KR102376017B1 - 보호막 형성용 시트 및 보호막이 형성된 반도체 칩의 제조 방법 - Google Patents

보호막 형성용 시트 및 보호막이 형성된 반도체 칩의 제조 방법 Download PDF

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Publication number
KR102376017B1
KR102376017B1 KR1020177004494A KR20177004494A KR102376017B1 KR 102376017 B1 KR102376017 B1 KR 102376017B1 KR 1020177004494 A KR1020177004494 A KR 1020177004494A KR 20177004494 A KR20177004494 A KR 20177004494A KR 102376017 B1 KR102376017 B1 KR 102376017B1
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South Korea
Prior art keywords
protective film
sheet
forming
film
laminate
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KR1020177004494A
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English (en)
Korean (ko)
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KR20170044108A (ko
Inventor
다이스케 야마모토
나오야 사이키
히로유키 요네야마
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린텍 가부시키가이샤
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Publication of KR20170044108A publication Critical patent/KR20170044108A/ko
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Publication of KR102376017B1 publication Critical patent/KR102376017B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Dicing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Formation Of Insulating Films (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020177004494A 2014-08-22 2015-08-21 보호막 형성용 시트 및 보호막이 형성된 반도체 칩의 제조 방법 KR102376017B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2014169266 2014-08-22
JP2014169267 2014-08-22
JPJP-P-2014-169267 2014-08-22
JPJP-P-2014-169266 2014-08-22
PCT/JP2015/073503 WO2016027883A1 (fr) 2014-08-22 2015-08-21 Feuille pour formation de membrane protectrice, et procédé de fabrication de puce semi-conductrice avec membrane protectrice

Publications (2)

Publication Number Publication Date
KR20170044108A KR20170044108A (ko) 2017-04-24
KR102376017B1 true KR102376017B1 (ko) 2022-03-17

Family

ID=55350823

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177004497A KR102368140B1 (ko) 2014-08-22 2015-08-21 보호막 형성용 시트 및 보호막이 형성된 반도체 칩의 제조 방법
KR1020177004494A KR102376017B1 (ko) 2014-08-22 2015-08-21 보호막 형성용 시트 및 보호막이 형성된 반도체 칩의 제조 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020177004497A KR102368140B1 (ko) 2014-08-22 2015-08-21 보호막 형성용 시트 및 보호막이 형성된 반도체 칩의 제조 방법

Country Status (8)

Country Link
JP (2) JPWO2016027888A1 (fr)
KR (2) KR102368140B1 (fr)
CN (2) CN106660333B (fr)
MY (2) MY186759A (fr)
PH (2) PH12017500284A1 (fr)
SG (2) SG11201701270QA (fr)
TW (4) TWI712670B (fr)
WO (2) WO2016027888A1 (fr)

