KR102368739B1 - 내열성 점착 시트 및 기능성 필름의 제조 방법 - Google Patents

내열성 점착 시트 및 기능성 필름의 제조 방법 Download PDF

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KR102368739B1
KR102368739B1 KR1020150163468A KR20150163468A KR102368739B1 KR 102368739 B1 KR102368739 B1 KR 102368739B1 KR 1020150163468 A KR1020150163468 A KR 1020150163468A KR 20150163468 A KR20150163468 A KR 20150163468A KR 102368739 B1 KR102368739 B1 KR 102368739B1
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film
heat
adhesive sheet
layer
mass
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KR20160060595A (ko
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료 다카하시
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린텍 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemical Kinetics & Catalysis (AREA)
KR1020150163468A 2014-11-20 2015-11-20 내열성 점착 시트 및 기능성 필름의 제조 방법 Active KR102368739B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-235770 2014-11-20
JP2014235770A JP6424070B2 (ja) 2014-11-20 2014-11-20 耐熱性粘着シート及び機能性フィルムの製造方法

Publications (2)

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KR20160060595A KR20160060595A (ko) 2016-05-30
KR102368739B1 true KR102368739B1 (ko) 2022-02-28

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KR1020150163468A Active KR102368739B1 (ko) 2014-11-20 2015-11-20 내열성 점착 시트 및 기능성 필름의 제조 방법

Country Status (4)

Country Link
JP (1) JP6424070B2 (enrdf_load_stackoverflow)
KR (1) KR102368739B1 (enrdf_load_stackoverflow)
CN (1) CN105619979B (enrdf_load_stackoverflow)
TW (1) TWI671381B (enrdf_load_stackoverflow)

Families Citing this family (12)

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Publication number Priority date Publication date Assignee Title
KR101993352B1 (ko) * 2015-12-09 2019-06-26 주식회사 엘지화학 광흡수 필름 및 이를 포함하는 편광판
KR102432417B1 (ko) * 2016-06-10 2022-08-12 닛토덴코 가부시키가이샤 투명 도전성 필름 및 터치 패널
KR101852837B1 (ko) * 2016-07-21 2018-04-27 주식회사 오킨스전자 반도체 패키지 검사용 캐리어 제조 방법
JP7111301B2 (ja) * 2018-03-27 2022-08-02 リンテック株式会社 剥離シート
JP7100541B2 (ja) * 2018-08-29 2022-07-13 日本カーバイド工業株式会社 積層体の製造方法及び積層体
WO2020137956A1 (ja) * 2018-12-27 2020-07-02 日東電工株式会社 保護シート
JPWO2020196222A1 (enrdf_load_stackoverflow) * 2019-03-26 2020-10-01
CN110885663A (zh) * 2019-11-26 2020-03-17 塔威新材料科技(上海)有限公司 一种uv湿气双重固化反应型聚氨酯热熔胶组合物
KR102562078B1 (ko) * 2020-01-10 2023-09-01 이솔화학 주식회사 투명 필름 적층체의 제조방법
TW202141600A (zh) * 2020-03-27 2021-11-01 日商琳得科股份有限公司 半導體裝置製造用片
CN113999639A (zh) * 2021-11-17 2022-02-01 九江福莱克斯有限公司 一种高透明耐温耐黄变聚酯胶粘剂及制作的挠性覆盖膜
CN116410502B (zh) * 2021-12-31 2024-12-03 山东东岳高分子材料有限公司 一种低剥离强度氟素离型膜及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251529A (ja) 2007-03-02 2008-10-16 Nitto Denko Corp 粘着剤層付き透明導電性フィルムおよびその製造方法
JP2014193527A (ja) 2013-03-28 2014-10-09 Lintec Corp 粘着シート

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Publication number Priority date Publication date Assignee Title
JPS548121Y2 (enrdf_load_stackoverflow) * 1974-08-28 1979-04-14
JP4151821B2 (ja) 2002-01-11 2008-09-17 日東電工株式会社 透明導電性フィルム用表面保護フィルム及び透明導電性フィルム
JP5612388B2 (ja) * 2010-07-30 2014-10-22 日東電工株式会社 透明導電性フィルム用粘着剤層、粘着剤層付き透明導電性フィルム、透明導電性積層体、およびタッチパネル
JP5825949B2 (ja) * 2011-09-14 2015-12-02 リンテック株式会社 離型フィルム及びその製造方法
JP5877122B2 (ja) * 2012-05-21 2016-03-02 藤森工業株式会社 表面処理フィルム、表面保護フィルム及びそれが貼り合わされた精密電気・電子部品
JP6346413B2 (ja) * 2013-06-10 2018-06-20 日東電工株式会社 セパレータ付き粘着剤層、その製造方法およびセパレータ付きの粘着剤層付き光学フィルム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251529A (ja) 2007-03-02 2008-10-16 Nitto Denko Corp 粘着剤層付き透明導電性フィルムおよびその製造方法
JP2014193527A (ja) 2013-03-28 2014-10-09 Lintec Corp 粘着シート

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TWI671381B (zh) 2019-09-11
CN105619979B (zh) 2019-11-12
JP2016098297A (ja) 2016-05-30
JP6424070B2 (ja) 2018-11-14
TW201627443A (zh) 2016-08-01
CN105619979A (zh) 2016-06-01
KR20160060595A (ko) 2016-05-30

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