KR102476597B1 - 수지 성형 장치 및 수지 성형품의 제조 방법 - Google Patents

수지 성형 장치 및 수지 성형품의 제조 방법 Download PDF

Info

Publication number
KR102476597B1
KR102476597B1 KR1020210078541A KR20210078541A KR102476597B1 KR 102476597 B1 KR102476597 B1 KR 102476597B1 KR 1020210078541 A KR1020210078541 A KR 1020210078541A KR 20210078541 A KR20210078541 A KR 20210078541A KR 102476597 B1 KR102476597 B1 KR 102476597B1
Authority
KR
South Korea
Prior art keywords
resin material
resin
image data
supply mechanism
molding apparatus
Prior art date
Application number
KR1020210078541A
Other languages
English (en)
Korean (ko)
Other versions
KR20210157882A (ko
Inventor
신 다케우치
료타 오카모토
유스케 이시카와
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20210157882A publication Critical patent/KR20210157882A/ko
Application granted granted Critical
Publication of KR102476597B1 publication Critical patent/KR102476597B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/44—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
KR1020210078541A 2020-06-22 2021-06-17 수지 성형 장치 및 수지 성형품의 제조 방법 KR102476597B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020106870A JP7003184B2 (ja) 2020-06-22 2020-06-22 樹脂成形装置、及び、樹脂成形品の製造方法
JPJP-P-2020-106870 2020-06-22

Publications (2)

Publication Number Publication Date
KR20210157882A KR20210157882A (ko) 2021-12-29
KR102476597B1 true KR102476597B1 (ko) 2022-12-12

Family

ID=79176950

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210078541A KR102476597B1 (ko) 2020-06-22 2021-06-17 수지 성형 장치 및 수지 성형품의 제조 방법

Country Status (4)

Country Link
JP (1) JP7003184B2 (ja)
KR (1) KR102476597B1 (ja)
CN (1) CN113903682A (ja)
TW (1) TWI773331B (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008132440A (ja) * 2006-11-29 2008-06-12 Musashi Eng Co Ltd 液体材料の充填方法および装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6381011A (ja) * 1986-09-25 1988-04-11 Bridgestone Corp ロ−ル間のゴムバンク量測定装置
JPH0639864A (ja) * 1992-07-22 1994-02-15 Mitsubishi Plastics Ind Ltd カレンダバンクの制御方法
JP4235621B2 (ja) 2005-03-31 2009-03-11 太陽誘電株式会社 半導体実装基板、半導体実装用基板、その外観検査方法及び外観検査装置
JP2011061165A (ja) * 2009-09-14 2011-03-24 Canon Inc インプリント装置及び物品の製造方法
JP6071216B2 (ja) 2012-02-28 2017-02-01 Ｔｏｗａ株式会社 樹脂封止用材料の製造方法及び樹脂封止装置
JP6552329B2 (ja) * 2014-09-12 2019-07-31 キヤノン株式会社 インプリント装置、インプリントシステム及び物品の製造方法
JP6674218B2 (ja) * 2014-12-09 2020-04-01 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6438332B2 (ja) 2015-03-18 2018-12-12 キヤノン株式会社 インプリントシステム、および物品の製造方法
JP6566706B2 (ja) * 2015-04-29 2019-08-28 Ｔｏｗａ株式会社 物品の製造装置及び製造方法
JP6218891B1 (ja) 2016-06-24 2017-10-25 Ｔｏｗａ株式会社 樹脂成形装置、樹脂成形品の製造方法及び製品の製造方法
JP6284996B1 (ja) * 2016-11-04 2018-02-28 Ｔｏｗａ株式会社 検査方法、樹脂封止装置、樹脂封止方法及び樹脂封止品の製造方法
JP7158173B2 (ja) 2017-05-15 2022-10-21 キヤノン株式会社 ドロップレシピの決定方法、インプリント装置および物品製造方法
JP6923503B2 (ja) * 2018-11-27 2021-08-18 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008132440A (ja) * 2006-11-29 2008-06-12 Musashi Eng Co Ltd 液体材料の充填方法および装置

Also Published As

Publication number Publication date
JP2022001419A (ja) 2022-01-06
TWI773331B (zh) 2022-08-01
CN113903682A (zh) 2022-01-07
KR20210157882A (ko) 2021-12-29
TW202200340A (zh) 2022-01-01
JP7003184B2 (ja) 2022-01-20

Similar Documents

Publication Publication Date Title
JP6923503B2 (ja) 樹脂成形装置、及び樹脂成形品の製造方法
KR102476597B1 (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
KR20140070464A (ko) 기판의 결함 검사 방법, 기판의 결함 검사 장치 및 컴퓨터 기억 매체
CN113690159A (zh) 芯片封装件的检测系统以及芯片封装件的检测方法
KR200339601Y1 (ko) 반도체 소자 비전 검사장치
KR20190073496A (ko) 수지 밀봉 장치의 촬상 방법 및 수지 밀봉 장치
JP7482824B2 (ja) 樹脂成形装置、及び、樹脂成形品の製造方法
JP6475030B2 (ja) 基板処理システム及び基板処理方法
JP2001228098A (ja) 検査・テーピング装置
US20220059377A1 (en) Inspection device, resin molding apparatus, and method of manufacturing resin molded product
TWI835241B (zh) 維護方法、及電子零件的製造方法
JP4021677B2 (ja) 半導体装置の検査方法
TWI808864B (zh) 校正方法、及電子零件的製造方法
JP2023089883A (ja) 樹脂成形装置、及び、樹脂成形品の製造方法
US20240116224A1 (en) Compression molding device
KR101746468B1 (ko) 에지 그라인딩 시스템
KR100990938B1 (ko) 반도체 패키지 제조 장치
KR20010088635A (ko) 라인스캔닝카메라 촬영법에 의한 리드프레임 검사방법
JP2021118244A (ja) 樹脂モールド装置及び樹脂モールド方法
JPH04177107A (ja) 成形品の外観検査装置
JP2010093137A (ja) 樹脂の管理方法及び樹脂封止装置
JP2008132726A (ja) 樹脂モールド装置
JP2004310343A (ja) 樹脂封止済基板の外観検査方法
JP2005285962A (ja) 半導体部品検査方法および半導体部品検査装置

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant