JP6632583B2 - 搬送装置及び基板処理装置 - Google Patents
搬送装置及び基板処理装置 Download PDFInfo
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- JP6632583B2 JP6632583B2 JP2017165154A JP2017165154A JP6632583B2 JP 6632583 B2 JP6632583 B2 JP 6632583B2 JP 2017165154 A JP2017165154 A JP 2017165154A JP 2017165154 A JP2017165154 A JP 2017165154A JP 6632583 B2 JP6632583 B2 JP 6632583B2
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- Prior art keywords
- temperature sensor
- transfer machine
- wafer
- transfer
- temperature
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- 238000012546 transfer Methods 0.000 title claims description 90
- 239000000758 substrate Substances 0.000 title claims description 29
- 238000012545 processing Methods 0.000 title claims description 28
- 238000005259 measurement Methods 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 24
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 107
- 230000007246 mechanism Effects 0.000 description 17
- 238000001514 detection method Methods 0.000 description 10
- 230000032258 transport Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000004043 responsiveness Effects 0.000 description 8
- 230000003028 elevating effect Effects 0.000 description 5
- 239000004696 Poly ether ether ketone Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920002530 polyetherether ketone Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Robotics (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
50 ウエハボート
60 ウエハ搬送装置
63 フォーク
66 位置検出センサ
67 温度センサ
67a 先端
67b 配線
68 ガイド
68a 開口
80 熱処理炉
100 制御部
P1 待機位置
P2 測定位置
W ウエハ
Claims (10)
- 被搬送物の温度を測定する測定位置と、前記測定位置から隔離された待機位置との間で移動する移載機と、
先端が前記移載機の先端側に向けて前記移載機から突出するように前記移載機に取り付けられ、前記測定位置において前記被搬送物の温度を測定する温度センサと、
前記移載機の先端側に開口を有し、前記温度センサの前記先端を保護するガイドと、
前記移載機の内部に設けられ、前記温度センサの出力を外部に取り出すための配線と、
を有し、
前記配線は、前記移載機の取付部から外部に取り出され、
前記測定位置は、前記温度センサが前記移載機の挿入方向における前記被搬送物の略中央となる位置である、
搬送装置。 - 前記ガイドは、前記移載機から突出して設けられ、平面視で略U字状又は略コ字状に形成されている、
請求項1に記載の搬送装置。 - 前記ガイドは、略U字状又は略コ字状の開口の側が前記移載機の先端側に位置する、
請求項2に記載の搬送装置。 - 前記ガイドの略U字状又は略コ字状の両側部の長さは、前記移載機から突出する前記温度センサの前記先端の長さ以上である、
請求項2又は3に記載の搬送装置。 - 前記温度センサは、前記被搬送物の温度を非接触で測定する、
請求項1乃至4のいずれか一項に記載の搬送装置。 - 前記温度センサは、前記移載機の先端に取り付けられている、
請求項1乃至5のいずれか一項に記載の搬送装置。 - 前記温度センサは、前記移載機の挿入方向における略中央に取り付けられている、
請求項1乃至5のいずれか一項に記載の搬送装置。 - 前記移載機には、前記温度センサの出力を取り出す配線が設けられている、
請求項1乃至7のいずれか一項に記載の搬送装置。 - 前記温度センサは、熱電対又は測温抵抗体である、
請求項1乃至8のいずれか一項に記載の搬送装置。 - 熱処理炉と、
複数の基板を保持した状態で熱処理炉に収容可能な基板保持具と、
前記複数の基板の温度を測定する測定位置と、前記測定位置から隔離された待機位置との間で移動する移載機と、
先端が前記移載機の先端側に向けて前記移載機から突出するように前記移載機に取り付けられ、前記測定位置において前記複数の基板の温度を測定する温度センサと、
前記移載機の先端側に開口を有し、前記温度センサの前記先端を保護するガイドと、
前記移載機の内部に設けられ、前記温度センサの出力を外部に取り出すための配線と、
を有し、
前記配線は、前記移載機の取付部から外部に取り出され、
前記測定位置は、前記温度センサが前記移載機の挿入方向における前記基板の略中央となる位置である、
基板処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017165154A JP6632583B2 (ja) | 2017-08-30 | 2017-08-30 | 搬送装置及び基板処理装置 |
KR1020180097906A KR102349064B1 (ko) | 2017-08-30 | 2018-08-22 | 반송 장치 및 기판 처리 장치 |
