GB8812329D0 - Electroless deposition - Google Patents
Electroless depositionInfo
- Publication number
- GB8812329D0 GB8812329D0 GB888812329A GB8812329A GB8812329D0 GB 8812329 D0 GB8812329 D0 GB 8812329D0 GB 888812329 A GB888812329 A GB 888812329A GB 8812329 A GB8812329 A GB 8812329A GB 8812329 D0 GB8812329 D0 GB 8812329D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- electroless deposition
- electroless
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Nonmetallic Welding Materials (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB888812329A GB8812329D0 (en) | 1988-05-25 | 1988-05-25 | Electroless deposition |
EP89304821A EP0343816A1 (en) | 1988-05-25 | 1989-05-12 | Electroless deposition |
JP1126824A JPH0219473A (en) | 1988-05-25 | 1989-05-22 | Electroless gold precipitation |
KR1019890006953A KR890017391A (en) | 1988-05-25 | 1989-05-24 | Electroless Welding Method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB888812329A GB8812329D0 (en) | 1988-05-25 | 1988-05-25 | Electroless deposition |
Publications (1)
Publication Number | Publication Date |
---|---|
GB8812329D0 true GB8812329D0 (en) | 1988-06-29 |
Family
ID=10637487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB888812329A Pending GB8812329D0 (en) | 1988-05-25 | 1988-05-25 | Electroless deposition |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0343816A1 (en) |
JP (1) | JPH0219473A (en) |
KR (1) | KR890017391A (en) |
GB (1) | GB8812329D0 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2866676B2 (en) * | 1989-09-18 | 1999-03-08 | 株式会社日立製作所 | Electroless gold plating solution and gold plating method using the same |
US5338343A (en) * | 1993-07-23 | 1994-08-16 | Technic Incorporated | Catalytic electroless gold plating baths |
US5635253A (en) * | 1994-08-30 | 1997-06-03 | International Business Machines Corporation | Method of replenishing electroless gold plating baths |
JP6619563B2 (en) * | 2015-04-30 | 2019-12-11 | 日本高純度化学株式会社 | Electroless gold plating solution, aldehyde-amine adduct replenisher, and gold film formed using them |
JP2023097848A (en) * | 2021-12-28 | 2023-07-10 | 上村工業株式会社 | Method for regenerating gold plating solution |
EP4407067A1 (en) | 2023-01-24 | 2024-07-31 | Atotech Deutschland GmbH & Co. KG | Plating bath composition for plating of precious metal and a method for depositing a precious metal layer |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3485643A (en) * | 1966-05-06 | 1969-12-23 | Photocircuits Corp | Electroless copper plating |
-
1988
- 1988-05-25 GB GB888812329A patent/GB8812329D0/en active Pending
-
1989
- 1989-05-12 EP EP89304821A patent/EP0343816A1/en not_active Withdrawn
- 1989-05-22 JP JP1126824A patent/JPH0219473A/en active Pending
- 1989-05-24 KR KR1019890006953A patent/KR890017391A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR890017391A (en) | 1989-12-16 |
JPH0219473A (en) | 1990-01-23 |
EP0343816A1 (en) | 1989-11-29 |
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