KR102349064B1 - 반송 장치 및 기판 처리 장치 - Google Patents
반송 장치 및 기판 처리 장치 Download PDFInfo
- Publication number
- KR102349064B1 KR102349064B1 KR1020180097906A KR20180097906A KR102349064B1 KR 102349064 B1 KR102349064 B1 KR 102349064B1 KR 1020180097906 A KR1020180097906 A KR 1020180097906A KR 20180097906 A KR20180097906 A KR 20180097906A KR 102349064 B1 KR102349064 B1 KR 102349064B1
- Authority
- KR
- South Korea
- Prior art keywords
- temperature sensor
- wafer
- tip
- measurement position
- temperature
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Robotics (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2017-165154 | 2017-08-30 | ||
JP2017165154A JP6632583B2 (ja) | 2017-08-30 | 2017-08-30 | 搬送装置及び基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190024718A KR20190024718A (ko) | 2019-03-08 |
KR102349064B1 true KR102349064B1 (ko) | 2022-01-07 |
Family
ID=65514775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020180097906A KR102349064B1 (ko) | 2017-08-30 | 2018-08-22 | 반송 장치 및 기판 처리 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6632583B2 (zh) |
KR (1) | KR102349064B1 (zh) |
CN (1) | CN109427639B (zh) |
TW (1) | TWI723279B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7246256B2 (ja) | 2019-05-29 | 2023-03-27 | 東京エレクトロン株式会社 | 搬送方法及び搬送システム |
JP7399035B2 (ja) | 2020-06-23 | 2023-12-15 | 東京エレクトロン株式会社 | ティーチング方法、搬送システム及びプログラム |
JP2022184175A (ja) | 2021-05-31 | 2022-12-13 | 東京エレクトロン株式会社 | 情報処理装置、移載位置教示方法及び基板処理装置 |
JP2022186429A (ja) | 2021-06-04 | 2022-12-15 | 東京エレクトロン株式会社 | 情報処理装置、移載位置補正方法及び基板処理装置 |
JP2023027797A (ja) | 2021-08-18 | 2023-03-03 | 東京エレクトロン株式会社 | 基板処理装置及び撮像方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006080410A (ja) * | 2004-09-13 | 2006-03-23 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法 |
JP2015031671A (ja) * | 2013-08-07 | 2015-02-16 | 中国電力株式会社 | 熱電対保護管用ガイドパイプおよび熱電対保護管の損傷抑制方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4217463A (en) * | 1978-03-13 | 1980-08-12 | National Distillers And Chemical Corporation | Fast responsive, high pressure thermocouple |
JPH04286143A (ja) * | 1991-03-14 | 1992-10-12 | Hitachi Ltd | ウエハ処理装置 |
JPH05304196A (ja) * | 1992-04-27 | 1993-11-16 | Mitsubishi Electric Corp | ウエハ搬送装置 |
JPH07142549A (ja) * | 1993-11-22 | 1995-06-02 | Hitachi Ltd | 半導体製造装置 |
JPH0997787A (ja) * | 1995-09-30 | 1997-04-08 | Tokyo Electron Ltd | 処理装置 |
US9354121B2 (en) * | 2011-10-13 | 2016-05-31 | Micromold Products, Inc. | Corrosion resistant thermowells with thin wall tips |
JP6339040B2 (ja) | 2015-03-20 | 2018-06-06 | 東京エレクトロン株式会社 | 保護カバー及びこれを用いた基板処理装置 |
-
2017
- 2017-08-30 JP JP2017165154A patent/JP6632583B2/ja active Active
-
2018
- 2018-08-22 KR KR1020180097906A patent/KR102349064B1/ko active IP Right Grant
- 2018-08-28 TW TW107129858A patent/TWI723279B/zh active
- 2018-08-30 CN CN201811004547.3A patent/CN109427639B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006080410A (ja) * | 2004-09-13 | 2006-03-23 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法 |
JP2015031671A (ja) * | 2013-08-07 | 2015-02-16 | 中国電力株式会社 | 熱電対保護管用ガイドパイプおよび熱電対保護管の損傷抑制方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201921569A (zh) | 2019-06-01 |
CN109427639A (zh) | 2019-03-05 |
CN109427639B (zh) | 2023-07-21 |
JP2019046843A (ja) | 2019-03-22 |
TWI723279B (zh) | 2021-04-01 |
KR20190024718A (ko) | 2019-03-08 |
JP6632583B2 (ja) | 2020-01-22 |
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