KR102314674B1 - 다층체 및 그의 제조 방법 - Google Patents

다층체 및 그의 제조 방법 Download PDF

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Publication number
KR102314674B1
KR102314674B1 KR1020167034306A KR20167034306A KR102314674B1 KR 102314674 B1 KR102314674 B1 KR 102314674B1 KR 1020167034306 A KR1020167034306 A KR 1020167034306A KR 20167034306 A KR20167034306 A KR 20167034306A KR 102314674 B1 KR102314674 B1 KR 102314674B1
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South Korea
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ply
delete delete
carrier
decorative
plastic
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English (en)
Korean (ko)
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KR20170026353A (ko
Inventor
클라우스 루드빅
크리스티안 슐츠
라이너 스탈
Original Assignee
레오나르트 쿠르츠 스티프퉁 운트 코. 카게
폴리아이씨 게엠베하 운트 코. 카게
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Publication of KR20170026353A publication Critical patent/KR20170026353A/ko
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811Multilayered articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14688Coating articles provided with a decoration
    • H01L25/0753
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0363Manufacture or treatment of packages of optical field-shaping means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00Layered products
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3493Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces
    • H01L2924/0002
    • H01L2933/0058

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Optical Filters (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Laminated Bodies (AREA)
KR1020167034306A 2014-05-09 2015-05-07 다층체 및 그의 제조 방법 Active KR102314674B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014106585.9 2014-05-09
DE102014106585.9A DE102014106585A1 (de) 2014-05-09 2014-05-09 Mehrschichtkörper und Verfahren zu dessen Herstellung
PCT/EP2015/060029 WO2015169890A2 (de) 2014-05-09 2015-05-07 Mehrschichtkörper und verfahren zu dessen herstellung

Publications (2)

Publication Number Publication Date
KR20170026353A KR20170026353A (ko) 2017-03-08
KR102314674B1 true KR102314674B1 (ko) 2021-10-20

Family

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Application Number Title Priority Date Filing Date
KR1020167034306A Active KR102314674B1 (ko) 2014-05-09 2015-05-07 다층체 및 그의 제조 방법

Country Status (9)

Country Link
US (1) US10335987B2 (https=)
EP (1) EP3140097B1 (https=)
JP (1) JP6687219B2 (https=)
KR (1) KR102314674B1 (https=)
CN (1) CN106660241B (https=)
DE (1) DE102014106585A1 (https=)
ES (1) ES2748425T3 (https=)
PL (1) PL3140097T3 (https=)
WO (1) WO2015169890A2 (https=)

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US11292166B2 (en) * 2017-04-07 2022-04-05 Tactotek Oy Method for manufacturing an electronic assembly and an electronic assembly
ES2693388A1 (es) * 2017-06-09 2018-12-11 Srg Global Liria, S.L Molduras de apariencia metálica traslúcidas a la luz y enmascaradas para iluminación selectiva
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US10619808B2 (en) 2017-10-18 2020-04-14 Good Earth Lighting, Inc. Flat panel ceiling light with quick-change covers
CN107799347B (zh) * 2017-10-30 2019-03-15 武汉理工大学 一种模内注塑薄膜开关
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DE102021104294A1 (de) * 2021-02-23 2022-08-25 Polyic Gmbh & Co. Kg Schichtkörper mit Dekorationsschicht und Verfahren zur Herstellung
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US11175438B1 (en) 2021-05-17 2021-11-16 Tactotek Oy Optoelectronically functional multilayer structure having embedded light-defining segments and related manufacturing method
KR102950780B1 (ko) * 2021-06-23 2026-04-09 삼성디스플레이 주식회사 표시 장치 및 그 제조방법
KR102394587B1 (ko) * 2021-07-19 2022-05-06 인탑스 주식회사 다중 ime 구조 및 그 제조 방법
CN113696410A (zh) * 2021-08-26 2021-11-26 东莞广华汽车饰件科技有限公司 一种具有发光功能的汽车装饰件的制造方法
KR102916012B1 (ko) * 2021-09-27 2026-01-22 삼성전자주식회사 디스플레이 모듈 및 이를 포함하는 웨어러블 전자 장치
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CN114347395B (zh) * 2022-03-17 2022-06-03 威海嘉瑞光电科技股份有限公司 半导体光学器件的封装方法及其使用的装置
JP7833142B2 (ja) * 2022-03-23 2026-03-19 スタンレー電気株式会社 波長変換装置及び照明装置
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Also Published As

Publication number Publication date
EP3140097A2 (de) 2017-03-15
PL3140097T3 (pl) 2020-02-28
CN106660241B (zh) 2019-08-16
US20170066168A1 (en) 2017-03-09
JP2017522583A (ja) 2017-08-10
JP6687219B2 (ja) 2020-04-22
WO2015169890A3 (de) 2016-02-04
DE102014106585A1 (de) 2015-11-12
US10335987B2 (en) 2019-07-02
CN106660241A (zh) 2017-05-10
WO2015169890A2 (de) 2015-11-12
ES2748425T3 (es) 2020-03-16
EP3140097B1 (de) 2019-09-04
KR20170026353A (ko) 2017-03-08

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