KR102399159B1 - 수지 조성물, 이를 사용한 열경화성 필름, 수지 경화물, 적층판, 프린트 배선판 및 반도체 장치 - Google Patents

수지 조성물, 이를 사용한 열경화성 필름, 수지 경화물, 적층판, 프린트 배선판 및 반도체 장치 Download PDF

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KR102399159B1
KR102399159B1 KR1020197013775A KR20197013775A KR102399159B1 KR 102399159 B1 KR102399159 B1 KR 102399159B1 KR 1020197013775 A KR1020197013775 A KR 1020197013775A KR 20197013775 A KR20197013775 A KR 20197013775A KR 102399159 B1 KR102399159 B1 KR 102399159B1
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South Korea
Prior art keywords
resin
resin composition
cured
component
carbon atoms
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KR1020197013775A
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English (en)
Korean (ko)
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KR20190080887A (ko
Inventor
준야 사토
츠요시 구로카와
마사키 요시다
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나믹스 가부시끼가이샤
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Publication of KR20190080887A publication Critical patent/KR20190080887A/ko
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Publication of KR102399159B1 publication Critical patent/KR102399159B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020197013775A 2016-11-24 2017-11-15 수지 조성물, 이를 사용한 열경화성 필름, 수지 경화물, 적층판, 프린트 배선판 및 반도체 장치 KR102399159B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-227533 2016-11-24
JP2016227533 2016-11-24
PCT/JP2017/041129 WO2018097010A1 (ja) 2016-11-24 2017-11-15 樹脂組成物、それを用いた熱硬化性フィルム、樹脂硬化物、積層板、プリント配線板、および半導体装置

Publications (2)

Publication Number Publication Date
KR20190080887A KR20190080887A (ko) 2019-07-08
KR102399159B1 true KR102399159B1 (ko) 2022-05-17

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KR1020197013775A KR102399159B1 (ko) 2016-11-24 2017-11-15 수지 조성물, 이를 사용한 열경화성 필름, 수지 경화물, 적층판, 프린트 배선판 및 반도체 장치

Country Status (5)

Country Link
JP (1) JP6917636B2 (zh)
KR (1) KR102399159B1 (zh)
CN (1) CN109923176B (zh)
TW (1) TWI743251B (zh)
WO (1) WO2018097010A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6796247B2 (ja) * 2016-03-22 2020-12-09 株式会社スリーボンド エポキシ樹脂組成物
CN111164151A (zh) * 2017-10-10 2020-05-15 味之素株式会社 固化体及其制造方法、树脂片材及树脂组合物
KR20210069636A (ko) * 2018-10-02 2021-06-11 나믹스 가부시끼가이샤 수지 조성물, 필름, 적층판 및 반도체 장치
JP7364243B2 (ja) 2018-12-04 2023-10-18 ナミックス株式会社 ミリ波基板用樹脂組成物、ミリ波基板用接着フィルム、ミリ波基板、ミリ波レーダー基板および半導体装置
JP7474064B2 (ja) 2019-02-18 2024-04-24 積水化学工業株式会社 樹脂材料及び多層プリント配線板
CN110554567B (zh) * 2019-08-28 2022-04-15 浙江福斯特新材料研究院有限公司 树脂组合物及其应用
CN113025117A (zh) * 2020-08-20 2021-06-25 深圳市百柔新材料技术有限公司 阻焊油墨及制备方法和使用方法、印制电路板

Citations (4)

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JP2009070916A (ja) 2007-09-11 2009-04-02 Kyocera Chemical Corp 発光ダイオード用ダイボンディングペースト
JP2016079354A (ja) 2014-10-22 2016-05-16 ナミックス株式会社 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置
JP2016147945A (ja) 2015-02-11 2016-08-18 ナミックス株式会社 樹脂組成物、絶縁フィルム、および半導体装置
JP2016166347A (ja) 2015-03-05 2016-09-15 パナソニックＩｐマネジメント株式会社 樹脂組成物、低誘電率樹脂シート、プリプレグ、金属箔張り積層板、高周波回路基板および多層配線基板

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JP2533781B2 (ja) * 1987-10-30 1996-09-11 油化シエルエポキシ株式会社 常温液状の非結晶性イミダゾ―ル誘導体組成物
WO2010103809A1 (ja) * 2009-03-11 2010-09-16 日本曹達株式会社 エポキシ樹脂組成物、硬化剤及び硬化促進剤
JP5463110B2 (ja) 2009-09-24 2014-04-09 ナミックス株式会社 カバーレイフィルム
JP6022893B2 (ja) * 2012-10-24 2016-11-09 ナミックス株式会社 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法
KR102138174B1 (ko) * 2013-03-22 2020-07-27 나믹스 가부시끼가이샤 수지 조성물, 그리고, 그것에 의한 접착 필름, 커버레이 필름, 층간 접착제
CN103342895B (zh) * 2013-07-29 2015-11-18 苏州生益科技有限公司 一种热固性树脂组合物及使用其制作的半固化片及层压板
CN105585808B (zh) * 2016-01-26 2018-02-27 广东汕头超声电子股份有限公司覆铜板厂 一种低介质损耗高导热树脂组合物及其制备方法及用其制作的半固化片、层压板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009070916A (ja) 2007-09-11 2009-04-02 Kyocera Chemical Corp 発光ダイオード用ダイボンディングペースト
JP2016079354A (ja) 2014-10-22 2016-05-16 ナミックス株式会社 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置
JP2016147945A (ja) 2015-02-11 2016-08-18 ナミックス株式会社 樹脂組成物、絶縁フィルム、および半導体装置
JP2016166347A (ja) 2015-03-05 2016-09-15 パナソニックＩｐマネジメント株式会社 樹脂組成物、低誘電率樹脂シート、プリプレグ、金属箔張り積層板、高周波回路基板および多層配線基板

Also Published As

Publication number Publication date
TW201823350A (zh) 2018-07-01
CN109923176A (zh) 2019-06-21
JP6917636B2 (ja) 2021-08-11
CN109923176B (zh) 2021-04-27
KR20190080887A (ko) 2019-07-08
WO2018097010A1 (ja) 2018-05-31
JPWO2018097010A1 (ja) 2019-10-17
TWI743251B (zh) 2021-10-21

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