 A KR 20207029987A KR 102655137 B1 KR102655137 B1 KR 102655137B1
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- H01L21/67276—
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- H—ELECTRICITY
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- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
- H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
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- H10P72/0612—Production flow monitoring, e.g. for increasing throughput
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45536—Use of plasma, radiation or electromagnetic fields
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
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- H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
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- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862645685P | 2018-03-20 | 2018-03-20 | |
| US62/645,685 | 2018-03-20 | ||
| PCT/US2019/022617 WO2019182916A1 (en) | 2018-03-20 | 2019-03-15 | Substrate processing tool with integrated metrology and method of using |
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| Publication Number | Publication Date |
|---|---|
| KR20200124314A KR20200124314A (ko) | 2020-11-02 |
| KR102655137B1 true KR102655137B1 (ko) | 2024-04-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207029987A Active KR102655137B1 (ko) | 2018-03-20 | 2019-03-15 | 계측 통합형 기판 프로세싱 툴 및 그 이용 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11264254B2 (https=) |
| JP (1) | JP7295359B2 (https=) |
| KR (1) | KR102655137B1 (https=) |
| CN (1) | CN112074939A (https=) |
| TW (1) | TWI848942B (https=) |
| WO (1) | WO2019182916A1 (https=) |
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| EP3540767A1 (en) * | 2018-03-16 | 2019-09-18 | ASML Netherlands B.V. | Inspection system, lithographic apparatus, and inspection method |
| US11319449B2 (en) * | 2019-12-20 | 2022-05-03 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Area selective deposition of metal containing films |
| US20210202244A1 (en) * | 2019-12-30 | 2021-07-01 | Tokyo Electron Limited | High-throughput multi-stage manufacturing platform and method for processing a plurality of substrates |
| JP7353200B2 (ja) * | 2020-02-06 | 2023-09-29 | 東京エレクトロン株式会社 | 成膜方法 |
| US20240030037A1 (en) * | 2020-09-01 | 2024-01-25 | Adeka Corporation | Etching method |
| US12237158B2 (en) | 2020-11-24 | 2025-02-25 | Applied Materials, Inc. | Etch feedback for control of upstream process |
| JP2022091523A (ja) * | 2020-12-09 | 2022-06-21 | 東京エレクトロン株式会社 | 成膜方法 |
| US11996307B2 (en) * | 2020-12-23 | 2024-05-28 | Applied Materials, Inc. | Semiconductor processing tool platform configuration with reduced footprint |
| US11709477B2 (en) | 2021-01-06 | 2023-07-25 | Applied Materials, Inc. | Autonomous substrate processing system |
| JP7617769B2 (ja) * | 2021-02-25 | 2025-01-20 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
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- 2019-03-15 KR KR1020207029987A patent/KR102655137B1/ko active Active
- 2019-03-15 US US16/355,579 patent/US11264254B2/en active Active
- 2019-03-15 JP JP2020550762A patent/JP7295359B2/ja active Active
- 2019-03-15 CN CN201980029771.4A patent/CN112074939A/zh active Pending
- 2019-03-19 TW TW108109231A patent/TWI848942B/zh active
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2022
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Also Published As
| Publication number | Publication date |
|---|---|
| US20190295870A1 (en) | 2019-09-26 |
| JP2021518673A (ja) | 2021-08-02 |
| TWI848942B (zh) | 2024-07-21 |
| CN112074939A (zh) | 2020-12-11 |
| US20220181176A1 (en) | 2022-06-09 |
| US11264254B2 (en) | 2022-03-01 |
| KR20200124314A (ko) | 2020-11-02 |
| TW201941346A (zh) | 2019-10-16 |
| WO2019182916A1 (en) | 2019-09-26 |
| US11769677B2 (en) | 2023-09-26 |
| JP7295359B2 (ja) | 2023-06-21 |
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