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WO2017149890A1 (fr) * 2016-03-04 2017-09-08 リンテック株式会社 Feuille composite pour formation de membrane protectrice
WO2017149926A1 (fr) * 2016-03-04 2017-09-08 リンテック株式会社 Feuille de traitement de semi-conducteur
KR20180122316A (ko) * 2016-03-04 2018-11-12 린텍 가부시키가이샤 반도체 가공용 시트
JP6573841B2 (ja) * 2016-03-04 2019-09-11 リンテック株式会社 半導体加工用シート
KR102516392B1 (ko) * 2016-03-04 2023-03-30 린텍 가부시키가이샤 보호막 형성용 복합 시트
JP6617056B2 (ja) * 2016-03-04 2019-12-04 リンテック株式会社 半導体加工用シート、その巻取体および当該巻取体の製造方法
TWI721158B (zh) * 2016-04-28 2021-03-11 日商琳得科股份有限公司 保護膜形成用膜及保護膜形成用複合片
TWI778960B (zh) * 2016-04-28 2022-10-01 日商琳得科股份有限公司 保護膜形成用膜、保護膜形成用複合片、以及附有保護膜的半導體晶片之製造方法
TWI796297B (zh) * 2016-04-28 2023-03-21 日商琳得科股份有限公司 保護膜形成用複合片
KR102407322B1 (ko) * 2016-04-28 2022-06-10 린텍 가부시키가이샤 보호막 형성용 필름 및 보호막 형성용 복합 시트
TWI731964B (zh) * 2016-04-28 2021-07-01 日商琳得科股份有限公司 保護膜形成用複合片
WO2017195711A1 (fr) * 2016-05-12 2017-11-16 住友ベークライト株式会社 Ruban adhésif permettant de traiter des substrats semi-conducteurs
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JP6438181B1 (ja) * 2017-05-17 2018-12-12 リンテック株式会社 半導体装置及びその製造方法
CN111051455B (zh) * 2017-08-28 2022-05-03 琳得科株式会社 膜状透明粘合剂及红外线传感器模块
WO2019146607A1 (fr) * 2018-01-24 2019-08-01 リンテック株式会社 Longue feuille stratifiée et son corps d'enroulement
KR102487552B1 (ko) 2018-02-05 2023-01-11 삼성전자주식회사 보호막 조성물 및 이를 이용한 반도체 패키지 제조 방법
JP7282076B2 (ja) * 2018-03-23 2023-05-26 リンテック株式会社 フィルム状接着剤及び半導体加工用シート
WO2019187010A1 (fr) * 2018-03-30 2019-10-03 リンテック株式会社 Feuille composite de formation de film de protection et son procédé de production
WO2019187014A1 (fr) * 2018-03-30 2019-10-03 リンテック株式会社 Feuille de support et feuille composite pour formation de film de protection
WO2020218519A1 (fr) * 2019-04-26 2020-10-29 リンテック株式会社 Procédé de production d'un corps à trois couches, procédé de production d'un corps à quatre couches, procédé de production d'un dispositif à semi-conducteurs équipé d'un film de protection de surface arrière, et corps à trois couches
JP7453879B2 (ja) 2020-08-12 2024-03-21 リンテック株式会社 保護膜形成用シートロールおよび保護膜形成用シートロールの製造方法
JP7484557B2 (ja) 2020-08-18 2024-05-16 三菱ケミカル株式会社 粘接着剤組成物、粘接着シート及び積層体
JP7084972B2 (ja) * 2020-10-06 2022-06-15 リンテック株式会社 保護膜形成用複合シート

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JP2013120841A (ja) * 2011-12-07 2013-06-17 Lintec Corp 保護膜形成層付ダイシングシートおよびチップの製造方法

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JP2013120841A (ja) * 2011-12-07 2013-06-17 Lintec Corp 保護膜形成層付ダイシングシートおよびチップの製造方法

Also Published As

Publication number Publication date
JPWO2016027888A1 (ja) 2017-06-01
TW201614024A (en) 2016-04-16
KR20170044108A (ko) 2017-04-24
TW201940622A (zh) 2019-10-16
PH12017500285A1 (en) 2017-06-28
TW201938728A (zh) 2019-10-01
SG11201701270QA (en) 2017-03-30
MY186759A (en) 2021-08-18
KR20170044652A (ko) 2017-04-25
TWI706023B (zh) 2020-10-01
WO2016027883A1 (fr) 2016-02-25
PH12017500284B1 (en) 2017-07-03
PH12017500285B1 (en) 2017-06-28
CN106660333B (zh) 2018-11-06
CN106660332B (zh) 2020-08-07
MY182846A (en) 2021-02-05
TW201614023A (en) 2016-04-16
CN106660333A (zh) 2017-05-10
WO2016027888A1 (fr) 2016-02-25
TWI668290B (zh) 2019-08-11
TWI712670B (zh) 2020-12-11
JPWO2016027883A1 (ja) 2017-06-01
TWI672354B (zh) 2019-09-21
KR102368140B1 (ko) 2022-02-25
PH12017500284A1 (en) 2017-07-03
JP6589209B2 (ja) 2019-10-16
CN106660332A (zh) 2017-05-10
SG11201701272UA (en) 2017-04-27

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