KR102412983B1 - 적층 세라믹 콘덴서 및 그 제조 방법 - Google Patents
적층 세라믹 콘덴서 및 그 제조 방법 Download PDFInfo
- Publication number
- KR102412983B1 KR102412983B1 KR1020180029149A KR20180029149A KR102412983B1 KR 102412983 B1 KR102412983 B1 KR 102412983B1 KR 1020180029149 A KR1020180029149 A KR 1020180029149A KR 20180029149 A KR20180029149 A KR 20180029149A KR 102412983 B1 KR102412983 B1 KR 102412983B1
- Authority
- KR
- South Korea
- Prior art keywords
- internal electrode
- electrode layer
- multilayer ceramic
- ceramic capacitor
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2017-097511 | 2017-05-16 | ||
| JP2017097511A JP6996867B2 (ja) | 2017-05-16 | 2017-05-16 | 積層セラミックコンデンサおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180125875A KR20180125875A (ko) | 2018-11-26 |
| KR102412983B1 true KR102412983B1 (ko) | 2022-06-24 |
Family
ID=64272738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020180029149A Active KR102412983B1 (ko) | 2017-05-16 | 2018-03-13 | 적층 세라믹 콘덴서 및 그 제조 방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10593474B2 (enExample) |
| JP (1) | JP6996867B2 (enExample) |
| KR (1) | KR102412983B1 (enExample) |
| CN (1) | CN108878143A (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6986360B2 (ja) | 2017-04-05 | 2021-12-22 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
| JP6986361B2 (ja) * | 2017-04-05 | 2021-12-22 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
| JP7169069B2 (ja) * | 2017-05-16 | 2022-11-10 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
| US10483038B2 (en) | 2017-05-16 | 2019-11-19 | Taiyo Yuden Co., Ltd. | Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor |
| KR102748942B1 (ko) * | 2019-07-29 | 2025-01-02 | 삼성전기주식회사 | 적층형 전자 부품 |
| KR102671970B1 (ko) * | 2019-08-16 | 2024-06-05 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
| JP7536434B2 (ja) * | 2019-10-04 | 2024-08-20 | 太陽誘電株式会社 | セラミック電子部品の製造方法、およびシート部材 |
| JP7523922B2 (ja) * | 2020-03-03 | 2024-07-29 | 太陽誘電株式会社 | セラミック電子部品の製造方法、および金属導電ペースト |
| KR102776256B1 (ko) * | 2020-11-19 | 2025-03-07 | 삼성전기주식회사 | 적층형 전자 부품 |
| WO2023162297A1 (ja) * | 2022-02-22 | 2023-08-31 | Tdk株式会社 | 積層セラミック電子部品 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311985A (ja) * | 2003-03-27 | 2004-11-04 | Tdk Corp | 積層型チップコンデンサおよびその製造方法 |
| JP2004323866A (ja) * | 2003-04-21 | 2004-11-18 | Murata Mfg Co Ltd | ニッケル粉末の製造方法及びニッケル粉末 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2872446B2 (ja) * | 1991-06-10 | 1999-03-17 | ローム株式会社 | 積層セラミックコンデンサ |
| JP3350949B2 (ja) * | 1992-02-20 | 2002-11-25 | 株式会社村田製作所 | 導電性ペースト |
| TW467779B (en) * | 1999-11-12 | 2001-12-11 | Mitsui Mining & Smelting Co | Nickel powder and conductive paste |
| JP3697401B2 (ja) * | 2001-02-22 | 2005-09-21 | 株式会社ノリタケカンパニーリミテド | 導体ペースト及びその製造方法 |
| US6855222B2 (en) * | 2002-06-19 | 2005-02-15 | Murata Manufacturing Co., Ltd. | Method for manufacturing laminated multilayer electronic components |
| JP4200792B2 (ja) * | 2003-03-12 | 2008-12-24 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JP4267614B2 (ja) * | 2005-09-30 | 2009-05-27 | Tdk株式会社 | 積層型セラミック電子部品の製造方法 |
