KR102466204B1 - 인쇄회로기판 및 인쇄회로기판의 제조방법 - Google Patents

인쇄회로기판 및 인쇄회로기판의 제조방법 Download PDF

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Publication number
KR102466204B1
KR102466204B1 KR1020150180330A KR20150180330A KR102466204B1 KR 102466204 B1 KR102466204 B1 KR 102466204B1 KR 1020150180330 A KR1020150180330 A KR 1020150180330A KR 20150180330 A KR20150180330 A KR 20150180330A KR 102466204 B1 KR102466204 B1 KR 102466204B1
Authority
KR
South Korea
Prior art keywords
insulating layer
circuit board
cavity
printed circuit
layer
Prior art date
Application number
KR1020150180330A
Other languages
English (en)
Korean (ko)
Other versions
KR20170072013A (ko
Inventor
박제상
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020150180330A priority Critical patent/KR102466204B1/ko
Priority to CN201611043463.1A priority patent/CN106888552B/zh
Publication of KR20170072013A publication Critical patent/KR20170072013A/ko
Application granted granted Critical
Publication of KR102466204B1 publication Critical patent/KR102466204B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020150180330A 2015-12-16 2015-12-16 인쇄회로기판 및 인쇄회로기판의 제조방법 KR102466204B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020150180330A KR102466204B1 (ko) 2015-12-16 2015-12-16 인쇄회로기판 및 인쇄회로기판의 제조방법
CN201611043463.1A CN106888552B (zh) 2015-12-16 2016-11-23 印刷电路板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150180330A KR102466204B1 (ko) 2015-12-16 2015-12-16 인쇄회로기판 및 인쇄회로기판의 제조방법

Publications (2)

Publication Number Publication Date
KR20170072013A KR20170072013A (ko) 2017-06-26
KR102466204B1 true KR102466204B1 (ko) 2022-11-11

Family

ID=59175633

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150180330A KR102466204B1 (ko) 2015-12-16 2015-12-16 인쇄회로기판 및 인쇄회로기판의 제조방법

Country Status (2)

Country Link
KR (1) KR102466204B1 (zh)
CN (1) CN106888552B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107613642B (zh) * 2017-08-31 2019-06-07 江苏普诺威电子股份有限公司 含阶梯槽埋容线路板的制作方法
KR102501905B1 (ko) * 2017-11-09 2023-02-21 삼성전기주식회사 인쇄회로기판 및 그 제조방법
EP3982700A4 (en) * 2019-06-04 2023-11-29 LG Innotek Co., Ltd. PRINTED CIRCUIT BOARD
CN114449781A (zh) * 2020-10-30 2022-05-06 庆鼎精密电子（淮安）有限公司 内埋元件电路板及其制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011018893A (ja) * 2009-07-08 2011-01-27 Samsung Electro-Mechanics Co Ltd 絶縁体、電子素子内蔵型印刷回路基板、及び電子素子内蔵型印刷回路基板の製造方法
JP2013520007A (ja) * 2010-02-12 2013-05-30 エルジー イノテック カンパニー リミテッド 印刷回路基板及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102017821A (zh) * 2008-02-04 2011-04-13 索尼化学&信息部件株式会社 抗蚀油墨及多层印刷配线板的制造方法
WO2010140214A1 (ja) * 2009-06-02 2010-12-09 ソニーケミカル＆インフォメーションデバイス株式会社 多層プリント配線板の製造方法
TWI418272B (zh) * 2009-08-25 2013-12-01 Samsung Electro Mech 處理核心基板之空腔的方法
KR101976602B1 (ko) * 2012-12-26 2019-05-10 엘지이노텍 주식회사 인쇄회로 기판 및 그 제조 방법
TWI610606B (zh) 2013-02-21 2018-01-01 味之素股份有限公司 零件內建配線基板之製造方法及半導體裝置
KR101601815B1 (ko) * 2014-02-06 2016-03-10 삼성전기주식회사 임베디드 기판, 인쇄회로기판 및 그 제조 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011018893A (ja) * 2009-07-08 2011-01-27 Samsung Electro-Mechanics Co Ltd 絶縁体、電子素子内蔵型印刷回路基板、及び電子素子内蔵型印刷回路基板の製造方法
JP2013520007A (ja) * 2010-02-12 2013-05-30 エルジー イノテック カンパニー リミテッド 印刷回路基板及びその製造方法

Also Published As

Publication number Publication date
CN106888552B (zh) 2020-05-19
CN106888552A (zh) 2017-06-23
KR20170072013A (ko) 2017-06-26

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