KR102630308B1 - 점착 시트 및 반도체 장치의 제조 방법 - Google Patents

점착 시트 및 반도체 장치의 제조 방법 Download PDF

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Publication number
KR102630308B1
KR102630308B1 KR1020207016851A KR20207016851A KR102630308B1 KR 102630308 B1 KR102630308 B1 KR 102630308B1 KR 1020207016851 A KR1020207016851 A KR 1020207016851A KR 20207016851 A KR20207016851 A KR 20207016851A KR 102630308 B1 KR102630308 B1 KR 102630308B1
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KR
South Korea
Prior art keywords
adhesive sheet
adhesive
meth
mass
functional group
Prior art date
Application number
KR1020207016851A
Other languages
English (en)
Korean (ko)
Other versions
KR20200101914A (ko
Inventor
겐 다카노
야스노리 가라사와
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2017/047211 external-priority patent/WO2019130539A1/ja
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20200101914A publication Critical patent/KR20200101914A/ko
Application granted granted Critical
Publication of KR102630308B1 publication Critical patent/KR102630308B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
KR1020207016851A 2017-12-28 2018-12-27 점착 시트 및 반도체 장치의 제조 방법 KR102630308B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPPCT/JP2017/047211 2017-12-28
PCT/JP2017/047211 WO2019130539A1 (ja) 2017-12-28 2017-12-28 粘着シート及び半導体装置の製造方法
JP2018152028 2018-08-10
JPJP-P-2018-152028 2018-08-10
PCT/JP2018/048170 WO2019131888A1 (ja) 2017-12-28 2018-12-27 粘着シート及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR20200101914A KR20200101914A (ko) 2020-08-28
KR102630308B1 true KR102630308B1 (ko) 2024-01-29

Family

ID=67067644

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207016851A KR102630308B1 (ko) 2017-12-28 2018-12-27 점착 시트 및 반도체 장치의 제조 방법

Country Status (5)

Country Link
JP (2) JP7416626B2 (zh)
KR (1) KR102630308B1 (zh)
CN (1) CN111527594B (zh)
TW (1) TWI787424B (zh)
WO (1) WO2019131888A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102654342B1 (ko) * 2019-09-19 2024-04-02 주식회사 엘지화학 점착제 조성물 및 이를 이용한 임시고정용 점착시트
JP2021114586A (ja) * 2020-01-21 2021-08-05 日東電工株式会社 紫外線硬化型粘着シート
US20240141217A1 (en) * 2021-03-03 2024-05-02 Nitto Denko Corporation Resin sheet and use thereof
WO2023095664A1 (ja) * 2021-11-25 2023-06-01 日東電工株式会社 粘着剤組成物および粘着シート

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013040276A (ja) * 2011-08-16 2013-02-28 Toray Advanced Materials Korea Inc 電子部品製造用粘着テープ
JP2017082104A (ja) * 2015-10-28 2017-05-18 リンテック株式会社 粘着シート及び半導体装置製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010073853A (ja) 2008-09-18 2010-04-02 Nitto Denko Corp 半導体装置製造用耐熱性粘着テープ及び半導体装置の製造方法
JP5335483B2 (ja) * 2009-02-27 2013-11-06 リンテック株式会社 粘着剤層付き偏光板の製造方法
JP5602374B2 (ja) * 2009-03-30 2014-10-08 リンテック株式会社 粘着剤組成物および粘着シート
JP2012069586A (ja) 2010-09-21 2012-04-05 Nitto Denko Corp ダイシング・ダイボンドフィルム、ダイシング・ダイボンドフィルムの製造方法、及び、半導体装置の製造方法
JP5588950B2 (ja) 2011-10-17 2014-09-10 日東電工株式会社 耐熱性粘着テープ
JP6067405B2 (ja) 2012-07-31 2017-01-25 日東電工株式会社 放射線硬化型粘着剤、放射線硬化型粘着剤層、放射線硬化型粘着シートおよび積層体
WO2014157329A1 (ja) 2013-03-27 2014-10-02 リンテック株式会社 半導体チップの製造方法
JP6325778B2 (ja) * 2013-06-28 2018-05-16 リンテック株式会社 粘着シートおよび積層体
WO2015046529A1 (ja) 2013-09-30 2015-04-02 リンテック株式会社 樹脂膜形成用複合シート
JPWO2015064574A1 (ja) 2013-10-30 2017-03-09 リンテック株式会社 半導体接合用接着シートおよび半導体装置の製造方法
JP5858347B2 (ja) * 2014-02-05 2016-02-10 大日本印刷株式会社 粘着剤組成物およびそれを用いた粘着フィルム
JP6325481B2 (ja) * 2015-03-31 2018-05-16 リンテック株式会社 粘着シート
JP6654362B2 (ja) 2015-06-04 2020-02-26 日東電工株式会社 粘着剤付き光学フィルム、および画像表示装置の製造方法
TWI621684B (zh) 2015-09-01 2018-04-21 Lintec Corp Adhesive sheet
TW201724291A (zh) 2015-09-01 2017-07-01 Lintec Corp 黏著薄片及半導體裝置之製造方法
JP6868344B2 (ja) * 2016-04-20 2021-05-12 日東電工株式会社 偏光フィルムおよびその製造方法、光学フィルムおよび画像表示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013040276A (ja) * 2011-08-16 2013-02-28 Toray Advanced Materials Korea Inc 電子部品製造用粘着テープ
JP2017082104A (ja) * 2015-10-28 2017-05-18 リンテック株式会社 粘着シート及び半導体装置製造方法

Also Published As

Publication number Publication date
CN111527594A (zh) 2020-08-11
JPWO2019131888A1 (ja) 2020-12-24
CN111527594B (zh) 2023-10-20
KR20200101914A (ko) 2020-08-28
JP7416626B2 (ja) 2024-01-17
JP2024003066A (ja) 2024-01-11
WO2019131888A1 (ja) 2019-07-04
TW201936839A (zh) 2019-09-16
TWI787424B (zh) 2022-12-21
JP7568815B2 (ja) 2024-10-16

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