TW107129858A TWI723279B (zh) | 2017-08-30 | 2018-08-28 | 搬送裝置及基板處理裝置 |
CN201811004547.3A CN109427639B (zh) | 2017-08-30 | 2018-08-30 | 输送装置和基板处理装置 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2017165154A JP6632583B2 (ja) | 2017-08-30 | 2017-08-30 | 搬送装置及び基板処理装置 |
Publications (2)
Publication Number | Publication Date |
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JP2019046843A JP2019046843A (ja) | 2019-03-22 |
JP6632583B2 true JP6632583B2 (ja) | 2020-01-22 |
Family
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JP2017165154A Active JP6632583B2 (ja) | 2017-08-30 | 2017-08-30 | 搬送装置及び基板処理装置 |
Country Status (4)
Country | Link |
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JP (1) | JP6632583B2 (ja) |
KR (1) | KR102349064B1 (ja) |
CN (1) | CN109427639B (ja) |
TW (1) | TWI723279B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7246256B2 (ja) | 2019-05-29 | 2023-03-27 | 東京エレクトロン株式会社 | 搬送方法及び搬送システム |
JP7399035B2 (ja) | 2020-06-23 | 2023-12-15 | 東京エレクトロン株式会社 | ティーチング方法、搬送システム及びプログラム |
JP2022184175A (ja) | 2021-05-31 | 2022-12-13 | 東京エレクトロン株式会社 | 情報処理装置、移載位置教示方法及び基板処理装置 |
JP2022186429A (ja) | 2021-06-04 | 2022-12-15 | 東京エレクトロン株式会社 | 情報処理装置、移載位置補正方法及び基板処理装置 |
JP2023027797A (ja) | 2021-08-18 | 2023-03-03 | 東京エレクトロン株式会社 | 基板処理装置及び撮像方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4217463A (en) * | 1978-03-13 | 1980-08-12 | National Distillers And Chemical Corporation | Fast responsive, high pressure thermocouple |
JPH04286143A (ja) * | 1991-03-14 | 1992-10-12 | Hitachi Ltd | ウエハ処理装置 |
JPH05304196A (ja) * | 1992-04-27 | 1993-11-16 | Mitsubishi Electric Corp | ウエハ搬送装置 |
JPH07142549A (ja) * | 1993-11-22 | 1995-06-02 | Hitachi Ltd | 半導体製造装置 |
JPH0997787A (ja) * | 1995-09-30 | 1997-04-08 | Tokyo Electron Ltd | 処理装置 |
JP2006080410A (ja) * | 2004-09-13 | 2006-03-23 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法 |
US9354121B2 (en) * | 2011-10-13 | 2016-05-31 | Micromold Products, Inc. | Corrosion resistant thermowells with thin wall tips |
JP2015031671A (ja) * | 2013-08-07 | 2015-02-16 | 中国電力株式会社 | 熱電対保護管用ガイドパイプおよび熱電対保護管の損傷抑制方法 |
JP6339040B2 (ja) | 2015-03-20 | 2018-06-06 | 東京エレクトロン株式会社 | 保護カバー及びこれを用いた基板処理装置 |
-
2017
- 2017-08-30 JP JP2017165154A patent/JP6632583B2/ja active Active
-
2018
- 2018-08-22 KR KR1020180097906A patent/KR102349064B1/ko active IP Right Grant
- 2018-08-28 TW TW107129858A patent/TWI723279B/zh active
- 2018-08-30 CN CN201811004547.3A patent/CN109427639B/zh active Active
Also Published As
Publication number | Publication date |
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CN109427639A (zh) | 2019-03-05 |
JP2019046843A (ja) | 2019-03-22 |
KR20190024718A (ko) | 2019-03-08 |
CN109427639B (zh) | 2023-07-21 |
KR102349064B1 (ko) | 2022-01-07 |
TWI723279B (zh) | 2021-04-01 |
TW201921569A (zh) | 2019-06-01 |
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