KR102433203B1 - 무전해 금 도금액, 알데히드-아민 부가체 보급액 및 그것들을 사용하여 형성한 금 피막 - Google Patents

무전해 금 도금액, 알데히드-아민 부가체 보급액 및 그것들을 사용하여 형성한 금 피막 Download PDF

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Publication number
KR102433203B1
KR102433203B1 KR1020177019892A KR20177019892A KR102433203B1 KR 102433203 B1 KR102433203 B1 KR 102433203B1 KR 1020177019892 A KR1020177019892 A KR 1020177019892A KR 20177019892 A KR20177019892 A KR 20177019892A KR 102433203 B1 KR102433203 B1 KR 102433203B1
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KR
South Korea
Prior art keywords
aldehyde
gold plating
plating solution
gold
amine
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KR1020177019892A
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English (en)
Korean (ko)
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KR20170142160A (ko
Inventor
요시조 기요하라
가즈야 시바타
히로시 하라시마
유스케 나카가와
유야 오쿠보
Original Assignee
니혼 고쥰도가가쿠 가부시키가이샤
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Publication of KR20170142160A publication Critical patent/KR20170142160A/ko
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Publication of KR102433203B1 publication Critical patent/KR102433203B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
KR1020177019892A 2015-04-30 2015-05-20 무전해 금 도금액, 알데히드-아민 부가체 보급액 및 그것들을 사용하여 형성한 금 피막 KR102433203B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015092629A JP6619563B2 (ja) 2015-04-30 2015-04-30 無電解金めっき液、アルデヒド−アミン付加体補給液及びそれらを用いて形成した金皮膜
JPJP-P-2015-092629 2015-04-30
PCT/JP2015/064427 WO2016174780A1 (ja) 2015-04-30 2015-05-20 無電解金めっき液、アルデヒド－アミン付加体補給液及びそれらを用いて形成した金皮膜

Publications (2)

Publication Number Publication Date
KR20170142160A KR20170142160A (ko) 2017-12-27
KR102433203B1 true KR102433203B1 (ko) 2022-08-16

Family

ID=57199083

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177019892A KR102433203B1 (ko) 2015-04-30 2015-05-20 무전해 금 도금액, 알데히드-아민 부가체 보급액 및 그것들을 사용하여 형성한 금 피막

Country Status (4)

Country Link
JP (1) JP6619563B2 (ja)
KR (1) KR102433203B1 (ja)
TW (1) TWI707060B (ja)
WO (1) WO2016174780A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7228411B2 (ja) 2019-03-06 2023-02-24 上村工業株式会社 無電解金めっき浴
US20210371998A1 (en) * 2020-05-27 2021-12-02 Macdermid Enthone Inc. Gold Plating Bath and Gold Plated Final Finish
CN111778498B (zh) * 2020-07-02 2024-04-26 深圳市化讯半导体材料有限公司 一种镀膜结构及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008169425A (ja) * 2007-01-11 2008-07-24 C Uyemura & Co Ltd 無電解金めっき浴のめっき能維持管理方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8812329D0 (en) * 1988-05-25 1988-06-29 Engelhard Corp Electroless deposition
JP2538461B2 (ja) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 無電解金めっき方法
JP4116718B2 (ja) * 1998-11-05 2008-07-09 日本リーロナール有限会社 無電解金めっき方法及びそれに使用する無電解金めっき液
JP2003518552A (ja) * 1999-11-05 2003-06-10 シップレーカンパニー エル エル シー 無電解金めっき組成物及びその使用方法
JP3994279B2 (ja) * 2002-10-21 2007-10-17 奥野製薬工業株式会社 無電解金めっき液
CN100510174C (zh) * 2003-06-10 2009-07-08 日矿金属株式会社 化学镀金液
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526459B2 (ja) 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526440B2 (ja) * 2007-01-17 2014-06-18 奥野製薬工業株式会社 パラジウム皮膜用還元析出型無電解金めっき液を用いて形成されたプリント配線板
JP5013077B2 (ja) 2007-04-16 2012-08-29 上村工業株式会社 無電解金めっき方法及び電子部品
JP2011249511A (ja) * 2010-05-26 2011-12-08 Sumitomo Bakelite Co Ltd 金メッキ金属微細パターン付き基材の製造方法、金メッキ金属微細パターン付き基材、プリント配線板、インターポーザ及び半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008169425A (ja) * 2007-01-11 2008-07-24 C Uyemura & Co Ltd 無電解金めっき浴のめっき能維持管理方法

Also Published As

Publication number Publication date
TW201638383A (zh) 2016-11-01
WO2016174780A1 (ja) 2016-11-03
KR20170142160A (ko) 2017-12-27
TWI707060B (zh) 2020-10-11
JP6619563B2 (ja) 2019-12-11
JP2016211014A (ja) 2016-12-15

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