| JP2007273684A (ja) * | 2006-03-31 | 2007-10-18 | Tdk Corp | 積層型電子部品の製造方法 |
| JP4861946B2 (ja) * | 2007-09-26 | 2012-01-25 | 株式会社ノリタケカンパニーリミテド | 高速焼成による膜状導体の製造方法 |
| JP2010067418A (ja) * | 2008-09-09 | 2010-03-25 | Noritake Co Ltd | 導体ペーストおよびその製造方法 |
| KR20130051994A (ko) * | 2010-11-24 | 2013-05-21 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 전자부품 및 그 제조방법 |
| KR101843190B1 (ko) * | 2011-08-31 | 2018-03-28 | 삼성전기주식회사 | 세라믹 전자부품 및 이의 제조방법 |
| KR101761939B1 (ko) | 2012-04-26 | 2017-07-26 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이의 제조방법 |
| KR101922867B1 (ko) | 2012-10-12 | 2018-11-28 | 삼성전기 주식회사 | 적층 세라믹 전자부품 및 이의 제조방법 |
| KR102041629B1 (ko) * | 2013-02-28 | 2019-11-06 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이의 제조방법 |
| JP2016146469A (ja) * | 2015-01-31 | 2016-08-12 | 株式会社村田製作所 | 積層セラミックコンデンサ、積層セラミックコンデンサの実装構造およびテーピング電子部品連 |
| KR102183425B1 (ko) * | 2015-07-22 | 2020-11-27 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
| US10483038B2 (en) | 2017-05-16 | 2019-11-19 | Taiyo Yuden Co., Ltd. | Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor |
-
2017
- 2017-05-16 JP JP2017097511A patent/JP6996867B2/ja active Active
-
2018
- 2018-02-28 US US15/908,519 patent/US10593474B2/en active Active
- 2018-03-13 KR KR1020180029149A patent/KR102412983B1/ko active Active
- 2018-03-23 CN CN201810245432.7A patent/CN108878143A/zh active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311985A (ja) * | 2003-03-27 | 2004-11-04 | Tdk Corp | 積層型チップコンデンサおよびその製造方法 |
| JP2004323866A (ja) * | 2003-04-21 | 2004-11-18 | Murata Mfg Co Ltd | ニッケル粉末の製造方法及びニッケル粉末 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018195672A (ja) | 2018-12-06 |
| US10593474B2 (en) | 2020-03-17 |
| US20180336998A1 (en) | 2018-11-22 |
| JP6996867B2 (ja) | 2022-01-17 |
| CN108878143A (zh) | 2018-11-23 |
| KR20180125875A (ko) | 2018-11-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108735508B (zh) | 多层陶瓷电容器及其制造方法 | |
| KR102648161B1 (ko) | 적층 세라믹 콘덴서 및 그 제조 방법 | |
| KR102587765B1 (ko) | 적층 세라믹 콘덴서 및 그 제조 방법 | |
| KR102520018B1 (ko) | 적층 세라믹 콘덴서 및 그 제조 방법 | |
| KR102442888B1 (ko) | 적층 세라믹 콘덴서 및 그 제조 방법 | |
| JP6996867B2 (ja) | 積層セラミックコンデンサおよびその製造方法 | |
| KR102684967B1 (ko) | 적층 세라믹 콘덴서 및 그 제조 방법 | |
| US11017945B2 (en) | Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor | |
| TWI793148B (zh) | 積層陶瓷電容器及其製造方法 | |
| JP6986360B2 (ja) | 積層セラミックコンデンサおよびその製造方法 | |
| JP6823975B2 (ja) | 積層セラミックコンデンサおよびその製造方法 | |
| KR20210063238A (ko) | 세라믹 전자 부품 및 그 제조 방법 | |
| KR102700456B1 (ko) | 적층 세라믹 콘덴서 및 그 제조 방법 | |
| JP7477080B2 (ja) | セラミック電子部品の製造方法 | |
| US10879002B2 (en) | Ceramic capacitor and manufacturing method thereof | |
| CN116031068A (zh) | 陶瓷电子器件 | |
| CN108878147A (zh) | 多层陶瓷电容器以及多层陶瓷电容器的制造方法 | |
| KR102491421B1 (ko) | 적층 세라믹 콘덴서 및 그 제조 방법 | |
| WO2023054378A1 (ja) | 積層セラミックコンデンサ | |
| US20250385046A1 (en) | Multilayer ceramic capacitor | |
| KR20260027350A (ko) | 적층 세라믹 콘덴서 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| U11 | Full renewal or maintenance fee paid |
Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE) Year of fee payment: 4 |