KR102385215B1 - Sn 도금재 및 그의 제조 방법 - Google Patents

Sn 도금재 및 그의 제조 방법 Download PDF

Info

Publication number
KR102385215B1
KR102385215B1 KR1020197019265A KR20197019265A KR102385215B1 KR 102385215 B1 KR102385215 B1 KR 102385215B1 KR 1020197019265 A KR1020197019265 A KR 1020197019265A KR 20197019265 A KR20197019265 A KR 20197019265A KR 102385215 B1 KR102385215 B1 KR 102385215B1
Authority
KR
South Korea
Prior art keywords
layer
plating
plating layer
alloy
thickness
Prior art date
Application number
KR1020197019265A
Other languages
English (en)
Korean (ko)
Other versions
KR20190087623A (ko
Inventor
히로토 나리에다
유타 소노다
다츠히로 도이
다카오 도미야
Original Assignee
도와 메탈테크 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016236780A external-priority patent/JP6734185B2/ja
Priority claimed from JP2017221415A external-priority patent/JP6940380B2/ja
Application filed by 도와 메탈테크 가부시키가이샤 filed Critical 도와 메탈테크 가부시키가이샤
Publication of KR20190087623A publication Critical patent/KR20190087623A/ko
Application granted granted Critical
Publication of KR102385215B1 publication Critical patent/KR102385215B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/22—Electroplating: Baths therefor from solutions of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020197019265A 2016-12-06 2017-11-21 Sn 도금재 및 그의 제조 방법 KR102385215B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2016236780A JP6734185B2 (ja) 2016-12-06 2016-12-06 Ｓｎめっき材およびその製造方法
JPJP-P-2016-236780 2016-12-06
JPJP-P-2017-056366 2017-03-22
JP2017056366 2017-03-22
JP2017221415A JP6940380B2 (ja) 2017-03-22 2017-11-17 Ｓｎめっき材およびその製造方法
JPJP-P-2017-221415 2017-11-17
PCT/JP2017/041827 WO2018105388A1 (ja) 2016-12-06 2017-11-21 Ｓｎめっき材およびその製造方法

Publications (2)

Publication Number Publication Date
KR20190087623A KR20190087623A (ko) 2019-07-24
KR102385215B1 true KR102385215B1 (ko) 2022-04-08

Family

ID=62492221

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197019265A KR102385215B1 (ko) 2016-12-06 2017-11-21 Sn 도금재 및 그의 제조 방법

Country Status (3)

Country Link
KR (1) KR102385215B1 (zh)
TW (1) TWI719270B (zh)
WO (1) WO2018105388A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109149199B (zh) * 2018-08-10 2020-10-16 北京小米移动软件有限公司 Type-C USB插头的生产方法及Type-C USB插头
CN109149317B (zh) * 2018-08-10 2020-10-16 北京小米移动软件有限公司 Micro USB插头的生产方法及Micro USB插头
DE112020002118T5 (de) * 2019-04-26 2022-01-27 Sumitomo Electric Industries, Ltd. Aluminiumbasisdraht, Litzendraht, und Verfahren zur Herstellung von Aluminiumbasisdraht

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016031654A1 (ja) * 2014-08-25 2016-03-03 株式会社神戸製鋼所 耐微摺動摩耗性に優れる接続部品用導電材料

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5385683B2 (ja) * 2009-05-22 2014-01-08 矢崎総業株式会社 コネクタ端子
JP5882723B2 (ja) 2011-12-26 2016-03-09 矢崎総業株式会社 端子
TWI485930B (zh) * 2012-10-04 2015-05-21 Jx Nippon Mining & Metals Corp Metal material for electronic parts and manufacturing method thereof
JP2015053251A (ja) * 2013-02-24 2015-03-19 古河電気工業株式会社 端子の製造方法、端子、電線の終端接続構造体の製造方法、および電線の終端接続構造体
JP6221695B2 (ja) * 2013-03-25 2017-11-01 三菱マテリアル株式会社 挿抜性に優れた錫めっき銅合金端子材
JP2015110829A (ja) * 2013-10-30 2015-06-18 三菱マテリアル株式会社 錫めっき銅合金端子材
JP5897083B1 (ja) * 2014-08-25 2016-03-30 株式会社神戸製鋼所 耐微摺動摩耗性に優れる接続部品用導電材料

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016031654A1 (ja) * 2014-08-25 2016-03-03 株式会社神戸製鋼所 耐微摺動摩耗性に優れる接続部品用導電材料

Also Published As

Publication number Publication date
TWI719270B (zh) 2021-02-21
WO2018105388A1 (ja) 2018-06-14
TW201825284A (zh) 2018-07-16
KR20190087623A (ko) 2019-07-24

Similar Documents

Publication Publication Date Title
JP6734185B2 (ja) Ｓｎめっき材およびその製造方法
CN110036142B (zh) Sn镀覆材料及其制造方法
CN108352639B (zh) 镀锡铜端子材及端子以及电线末端部结构
JP4024244B2 (ja) 接続部品用導電材料及びその製造方法
JP5025387B2 (ja) 接続部品用導電材料及びその製造方法
JP6940380B2 (ja) Ｓｎめっき材およびその製造方法
CN109072471B (zh) 镀锡铜端子材及端子以及电线末端部结构
TWI465333B (zh) Electronic material for electronic parts and method for manufacturing the same, use of its connector terminals, connectors and electronic parts
WO2010119489A1 (ja) 導電部材及びその製造方法
KR102385215B1 (ko) Sn 도금재 및 그의 제조 방법
JP4368931B2 (ja) オス端子及びその製造方法
CN110214203B (zh) 连接器用端子材及端子以及电线末端部结构
JP7187162B2 (ja) Ｓｎめっき材およびその製造方法
CN111315922B (zh) 防腐蚀端子材及防腐蚀端子以及电线末端部结构
JP5185759B2 (ja) 導電材及びその製造方法
JP6086531B2 (ja) 銀めっき材
JP2014164938A (ja) 圧着端子及び圧着端子の製造方法
JP6839952B2 (ja) Ｓｎめっき材およびその製造方法
JP6978287B2 (ja) めっき材
JP2018147778A (ja) 防食端子材及び防食端子並びに電線端末部構造
JP7404053B2 (ja) Ｓｎめっき材およびその製造方法
JP2020056090A (ja) 防食端子材とその製造方法、及び防食端子並びに電線端末部構造
WO2022168740A1 (ja) アルミニウム心線用防食端子材及び防食端子並びに電線端末部構造
JP7380448B2 (ja) アルミニウム心線用防食端子材とその製造方法、及び防食端子並びに電線端末部構造
US11901659B2 (en) Terminal material for connectors

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant