CN112074939A - 具有集成计量的衬底加工工具及其使用方法 - Google Patents

具有集成计量的衬底加工工具及其使用方法 Download PDF

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Publication number
CN112074939A
CN112074939A CN201980029771.4A CN201980029771A CN112074939A CN 112074939 A CN112074939 A CN 112074939A CN 201980029771 A CN201980029771 A CN 201980029771A CN 112074939 A CN112074939 A CN 112074939A
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substrate
substrate processing
chamber
transfer chamber
metrology module
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Chinese (zh)
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坎达巴拉·塔皮利
罗伯特·克拉克
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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