KR102327960B1 - 패턴 형성 장치, 패턴 형성 방법 및 토출 데이터 생성 방법 - Google Patents

패턴 형성 장치, 패턴 형성 방법 및 토출 데이터 생성 방법 Download PDF

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Publication number
KR102327960B1
KR102327960B1 KR1020190158266A KR20190158266A KR102327960B1 KR 102327960 B1 KR102327960 B1 KR 102327960B1 KR 1020190158266 A KR1020190158266 A KR 1020190158266A KR 20190158266 A KR20190158266 A KR 20190158266A KR 102327960 B1 KR102327960 B1 KR 102327960B1
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KR
South Korea
Prior art keywords
pattern
wiring board
ink
conductive pattern
per unit
Prior art date
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KR1020190158266A
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English (en)
Korean (ko)
Other versions
KR20200089597A (ko
Inventor
마사하루 나카가와
게이고 시미즈
Original Assignee
가부시키가이샤 스크린 홀딩스
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Publication of KR20200089597A publication Critical patent/KR20200089597A/ko
Application granted granted Critical
Publication of KR102327960B1 publication Critical patent/KR102327960B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Ink Jet (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020190158266A 2019-01-17 2019-12-02 패턴 형성 장치, 패턴 형성 방법 및 토출 데이터 생성 방법 KR102327960B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-006304 2019-01-17
JP2019006304A JP7281907B2 (ja) 2019-01-17 2019-01-17 パターン形成装置、パターン形成方法および吐出データ生成方法

Publications (2)

Publication Number Publication Date
KR20200089597A KR20200089597A (ko) 2020-07-27
KR102327960B1 true KR102327960B1 (ko) 2021-11-17

Family

ID=71653911

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190158266A KR102327960B1 (ko) 2019-01-17 2019-12-02 패턴 형성 장치, 패턴 형성 방법 및 토출 데이터 생성 방법

Country Status (4)

Country Link
JP (1) JP7281907B2 (zh)
KR (1) KR102327960B1 (zh)
CN (1) CN111446184A (zh)
TW (1) TWI723612B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022013150A (ja) 2020-07-03 2022-01-18 オムロン株式会社 Ｘ線検査装置
CN112533393B (zh) * 2020-12-04 2022-04-19 广州兴森快捷电路科技有限公司 Pcb阻焊方法、pcb阻焊系统及存储介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008004820A (ja) 2006-06-23 2008-01-10 Taiyo Ink Mfg Ltd プリント配線板及びその製造方法
WO2009098871A1 (ja) 2008-02-06 2009-08-13 Panasonic Corporation 情報記録媒体の製造方法
JP2012081381A (ja) * 2010-10-07 2012-04-26 Sharp Corp 液体描画方法、液体描画装置および太陽電池用機能性マスク

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08288623A (ja) * 1995-04-10 1996-11-01 Canon Inc プリント配線板の製造方法およびプリント配線板
KR20140024931A (ko) * 2011-07-15 2014-03-03 스미도모쥬기가이고교 가부시키가이샤 박막형성방법 및 박막형성장치
KR101849177B1 (ko) * 2011-11-11 2018-06-01 엘지디스플레이 주식회사 입체 영상 표시장치 및 이의 제조방법
JPWO2017077603A1 (ja) * 2015-11-04 2017-11-02 株式会社メイコー 印刷硬化方法、印刷硬化装置、及びプリント配線基板の製造方法
JPWO2017164032A1 (ja) * 2016-03-23 2019-02-14 富士フイルム株式会社 印刷版および印刷方法ならびに印刷版の製造方法
JPWO2017169624A1 (ja) * 2016-03-31 2019-02-07 太陽インキ製造株式会社 硬化装置およびソルダーレジストの製造方法
US20200045833A1 (en) 2016-04-19 2020-02-06 Kaneka Corporation Printed wiring board and method for manufacturing same
JP2018086637A (ja) 2016-11-30 2018-06-07 東レエンジニアリング株式会社 絶縁膜材料の塗布方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008004820A (ja) 2006-06-23 2008-01-10 Taiyo Ink Mfg Ltd プリント配線板及びその製造方法
WO2009098871A1 (ja) 2008-02-06 2009-08-13 Panasonic Corporation 情報記録媒体の製造方法
JP2012081381A (ja) * 2010-10-07 2012-04-26 Sharp Corp 液体描画方法、液体描画装置および太陽電池用機能性マスク

Also Published As

Publication number Publication date
TWI723612B (zh) 2021-04-01
CN111446184A (zh) 2020-07-24
TW202029855A (zh) 2020-08-01
KR20200089597A (ko) 2020-07-27
JP2020115517A (ja) 2020-07-30
JP7281907B2 (ja) 2023-05-26

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